GB2116370B - Flexible circuit board - Google Patents

Flexible circuit board

Info

Publication number
GB2116370B
GB2116370B GB08302378A GB8302378A GB2116370B GB 2116370 B GB2116370 B GB 2116370B GB 08302378 A GB08302378 A GB 08302378A GB 8302378 A GB8302378 A GB 8302378A GB 2116370 B GB2116370 B GB 2116370B
Authority
GB
United Kingdom
Prior art keywords
circuit board
flexible circuit
flexible
board
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08302378A
Other languages
English (en)
Other versions
GB8302378D0 (en
GB2116370A (en
Inventor
Katsuyuki Yatabe
Seiichi Tobe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mektron KK
Original Assignee
Nippon Mektron KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron KK filed Critical Nippon Mektron KK
Publication of GB8302378D0 publication Critical patent/GB8302378D0/en
Publication of GB2116370A publication Critical patent/GB2116370A/en
Application granted granted Critical
Publication of GB2116370B publication Critical patent/GB2116370B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
GB08302378A 1982-01-30 1983-01-28 Flexible circuit board Expired GB2116370B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1226982U JPS58116272U (ja) 1982-01-30 1982-01-30 可撓性回路基板

Publications (3)

Publication Number Publication Date
GB8302378D0 GB8302378D0 (en) 1983-03-02
GB2116370A GB2116370A (en) 1983-09-21
GB2116370B true GB2116370B (en) 1985-04-17

Family

ID=11800645

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08302378A Expired GB2116370B (en) 1982-01-30 1983-01-28 Flexible circuit board

Country Status (4)

Country Link
JP (1) JPS58116272U (de)
DE (1) DE3302993C2 (de)
FR (1) FR2520965B1 (de)
GB (1) GB2116370B (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59144968A (ja) * 1983-02-08 1984-08-20 Sharp Corp 薄形電子機器
DE3447202A1 (de) * 1984-12-22 1986-07-10 CYTOMED Medizintechnik GmbH, 8750 Aschaffenburg Implantierbarer, intravasaler katheter fuer die dauermedikation von pharmaka
JPS63158711A (ja) * 1986-12-22 1988-07-01 帝国通信工業株式会社 フレキシブルプリント基板の端子構造
GB8719076D0 (en) * 1987-08-12 1987-09-16 Bicc Plc Circuit board
FR2634095A1 (fr) * 1988-07-05 1990-01-12 Bull Cp8 Circuit imprime souple, notamment pour carte a microcircuits electroniques, et carte incorporant un tel circuit
DE4232119A1 (de) * 1992-09-25 1994-03-31 Mes Und Regeltechnik Geraeteba Regelung einer Wälzkolbenpumpe
EP0604893B1 (de) * 1992-12-26 2002-05-02 Canon Kabushiki Kaisha Flüssigkristallapparat
DE4423893C2 (de) * 1994-07-07 1996-09-05 Freudenberg Carl Fa Flachdichtung mit flexibler Leiterplatte
US5760465A (en) * 1996-02-01 1998-06-02 International Business Machines Corporation Electronic package with strain relief means
KR100733877B1 (ko) * 2000-07-06 2007-07-02 엘지.필립스 엘시디 주식회사 가요성 인쇄회로 필름
GB2421358B (en) * 2004-12-16 2007-02-21 Sendo Int Ltd Wireless communication unit and flexible printed circuit board therefor
CN111465171A (zh) * 2020-04-02 2020-07-28 安捷利电子科技（苏州）有限公司 柔性线路板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1241169A (en) * 1967-09-21 1971-07-28 Elliott Brothers London Ltd Improvements relating to printed circuits
US3772776A (en) * 1969-12-03 1973-11-20 Thomas & Betts Corp Method of interconnecting memory plane boards
US3716846A (en) * 1970-01-24 1973-02-13 R Hafner Connector sheet with contacts on opposite sides
DE2423144A1 (de) * 1974-05-13 1975-11-20 Siemens Ag Flexibler schaltungstraeger
DE2835961A1 (de) * 1978-08-17 1980-02-28 Siemens Ag Einrichtung zum loesbaren elektrischen kontaktieren einer leiterfolie mit einem starren kontakttraeger

Also Published As

Publication number Publication date
GB8302378D0 (en) 1983-03-02
JPS58116272U (ja) 1983-08-08
FR2520965B1 (fr) 1985-07-19
GB2116370A (en) 1983-09-21
FR2520965A1 (fr) 1983-08-05
DE3302993A1 (de) 1983-08-11
DE3302993C2 (de) 1987-03-05

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19930128