IT1171462B - Bagno di placcatura del nichel per riduzione con assenza di ammoniaca e procedimento per placcare materiali non conduttori - Google Patents

Bagno di placcatura del nichel per riduzione con assenza di ammoniaca e procedimento per placcare materiali non conduttori

Info

Publication number
IT1171462B
IT1171462B IT49107/81A IT4910781A IT1171462B IT 1171462 B IT1171462 B IT 1171462B IT 49107/81 A IT49107/81 A IT 49107/81A IT 4910781 A IT4910781 A IT 4910781A IT 1171462 B IT1171462 B IT 1171462B
Authority
IT
Italy
Prior art keywords
ions
bath
pref
coating
plating bath
Prior art date
Application number
IT49107/81A
Other languages
English (en)
Other versions
IT8149107A0 (it
Inventor
Eugene F Yarkoshy
Anthony J Marczak
Michael J Aleksinas
Original Assignee
Enthone
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to GB08123255A priority Critical patent/GB2106937A/en
Priority to AU73517/81A priority patent/AU7351781A/en
Priority to FR8114981A priority patent/FR2510612A1/fr
Priority to JP56122896A priority patent/JPS5827970A/ja
Priority to BR8105075A priority patent/BR8105075A/pt
Priority to DE19813131342 priority patent/DE3131342A1/de
Application filed by Enthone filed Critical Enthone
Priority to IT49107/81A priority patent/IT1171462B/it
Publication of IT8149107A0 publication Critical patent/IT8149107A0/it
Application granted granted Critical
Publication of IT1171462B publication Critical patent/IT1171462B/it

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
IT49107/81A 1981-07-28 1981-08-13 Bagno di placcatura del nichel per riduzione con assenza di ammoniaca e procedimento per placcare materiali non conduttori IT1171462B (it)

Priority Applications (7)

Application Number Priority Date Filing Date Title
GB08123255A GB2106937A (en) 1981-07-28 1981-07-28 Electroless nickel plating
AU73517/81A AU7351781A (en) 1981-07-28 1981-07-28 Ammonia-free electroless nickel plating bath
FR8114981A FR2510612A1 (fr) 1981-07-28 1981-07-31 Bain de nickelage non electrolytique sans ammoniac et procede pour la metallisation de non-conducteurs
JP56122896A JPS5827970A (ja) 1981-07-28 1981-08-05 非電気ニツケルめつき法及びめつき浴
BR8105075A BR8105075A (pt) 1981-07-28 1981-08-06 Banho de niquelagem isento de amonia,sem eletricidade e processo para revestimento de nao condutores
DE19813131342 DE3131342A1 (de) 1981-07-28 1981-08-07 "ammoniakfreies stromloses vernickelungsbad und verfahren zum vernickeln von nichtleitern"
IT49107/81A IT1171462B (it) 1981-07-28 1981-08-13 Bagno di placcatura del nichel per riduzione con assenza di ammoniaca e procedimento per placcare materiali non conduttori

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
GB08123255A GB2106937A (en) 1981-07-28 1981-07-28 Electroless nickel plating
AU73517/81A AU7351781A (en) 1981-07-28 1981-07-28 Ammonia-free electroless nickel plating bath
FR8114981A FR2510612A1 (fr) 1981-07-28 1981-07-31 Bain de nickelage non electrolytique sans ammoniac et procede pour la metallisation de non-conducteurs
JP56122896A JPS5827970A (ja) 1981-07-28 1981-08-05 非電気ニツケルめつき法及びめつき浴
BR8105075A BR8105075A (pt) 1981-07-28 1981-08-06 Banho de niquelagem isento de amonia,sem eletricidade e processo para revestimento de nao condutores
DE19813131342 DE3131342A1 (de) 1981-07-28 1981-08-07 "ammoniakfreies stromloses vernickelungsbad und verfahren zum vernickeln von nichtleitern"
IT49107/81A IT1171462B (it) 1981-07-28 1981-08-13 Bagno di placcatura del nichel per riduzione con assenza di ammoniaca e procedimento per placcare materiali non conduttori

Publications (2)

Publication Number Publication Date
IT8149107A0 IT8149107A0 (it) 1981-08-13
IT1171462B true IT1171462B (it) 1987-06-10

Family

ID=34199391

Family Applications (1)

Application Number Title Priority Date Filing Date
IT49107/81A IT1171462B (it) 1981-07-28 1981-08-13 Bagno di placcatura del nichel per riduzione con assenza di ammoniaca e procedimento per placcare materiali non conduttori

Country Status (7)

Country Link
JP (1) JPS5827970A (it)
AU (1) AU7351781A (it)
BR (1) BR8105075A (it)
DE (1) DE3131342A1 (it)
FR (1) FR2510612A1 (it)
GB (1) GB2106937A (it)
IT (1) IT1171462B (it)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10437114B2 (en) 2015-12-01 2019-10-08 Japan Display Inc. Display device
CN113861614B (zh) * 2021-09-29 2023-10-31 上海金发科技发展有限公司 一种高电镀结合力的abs改性材料及其制备方法与应用

Also Published As

Publication number Publication date
AU7351781A (en) 1983-02-03
BR8105075A (pt) 1983-03-15
JPS5827970A (ja) 1983-02-18
IT8149107A0 (it) 1981-08-13
DE3131342A1 (de) 1983-02-24
FR2510612A1 (fr) 1983-02-04
GB2106937A (en) 1983-04-20

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