GB2117383A - Liquids with reduced spreading tendency - Google Patents
Liquids with reduced spreading tendency Download PDFInfo
- Publication number
- GB2117383A GB2117383A GB08307120A GB8307120A GB2117383A GB 2117383 A GB2117383 A GB 2117383A GB 08307120 A GB08307120 A GB 08307120A GB 8307120 A GB8307120 A GB 8307120A GB 2117383 A GB2117383 A GB 2117383A
- Authority
- GB
- United Kingdom
- Prior art keywords
- liquid
- inhibitor
- combination
- amine
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
- C08K5/095—Carboxylic acids containing halogens
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/63—Additives non-macromolecular organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/32—Materials not provided for elsewhere for absorbing liquids to remove pollution, e.g. oil, gasoline, fat
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/2857—Adhesive compositions including metal or compound thereof or natural rubber
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
- Y10T428/2887—Adhesive compositions including addition polymer from unsaturated monomer including nitrogen containing polymer [e.g., polyacrylonitrile, polymethacrylonitrile, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31692—Next to addition polymer from unsaturated monomers
- Y10T428/31699—Ester, halide or nitrile of addition polymer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31786—Of polyester [e.g., alkyd, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
- Y10T428/31935—Ester, halide or nitrile of addition polymer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Environmental & Geological Engineering (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Public Health (AREA)
- Dispersion Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
- Error Detection And Correction (AREA)
- Synchronisation In Digital Transmission Systems (AREA)
- Detergent Compositions (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/358,859 US4483898A (en) | 1982-03-17 | 1982-03-17 | Liquids with reduced spreading tendency |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB8307120D0 GB8307120D0 (en) | 1983-04-20 |
| GB2117383A true GB2117383A (en) | 1983-10-12 |
Family
ID=23411334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB08307120A Withdrawn GB2117383A (en) | 1982-03-17 | 1983-03-15 | Liquids with reduced spreading tendency |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US4483898A (https=) |
| EP (1) | EP0103617B1 (https=) |
| JP (1) | JPS59500419A (https=) |
| KR (1) | KR910010212B1 (https=) |
| CA (1) | CA1215799A (https=) |
| DE (1) | DE3368022D1 (https=) |
| GB (1) | GB2117383A (https=) |
| IT (1) | IT1163147B (https=) |
| WO (1) | WO1983003210A1 (https=) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5075378A (en) * | 1985-12-23 | 1991-12-24 | The Standard Oil Company | Coating of an epoxy resin, fluorocarbon polymer fluorinated curing agent |
| USRE36788E (en) * | 1990-09-06 | 2000-07-25 | Visa International Service Association | Funds transfer system |
| US5646241A (en) * | 1995-05-12 | 1997-07-08 | Quantum Materials, Inc. | Bleed resistant cyanate ester-containing compositions |
| US5753748A (en) * | 1995-05-12 | 1998-05-19 | Quantum Materials, Inc. | Bleed resistant cyanate ester-containing compositions |
| US5859110A (en) * | 1996-06-10 | 1999-01-12 | Johnson Matthey, Inc. | Method of decreasing bleed from organic-based formulations and anti-bleed compostitions |
| US5783621A (en) * | 1996-06-10 | 1998-07-21 | Johnson Matthey, Inc. | Method of decreasing bleed fom organic-based formulations and anti-bleed compositions |
| US6265243B1 (en) | 1999-03-29 | 2001-07-24 | Lucent Technologies Inc. | Process for fabricating organic circuits |
| US7875688B2 (en) | 2004-06-04 | 2011-01-25 | Designer Molecules, Inc. | Free-radical curable polyesters and methods for use thereof |
| WO2008034716A1 (en) * | 2006-09-22 | 2008-03-27 | Clariant International Ltd | Use of ethoxylated alkylamines for modification of the surface tension of plastics |
| US7868113B2 (en) | 2007-04-11 | 2011-01-11 | Designer Molecules, Inc. | Low shrinkage polyester thermosetting resins |
| WO2009082833A1 (en) * | 2007-12-26 | 2009-07-09 | Henkel Ag & Co. Kgaa | Functional fluoride anti-bleed agents with reactive groups an application in organic based curable compositions |
| US8398898B2 (en) * | 2008-02-23 | 2013-03-19 | Designer Molecules, Inc. | Soluble metal salts for use as conductivity promoters |
| WO2009117729A2 (en) * | 2008-03-21 | 2009-09-24 | Designer Molecules, Inc. | Anti-bleed compounds, compositions and methods for use thereof |
| JP2011526309A (ja) | 2008-07-03 | 2011-10-06 | ヘンケル コーポレイション | 銀被覆フレーク状材料で充填された伝導性硬化性組成物およびダイ取付け用途 |
Citations (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB749112A (en) * | 1951-12-21 | 1956-05-16 | Ciba Ltd | Manufacture of an etherification product of a polyglycidyl ether of a polyoxy compound with a higher monohydric alcohol |
| GB799717A (en) * | 1956-04-20 | 1958-08-13 | Distillers Co Yeast Ltd | Epoxy resin compositions |
| GB806196A (en) * | 1956-04-21 | 1958-12-23 | Distillers Co Yeast Ltd | Epoxy resin composition |
| GB879957A (en) * | 1958-09-22 | 1961-10-11 | Ciba Ltd | Improvements relating to the hardening of epoxides |
| GB885215A (en) * | 1957-08-28 | 1961-12-20 | Ciba Ltd | Synthetic resins from amines and polyepoxides |
| GB934873A (en) * | 1959-02-06 | 1963-08-21 | Norton Co | Resinous coatings for adhesive tapes |
| GB1001467A (en) * | 1962-05-12 | 1965-08-18 | Beck & Co G M B H | Improvements in or relating to methods of hardening epoxy resins |
| GB1019925A (en) * | 1963-09-26 | 1966-02-09 | Ciba Ltd | Epoxide resin compositions |
| GB1305823A (https=) * | 1969-05-06 | 1973-02-07 | ||
| GB1324902A (en) * | 1970-03-02 | 1973-07-25 | Atlantic Richfield Co | Wax-polymer compositions |
| GB1428453A (en) * | 1972-02-10 | 1976-03-17 | Stauffer Chemical Co | Curable organiopolyiloxane compositions |
| GB1524093A (en) * | 1975-05-06 | 1978-09-06 | Ciba Geigy Ag | Preparations of reaction products obtained from epoxides fatty amines and reaction products which contain carboxyl groups process for their manufacture and their use |
| GB2032925A (en) * | 1978-10-14 | 1980-05-14 | Daikin Ind Ltd | Epoxy resin composition |
| GB1570444A (en) * | 1976-11-06 | 1980-07-02 | Schering Ag | Hardening agents for epoxy resins |
| GB2055844A (en) * | 1979-07-31 | 1981-03-11 | Ppg Industries Inc | Esters of diglycidyl polyethers of hydrogenated phenols and coating compositions containing same |
| GB1590227A (en) * | 1976-11-13 | 1981-05-28 | Lion Hamigaki Kk | A-cyanoacrylate dental materials and adhesives |
| GB2065125A (en) * | 1979-12-13 | 1981-06-24 | Union Carbide Corp | High solids epoxy resin-polycaprolactone coating compositions |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4090366A (en) * | 1976-05-12 | 1978-05-23 | Vickers-Intertek Limited | Transit capsules |
| US4143456A (en) * | 1976-06-28 | 1979-03-13 | Citizen Watch Commpany Ltd. | Semiconductor device insulation method |
| US4238528A (en) * | 1978-06-26 | 1980-12-09 | International Business Machines Corporation | Polyimide coating process and material |
-
1982
- 1982-03-17 US US06/358,859 patent/US4483898A/en not_active Expired - Lifetime
-
1983
- 1983-02-22 DE DE8383901046T patent/DE3368022D1/de not_active Expired
- 1983-02-22 WO PCT/US1983/000226 patent/WO1983003210A1/en not_active Ceased
- 1983-02-22 EP EP83901046A patent/EP0103617B1/en not_active Expired
- 1983-02-22 JP JP58501078A patent/JPS59500419A/ja active Granted
- 1983-03-02 CA CA000422714A patent/CA1215799A/en not_active Expired
- 1983-03-15 GB GB08307120A patent/GB2117383A/en not_active Withdrawn
- 1983-03-16 IT IT20104/83A patent/IT1163147B/it active
- 1983-03-16 KR KR1019830001056A patent/KR910010212B1/ko not_active Expired
Patent Citations (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB749112A (en) * | 1951-12-21 | 1956-05-16 | Ciba Ltd | Manufacture of an etherification product of a polyglycidyl ether of a polyoxy compound with a higher monohydric alcohol |
| GB799717A (en) * | 1956-04-20 | 1958-08-13 | Distillers Co Yeast Ltd | Epoxy resin compositions |
| GB806196A (en) * | 1956-04-21 | 1958-12-23 | Distillers Co Yeast Ltd | Epoxy resin composition |
| GB885215A (en) * | 1957-08-28 | 1961-12-20 | Ciba Ltd | Synthetic resins from amines and polyepoxides |
| GB879957A (en) * | 1958-09-22 | 1961-10-11 | Ciba Ltd | Improvements relating to the hardening of epoxides |
| GB934873A (en) * | 1959-02-06 | 1963-08-21 | Norton Co | Resinous coatings for adhesive tapes |
| GB1001467A (en) * | 1962-05-12 | 1965-08-18 | Beck & Co G M B H | Improvements in or relating to methods of hardening epoxy resins |
| GB1019925A (en) * | 1963-09-26 | 1966-02-09 | Ciba Ltd | Epoxide resin compositions |
| GB1305823A (https=) * | 1969-05-06 | 1973-02-07 | ||
| GB1324902A (en) * | 1970-03-02 | 1973-07-25 | Atlantic Richfield Co | Wax-polymer compositions |
| GB1428453A (en) * | 1972-02-10 | 1976-03-17 | Stauffer Chemical Co | Curable organiopolyiloxane compositions |
| GB1524093A (en) * | 1975-05-06 | 1978-09-06 | Ciba Geigy Ag | Preparations of reaction products obtained from epoxides fatty amines and reaction products which contain carboxyl groups process for their manufacture and their use |
| GB1570444A (en) * | 1976-11-06 | 1980-07-02 | Schering Ag | Hardening agents for epoxy resins |
| GB1590227A (en) * | 1976-11-13 | 1981-05-28 | Lion Hamigaki Kk | A-cyanoacrylate dental materials and adhesives |
| GB2032925A (en) * | 1978-10-14 | 1980-05-14 | Daikin Ind Ltd | Epoxy resin composition |
| GB2055844A (en) * | 1979-07-31 | 1981-03-11 | Ppg Industries Inc | Esters of diglycidyl polyethers of hydrogenated phenols and coating compositions containing same |
| GB2065125A (en) * | 1979-12-13 | 1981-06-24 | Union Carbide Corp | High solids epoxy resin-polycaprolactone coating compositions |
Also Published As
| Publication number | Publication date |
|---|---|
| WO1983003210A1 (en) | 1983-09-29 |
| US4483898A (en) | 1984-11-20 |
| CA1215799A (en) | 1986-12-23 |
| JPH037228B2 (https=) | 1991-02-01 |
| KR840003671A (ko) | 1984-09-15 |
| KR910010212B1 (ko) | 1991-12-21 |
| DE3368022D1 (en) | 1987-01-15 |
| EP0103617A1 (en) | 1984-03-28 |
| EP0103617B1 (en) | 1986-12-03 |
| IT8320104A1 (it) | 1984-09-16 |
| IT1163147B (it) | 1987-04-08 |
| EP0103617A4 (en) | 1984-09-13 |
| GB8307120D0 (en) | 1983-04-20 |
| IT8320104A0 (it) | 1983-03-16 |
| JPS59500419A (ja) | 1984-03-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4483898A (en) | Liquids with reduced spreading tendency | |
| KR100863473B1 (ko) | 접착제 및 전기 장치 | |
| DE602004013608T2 (de) | Thermisches leitfähiges Material mit elektrisch leitfähigen Nanopartikeln | |
| US5242715A (en) | Process for coating or bonding electronic components and subassemblies | |
| US6500891B1 (en) | Low viscosity thermally conductive compositions containing spherical thermally conductive particles | |
| CA2611381C (en) | B-stageable film, electronic device, and associated process | |
| EP0234347B1 (en) | Electrically conductive composition and use thereof | |
| US20070241303A1 (en) | Thermally conductive composition and method for preparing the same | |
| KR980002194A (ko) | 반도체 칩 부착용 무용매 에폭시 기재 접착제 및 방법 | |
| TW201900759A (zh) | 樹脂組成物 | |
| CN100441607C (zh) | 潜在性固化剂的制备方法 | |
| KR20050014749A (ko) | 열 계면 재료 | |
| KR20190100209A (ko) | 표면 처리 실리카 필러 및 표면 처리 실리카 필러를 함유하는 수지 조성물 | |
| US4859268A (en) | Method of using electrically conductive composition | |
| EP0279979A1 (en) | Conductive adhesive | |
| KR102837107B1 (ko) | 접착제 조성물 및 구조체 | |
| CN107709502A (zh) | 散热材料粘接用组合物、带粘接剂的散热材料、嵌入基板和其制造方法 | |
| JPS6272511A (ja) | 疎水性としたダイヤモンド粉末及びその処理法 | |
| TWI593768B (zh) | 先設置型半導體封裝用膜 | |
| KR20180095410A (ko) | 도전성 접착제 조성물 | |
| CN120769881A (zh) | 用于封装电子器件的树脂组合物以及使用其制造的电子器件 | |
| JP2023064099A (ja) | スプレー用放熱ペースト、放熱層、及び電子部品 | |
| CA1141528A (en) | Conductive adhesive system including a conductivity enhancer | |
| JPH0351303B2 (https=) | ||
| CN1506429A (zh) | 潜在性硬化剂、其制造方法和粘接剂 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |