JPS58116272U - 可撓性回路基板 - Google Patents

可撓性回路基板

Info

Publication number
JPS58116272U
JPS58116272U JP1226982U JP1226982U JPS58116272U JP S58116272 U JPS58116272 U JP S58116272U JP 1226982 U JP1226982 U JP 1226982U JP 1226982 U JP1226982 U JP 1226982U JP S58116272 U JPS58116272 U JP S58116272U
Authority
JP
Japan
Prior art keywords
circuit board
flexible circuit
cover film
circuit pattern
edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1226982U
Other languages
English (en)
Inventor
戸部　誠一
Original Assignee
日本メクトロン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本メクトロン株式会社 filed Critical 日本メクトロン株式会社
Priority to JP1226982U priority Critical patent/JPS58116272U/ja
Priority to FR8301326A priority patent/FR2520965B1/fr
Priority to GB08302378A priority patent/GB2116370B/en
Priority to DE19833302993 priority patent/DE3302993A1/de
Publication of JPS58116272U publication Critical patent/JPS58116272U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来構造のカバーフィルム付可撓性回路基板の
概念的な平面構成図、第２図および第３図は本考案の実
施例による第１図と同様な可視性回路基板の概念的平面
構成図である。 １・・・・・・ベースフィルム、２・…・・回路パター
ン、２Ａ・・・・・・接続部分、３・・・・・・カバー
フィルム、４・・・・・・端縁、５，６・・・・・・透
孔。

Claims (1)

    【実用新案登録請求の範囲】
  1. 回路パターン上にカバーフィルムを設けるようにした可
    撓性回路基板において、回路パターンの露出接続部分に
    対する上記力゛バーフィルムの端縁または該端縁位置に
    相当するペニスフィルム領域若しくはそれら双方の領域
    部分に透孔を設けるように構成したことを特徴とする可
    撓性回路基板。
JP1226982U 1982-01-30 1982-01-30 可撓性回路基板 Pending JPS58116272U (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP1226982U JPS58116272U (ja) 1982-01-30 1982-01-30 可撓性回路基板
FR8301326A FR2520965B1 (fr) 1982-01-30 1983-01-28 Autre plaquette flexible a circuit
GB08302378A GB2116370B (en) 1982-01-30 1983-01-28 Flexible circuit board
DE19833302993 DE3302993A1 (de) 1982-01-30 1983-01-29 Flexible schaltungstraegerplatte oder -bahn

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1226982U JPS58116272U (ja) 1982-01-30 1982-01-30 可撓性回路基板

Publications (1)

Publication Number Publication Date
JPS58116272U true JPS58116272U (ja) 1983-08-08

Family

ID=11800645

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1226982U Pending JPS58116272U (ja) 1982-01-30 1982-01-30 可撓性回路基板

Country Status (4)

Country Link
JP (1) JPS58116272U (ja)
DE (1) DE3302993A1 (ja)
FR (1) FR2520965B1 (ja)
GB (1) GB2116370B (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59144968A (ja) * 1983-02-08 1984-08-20 Sharp Corp 薄形電子機器
DE3447202A1 (de) * 1984-12-22 1986-07-10 CYTOMED Medizintechnik GmbH, 8750 Aschaffenburg Implantierbarer, intravasaler katheter fuer die dauermedikation von pharmaka
JPS63158711A (ja) * 1986-12-22 1988-07-01 帝国通信工業株式会社 フレキシブルプリント基板の端子構造
GB8719076D0 (en) * 1987-08-12 1987-09-16 Bicc Plc Circuit board
FR2634095A1 (fr) * 1988-07-05 1990-01-12 Bull Cp8 Circuit imprime souple, notamment pour carte a microcircuits electroniques, et carte incorporant un tel circuit
DE4232119A1 (de) * 1992-09-25 1994-03-31 Mes Und Regeltechnik Geraeteba Regelung einer Wälzkolbenpumpe
DE69331873T2 (de) * 1992-12-26 2002-11-14 Canon Kk Flüssigkristallapparat
DE4423893C2 (de) * 1994-07-07 1996-09-05 Freudenberg Carl Fa Flachdichtung mit flexibler Leiterplatte
US5760465A (en) * 1996-02-01 1998-06-02 International Business Machines Corporation Electronic package with strain relief means
KR100733877B1 (ko) 2000-07-06 2007-07-02 엘지.필립스 엘시디 주식회사 가요성 인쇄회로 필름
GB2421358B (en) * 2004-12-16 2007-02-21 Sendo Int Ltd Wireless communication unit and flexible printed circuit board therefor
CN111465171A (zh) * 2020-04-02 2020-07-28 安捷利电子科技（苏州）有限公司 柔性线路板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1241169A (en) * 1967-09-21 1971-07-28 Elliott Brothers London Ltd Improvements relating to printed circuits
US3772776A (en) * 1969-12-03 1973-11-20 Thomas & Betts Corp Method of interconnecting memory plane boards
US3716846A (en) * 1970-01-24 1973-02-13 R Hafner Connector sheet with contacts on opposite sides
DE2423144A1 (de) * 1974-05-13 1975-11-20 Siemens Ag Flexibler schaltungstraeger
DE2835961A1 (de) * 1978-08-17 1980-02-28 Siemens Ag Einrichtung zum loesbaren elektrischen kontaktieren einer leiterfolie mit einem starren kontakttraeger

Also Published As

Publication number Publication date
GB2116370A (en) 1983-09-21
GB8302378D0 (en) 1983-03-02
FR2520965A1 (fr) 1983-08-05
GB2116370B (en) 1985-04-17
DE3302993A1 (de) 1983-08-11
FR2520965B1 (fr) 1985-07-19
DE3302993C2 (ja) 1987-03-05

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