GB2116370B - Flexible circuit board - Google Patents
Flexible circuit boardInfo
- Publication number
- GB2116370B GB2116370B GB08302378A GB8302378A GB2116370B GB 2116370 B GB2116370 B GB 2116370B GB 08302378 A GB08302378 A GB 08302378A GB 8302378 A GB8302378 A GB 8302378A GB 2116370 B GB2116370 B GB 2116370B
- Authority
- GB
- United Kingdom
- Prior art keywords
- circuit board
- flexible circuit
- flexible
- board
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/063—Lamination of preperforated insulating layer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1226982U JPS58116272U (ja) | 1982-01-30 | 1982-01-30 | 可撓性回路基板 |
Publications (3)
Publication Number | Publication Date |
---|---|
GB8302378D0 GB8302378D0 (en) | 1983-03-02 |
GB2116370A GB2116370A (en) | 1983-09-21 |
GB2116370B true GB2116370B (en) | 1985-04-17 |
Family
ID=11800645
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB08302378A Expired GB2116370B (en) | 1982-01-30 | 1983-01-28 | Flexible circuit board |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPS58116272U (fr) |
DE (1) | DE3302993C2 (fr) |
FR (1) | FR2520965B1 (fr) |
GB (1) | GB2116370B (fr) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59144968A (ja) * | 1983-02-08 | 1984-08-20 | Sharp Corp | 薄形電子機器 |
DE3447202A1 (de) * | 1984-12-22 | 1986-07-10 | CYTOMED Medizintechnik GmbH, 8750 Aschaffenburg | Implantierbarer, intravasaler katheter fuer die dauermedikation von pharmaka |
JPS63158711A (ja) * | 1986-12-22 | 1988-07-01 | 帝国通信工業株式会社 | フレキシブルプリント基板の端子構造 |
GB8719076D0 (en) * | 1987-08-12 | 1987-09-16 | Bicc Plc | Circuit board |
FR2634095A1 (fr) * | 1988-07-05 | 1990-01-12 | Bull Cp8 | Circuit imprime souple, notamment pour carte a microcircuits electroniques, et carte incorporant un tel circuit |
DE4232119A1 (de) * | 1992-09-25 | 1994-03-31 | Mes Und Regeltechnik Geraeteba | Regelung einer Wälzkolbenpumpe |
DE69331873T2 (de) * | 1992-12-26 | 2002-11-14 | Canon K.K., Tokio/Tokyo | Flüssigkristallapparat |
DE4423893C2 (de) * | 1994-07-07 | 1996-09-05 | Freudenberg Carl Fa | Flachdichtung mit flexibler Leiterplatte |
US5760465A (en) * | 1996-02-01 | 1998-06-02 | International Business Machines Corporation | Electronic package with strain relief means |
KR100733877B1 (ko) * | 2000-07-06 | 2007-07-02 | 엘지.필립스 엘시디 주식회사 | 가요성 인쇄회로 필름 |
GB2421358B (en) * | 2004-12-16 | 2007-02-21 | Sendo Int Ltd | Wireless communication unit and flexible printed circuit board therefor |
CN111465171A (zh) * | 2020-04-02 | 2020-07-28 | 安捷利电子科技(苏州)有限公司 | 柔性线路板 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1241169A (en) * | 1967-09-21 | 1971-07-28 | Elliott Brothers London Ltd | Improvements relating to printed circuits |
US3772776A (en) * | 1969-12-03 | 1973-11-20 | Thomas & Betts Corp | Method of interconnecting memory plane boards |
US3716846A (en) * | 1970-01-24 | 1973-02-13 | R Hafner | Connector sheet with contacts on opposite sides |
DE2423144A1 (de) * | 1974-05-13 | 1975-11-20 | Siemens Ag | Flexibler schaltungstraeger |
DE2835961A1 (de) * | 1978-08-17 | 1980-02-28 | Siemens Ag | Einrichtung zum loesbaren elektrischen kontaktieren einer leiterfolie mit einem starren kontakttraeger |
-
1982
- 1982-01-30 JP JP1226982U patent/JPS58116272U/ja active Pending
-
1983
- 1983-01-28 GB GB08302378A patent/GB2116370B/en not_active Expired
- 1983-01-28 FR FR8301326A patent/FR2520965B1/fr not_active Expired
- 1983-01-29 DE DE19833302993 patent/DE3302993C2/de not_active Expired
Also Published As
Publication number | Publication date |
---|---|
GB8302378D0 (en) | 1983-03-02 |
FR2520965A1 (fr) | 1983-08-05 |
DE3302993C2 (de) | 1987-03-05 |
GB2116370A (en) | 1983-09-21 |
JPS58116272U (ja) | 1983-08-08 |
DE3302993A1 (de) | 1983-08-11 |
FR2520965B1 (fr) | 1985-07-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 19930128 |