GB2189936B - Planar capacitor and hybrid integrated circuit package comprising same - Google Patents

Planar capacitor and hybrid integrated circuit package comprising same

Info

Publication number
GB2189936B
GB2189936B GB8709990A GB8709990A GB2189936B GB 2189936 B GB2189936 B GB 2189936B GB 8709990 A GB8709990 A GB 8709990A GB 8709990 A GB8709990 A GB 8709990A GB 2189936 B GB2189936 B GB 2189936B
Authority
GB
United Kingdom
Prior art keywords
same
integrated circuit
circuit package
hybrid integrated
planar capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB8709990A
Other languages
English (en)
Other versions
GB8709990D0 (en
GB2189936A (en
Inventor
Walter B Meinel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Tucson Corp
Original Assignee
Burr Brown Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Burr Brown Corp filed Critical Burr Brown Corp
Publication of GB8709990D0 publication Critical patent/GB8709990D0/en
Publication of GB2189936A publication Critical patent/GB2189936A/en
Application granted granted Critical
Publication of GB2189936B publication Critical patent/GB2189936B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/45—Differential amplifiers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
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    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H01F17/06—Fixed inductances of the signal type  with magnetic core with core substantially closed in itself, e.g. toroid
    • H01F17/062—Toroidal core with turns of coil around it
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
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  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microwave Amplifiers (AREA)
  • Amplifiers (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
GB8709990A 1986-04-28 1987-04-28 Planar capacitor and hybrid integrated circuit package comprising same Expired - Fee Related GB2189936B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US85672086A 1986-04-28 1986-04-28

Publications (3)

Publication Number Publication Date
GB8709990D0 GB8709990D0 (en) 1987-06-03
GB2189936A GB2189936A (en) 1987-11-04
GB2189936B true GB2189936B (en) 1990-05-16

Family

ID=25324345

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8709990A Expired - Fee Related GB2189936B (en) 1986-04-28 1987-04-28 Planar capacitor and hybrid integrated circuit package comprising same

Country Status (5)

Country Link
JP (1) JPS62257759A (ko)
KR (1) KR870010686A (ko)
DE (1) DE3713833C2 (ko)
FR (1) FR2598032B1 (ko)
GB (1) GB2189936B (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5200881A (en) * 1990-07-27 1993-04-06 Mitsubishi Denki Kabushiki Kaisha Gas insulated switchgear
DE4031289A1 (de) * 1990-10-04 1992-04-09 Telefunken Electronic Gmbh Oszillator
JP3045573B2 (ja) * 1991-08-19 2000-05-29 北川工業株式会社 電子部品、コンデンサおよび３端子ノイズフィルタの製造方法
US5444600A (en) * 1992-12-03 1995-08-22 Linear Technology Corporation Lead frame capacitor and capacitively-coupled isolator circuit using the same
US5428245A (en) * 1994-05-06 1995-06-27 National Semiconductor Corporation Lead frame including an inductor or other such magnetic component
US5491360A (en) * 1994-12-28 1996-02-13 National Semiconductor Corporation Electronic package for isolated circuits
US5642276A (en) * 1995-02-08 1997-06-24 Lucent Technologies Inc. High frequency surface mount transformer-diode power module
US7016490B2 (en) * 2001-05-21 2006-03-21 Conexant Systems, Inc. Circuit board capacitor structure for forming a high voltage isolation barrier
CN108493168A (zh) * 2018-05-28 2018-09-04 北京中科格励微科技有限公司 一种电绝缘的多腔封装结构

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL237700A (ko) * 1958-04-02
US3675095A (en) * 1971-06-10 1972-07-04 Rca Corp Capacitors of constant capacitance
SE381957B (sv) * 1972-08-28 1975-12-22 Western Electric Co Kondensator for anvendning vid remstransmissionsledningar
US3764938A (en) * 1972-08-28 1973-10-09 Bell Telephone Labor Inc Resonance suppression in interdigital capacitors useful as dc bias breaks in diode oscillator circuits
GB1469944A (en) * 1975-04-21 1977-04-06 Decca Ltd Planar capacitor
US4038488A (en) * 1975-05-12 1977-07-26 Cambridge Memories, Inc. Multilayer ceramic multi-chip, dual in-line packaging assembly
DE7635588U1 (de) * 1976-11-11 1978-02-02 Gebrueder Junghans Gmbh, 7230 Schramberg Kondensatoranordnung
US4188651A (en) * 1978-03-27 1980-02-12 Sprague Electric Company Ceramic capacitor with surface electrodes
JPS5637721A (en) * 1979-09-03 1981-04-11 Murata Mfg Co Ltd Surface wave resonator
US4292595A (en) * 1979-11-13 1981-09-29 Burr-Brown Research Corporation Capacitance coupled isolation amplifier and method

Also Published As

Publication number Publication date
DE3713833A1 (de) 1987-11-12
GB8709990D0 (en) 1987-06-03
FR2598032A1 (fr) 1987-10-30
FR2598032B1 (fr) 1991-08-09
DE3713833C2 (de) 1997-03-20
JPS62257759A (ja) 1987-11-10
KR870010686A (ko) 1987-11-30
GB2189936A (en) 1987-11-04

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Effective date: 19950428