GB2106937A - Electroless nickel plating - Google Patents
Electroless nickel plating Download PDFInfo
- Publication number
- GB2106937A GB2106937A GB08123255A GB8123255A GB2106937A GB 2106937 A GB2106937 A GB 2106937A GB 08123255 A GB08123255 A GB 08123255A GB 8123255 A GB8123255 A GB 8123255A GB 2106937 A GB2106937 A GB 2106937A
- Authority
- GB
- United Kingdom
- Prior art keywords
- nickel
- bath
- ions
- amine
- ammonia
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB08123255A GB2106937A (en) | 1981-07-28 | 1981-07-28 | Electroless nickel plating |
AU73517/81A AU7351781A (en) | 1981-07-28 | 1981-07-28 | Ammonia-free electroless nickel plating bath |
FR8114981A FR2510612A1 (fr) | 1981-07-28 | 1981-07-31 | Bain de nickelage non electrolytique sans ammoniac et procede pour la metallisation de non-conducteurs |
JP56122896A JPS5827970A (ja) | 1981-07-28 | 1981-08-05 | 非電気ニツケルめつき法及びめつき浴 |
BR8105075A BR8105075A (pt) | 1981-07-28 | 1981-08-06 | Banho de niquelagem isento de amonia,sem eletricidade e processo para revestimento de nao condutores |
DE19813131342 DE3131342A1 (de) | 1981-07-28 | 1981-08-07 | "ammoniakfreies stromloses vernickelungsbad und verfahren zum vernickeln von nichtleitern" |
IT49107/81A IT1171462B (it) | 1981-07-28 | 1981-08-13 | Bagno di placcatura del nichel per riduzione con assenza di ammoniaca e procedimento per placcare materiali non conduttori |
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB08123255A GB2106937A (en) | 1981-07-28 | 1981-07-28 | Electroless nickel plating |
AU73517/81A AU7351781A (en) | 1981-07-28 | 1981-07-28 | Ammonia-free electroless nickel plating bath |
FR8114981A FR2510612A1 (fr) | 1981-07-28 | 1981-07-31 | Bain de nickelage non electrolytique sans ammoniac et procede pour la metallisation de non-conducteurs |
JP56122896A JPS5827970A (ja) | 1981-07-28 | 1981-08-05 | 非電気ニツケルめつき法及びめつき浴 |
BR8105075A BR8105075A (pt) | 1981-07-28 | 1981-08-06 | Banho de niquelagem isento de amonia,sem eletricidade e processo para revestimento de nao condutores |
DE19813131342 DE3131342A1 (de) | 1981-07-28 | 1981-08-07 | "ammoniakfreies stromloses vernickelungsbad und verfahren zum vernickeln von nichtleitern" |
IT49107/81A IT1171462B (it) | 1981-07-28 | 1981-08-13 | Bagno di placcatura del nichel per riduzione con assenza di ammoniaca e procedimento per placcare materiali non conduttori |
Publications (1)
Publication Number | Publication Date |
---|---|
GB2106937A true GB2106937A (en) | 1983-04-20 |
Family
ID=34199391
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB08123255A Withdrawn GB2106937A (en) | 1981-07-28 | 1981-07-28 | Electroless nickel plating |
Country Status (7)
Country | Link |
---|---|
JP (1) | JPS5827970A (it) |
AU (1) | AU7351781A (it) |
BR (1) | BR8105075A (it) |
DE (1) | DE3131342A1 (it) |
FR (1) | FR2510612A1 (it) |
GB (1) | GB2106937A (it) |
IT (1) | IT1171462B (it) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113861614A (zh) * | 2021-09-29 | 2021-12-31 | 上海金发科技发展有限公司 | 一种高电镀结合力的abs改性材料及其制备方法与应用 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10437114B2 (en) | 2015-12-01 | 2019-10-08 | Japan Display Inc. | Display device |
-
1981
- 1981-07-28 GB GB08123255A patent/GB2106937A/en not_active Withdrawn
- 1981-07-28 AU AU73517/81A patent/AU7351781A/en not_active Abandoned
- 1981-07-31 FR FR8114981A patent/FR2510612A1/fr not_active Withdrawn
- 1981-08-05 JP JP56122896A patent/JPS5827970A/ja active Pending
- 1981-08-06 BR BR8105075A patent/BR8105075A/pt unknown
- 1981-08-07 DE DE19813131342 patent/DE3131342A1/de not_active Withdrawn
- 1981-08-13 IT IT49107/81A patent/IT1171462B/it active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113861614A (zh) * | 2021-09-29 | 2021-12-31 | 上海金发科技发展有限公司 | 一种高电镀结合力的abs改性材料及其制备方法与应用 |
CN113861614B (zh) * | 2021-09-29 | 2023-10-31 | 上海金发科技发展有限公司 | 一种高电镀结合力的abs改性材料及其制备方法与应用 |
Also Published As
Publication number | Publication date |
---|---|
FR2510612A1 (fr) | 1983-02-04 |
BR8105075A (pt) | 1983-03-15 |
IT8149107A0 (it) | 1981-08-13 |
JPS5827970A (ja) | 1983-02-18 |
AU7351781A (en) | 1983-02-03 |
IT1171462B (it) | 1987-06-10 |
DE3131342A1 (de) | 1983-02-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |