JPS58116271U - 可撓性回路基板 - Google Patents

可撓性回路基板

Info

Publication number
JPS58116271U
JPS58116271U JP1226882U JP1226882U JPS58116271U JP S58116271 U JPS58116271 U JP S58116271U JP 1226882 U JP1226882 U JP 1226882U JP 1226882 U JP1226882 U JP 1226882U JP S58116271 U JPS58116271 U JP S58116271U
Authority
JP
Japan
Prior art keywords
circuit board
flexible circuit
flexible
film
reinforcing portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1226882U
Other languages
English (en)
Inventor
矢田部　勝之
Original Assignee
日本メクトロン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本メクトロン株式会社 filed Critical 日本メクトロン株式会社
Priority to JP1226882U priority Critical patent/JPS58116271U/ja
Priority to FR8301325A priority patent/FR2520964B1/fr
Priority to GB08302377A priority patent/GB2130019B/en
Priority to DE19833302994 priority patent/DE3302994A1/de
Publication of JPS58116271U publication Critical patent/JPS58116271U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H05K1/0281—Reinforcement details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来例のカバーフィルム付可撓性回路基板を示
す概念的な平面構成図、第２図および第３図鉢本箸案の
一実施例に従った可撓性回路基板の概念的な要部平面構
成図およびその側面構成図である。

Claims (3)

    【実用新案登録請求の範囲】
  1. （１）回路パターン上にカバーフィルムを設けるように
    した可撓性回路基板において、回路パターンの露出接続
    部分と接する上記カバーフィルム端縁の少な（とも−側
    端であって該回路パターンを設けるベースフィルム部分
    と結合する柔軟な補強部を設けるように構成してなる可
    撓性回路基板。
  2. （２）前記補強部が上記ベースフィルムと一体に形成さ
    れてなる実用新案登録請求の範囲（１）の可撓性回路基
    板。
  3. （３）　　前記補強部が上記ベースフィルムと別体であ
    一つて柔軟な部材で構成された実用新案登録請求の範囲
    （１）の可撓性回路基板。
JP1226882U 1982-01-30 1982-01-30 可撓性回路基板 Pending JPS58116271U (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP1226882U JPS58116271U (ja) 1982-01-30 1982-01-30 可撓性回路基板
FR8301325A FR2520964B1 (fr) 1982-01-30 1983-01-28 Plaquette flexible a circuit
GB08302377A GB2130019B (en) 1982-01-30 1983-01-28 Flexible circuit board
DE19833302994 DE3302994A1 (de) 1982-01-30 1983-01-29 Flexible schaltungstraegerplatte oder -bahn

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1226882U JPS58116271U (ja) 1982-01-30 1982-01-30 可撓性回路基板

Publications (1)

Publication Number Publication Date
JPS58116271U true JPS58116271U (ja) 1983-08-08

Family

ID=11800616

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1226882U Pending JPS58116271U (ja) 1982-01-30 1982-01-30 可撓性回路基板

Country Status (4)

Country Link
JP (1) JPS58116271U (ja)
DE (1) DE3302994A1 (ja)
FR (1) FR2520964B1 (ja)
GB (1) GB2130019B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63158711A (ja) * 1986-12-22 1988-07-01 帝国通信工業株式会社 フレキシブルプリント基板の端子構造
JPH0625973Y2 (ja) * 1988-05-13 1994-07-06 アルプス電気株式会社 フレキシブル配線板
US4913662A (en) * 1989-03-06 1990-04-03 Nadin Noy Flat, flexible, cable construction and connector attached thereto
JP2606177B2 (ja) * 1995-04-26 1997-04-30 日本電気株式会社 印刷配線板

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5514736B2 (ja) * 1975-09-09 1980-04-18

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3009010A (en) * 1958-02-10 1961-11-14 Sanders Associates Inc Printed circuit harness and connector
FR1434935A (fr) * 1963-11-04 1966-04-15 Sanders Associates Inc Inhibiteur des déformations d'une matière thermoplastique
US3772776A (en) * 1969-12-03 1973-11-20 Thomas & Betts Corp Method of interconnecting memory plane boards
US3997229A (en) * 1975-09-15 1976-12-14 Thomas & Betts Corporation Flexible connecting means

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5514736B2 (ja) * 1975-09-09 1980-04-18

Also Published As

Publication number Publication date
GB2130019A (en) 1984-05-23
DE3302994A1 (de) 1983-08-18
GB8302377D0 (en) 1983-03-02
FR2520964B1 (fr) 1985-07-19
GB2130019B (en) 1985-04-17
FR2520964A1 (fr) 1983-08-05
DE3302994C2 (ja) 1988-07-07

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