GB2084191A - Electro-deposition of alloys - Google Patents

Electro-deposition of alloys Download PDF

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Publication number
GB2084191A
GB2084191A GB8030638A GB8030638A GB2084191A GB 2084191 A GB2084191 A GB 2084191A GB 8030638 A GB8030638 A GB 8030638A GB 8030638 A GB8030638 A GB 8030638A GB 2084191 A GB2084191 A GB 2084191A
Authority
GB
United Kingdom
Prior art keywords
lead
tin
cathode
anode
solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB8030638A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Federal Mogul Shoreham Ltd
Original Assignee
Vandervell Products Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vandervell Products Ltd filed Critical Vandervell Products Ltd
Priority to GB8030638A priority Critical patent/GB2084191A/en
Priority to EP81304194A priority patent/EP0048579B1/en
Priority to DE8181304194T priority patent/DE3167841D1/en
Priority to AT81304194T priority patent/ATE10862T1/en
Priority to CA000386328A priority patent/CA1172599A/en
Priority to BR8106041A priority patent/BR8106041A/en
Publication of GB2084191A publication Critical patent/GB2084191A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002Cell separation, e.g. membranes, diaphragms

Abstract

Apparatus and method for the electro-deposition of a ternary alloy on to a cathode comprises an anolyte containing chamber 14 and a catholyte containing chamber 10 in communication with one another only through the medium of a cation exchange membrane 16. The apparatus is used for depositing a ternary bearing alloy, such as lead-antimony-tin or lead-tin-copper on to the bronze substrate of a steel backed bearing member; the bearing member comprising the cathode 12. Use of the method and apparatus prevents undesirable immersion plating of the lead-containing anode 20 by metals from the plating solution which are more noble than lead.

Description

1
GB 2 084 1 91A 1
SPECIFICATION
Method and apparatus for the electro-deposition of lead alloys
5 This invention relates to a method and apparatus for the electro-deposition of an alloy coating on 5 to a backing member, such a process being of particular interest to the coating of a load carrying bearing surface on to the backing member of a plain bearing.
Such a bearing may comprise for example a half shell backing member of steel with a bronze sybstrate bonded thereto and on to which is electro-deposited a bearing surface coating of lead-10 indium or lead-antimony-tin. Binary and ternary alloys can be co-deposited electrolytically as is 10 described for example in British Patents 577335 and 628459 and in U.S.A. Patent 2605149. In British Patent 577335 it is stated, and has been verified in tests, that coatings of ternary alfoys such as lead-antimony-tin or lead-tin-copper can replace the more usual lead-tin or lead-indium binary alloy coatings as bearing surfaces.
1 5 However in the electro-deposition of ternary alloys containing antimony or copper, there is a 15 displacement reaction when a soluble metal anode is used. For example in British Patent 628459 it is stated that antimony will immersion plate on to a lead, lead-tin or lead-tin-antimony anode. In Patent 628459 it is stated that this immersion plating is adherent enough so that the anode may be used two or three times and then the antimony my be scrubbed off 20 and reclaimed and, whereas such a procedure may be acceptable for small scale operation, it 20 would not be feasible to operate a continuous production plating process wherein anodes were required to be removed many times during the working operation for scrubbing.
Similarly if a lead-tin-copper electrolyte is utilised, the copper in the plating solution immersion plates out on to metal anodes such as lead or lead-tin and, although such an 25 electrolyte has been in production use for many years, the removal of all the anodes from the 25 bath during idle periods is required, and frequent additions of copper fluoroborate are necessary to replace losses from the electrolyte.
It is the object of the present invention to provide an improved method and apparatus which will prevent the undesirable immersion plating of a soluble metal anode containing lead by 30 metals from the plating solution which are more noble than lead. 30
In accordance with one aspect of the invention there is provided apparatus for the electro-deposition of an alloy on to a cathode comprising a first chamber within which the cathode is located and which contains a catholyte solution; a second chamber within which the anode is located and which contains an anolyte solution, and said first and second chambers communi-35 eating with one another only through the medium of a cation exchange membrane. 35
In accordance with a further aspect of the invention there is provided a method of electro-depositing an alloy on to a metal cathode comprising the steps of immersing the cathode in a first chamber containing a catholyte solution; immersing a metal anode in a second chamber containing an anolyte solution communicating with said catholyte solution only through the 40 medium of a cation exchange membrane and applying a direct current between the anode and 40 cathode.
In use of the apparatus and method according to the invention the anolyte will not contain elements capable of immersion plating on to the anode. Thus if the catholyte comprises a lead-antimony-tin plating solution then the anolyte will not contain any antimony. Similarly if the 45 catholyte comprises a lead-tin-copper plating solution then the anolyte will not contain copper. 45 When the apparatus is in use, metal ions arising from the anode pass through the cation exchange membrane towards the cathode under the influence of the plating potential. Since the anolyte contains no metal capable of immersion plating on to the anode the anode will remain clean. At the end of a plating operation, when the plating potential is disconnected, the 50 antimony or copper or arsenic in the catholyte (depending on what alloy is being co-deposited) 50 is*prevented from entering the anolyte by the physical barrier of the cation exchange membrane.
That is to say, metal ions can pass in one direction only, i.e. towards the cathode, and then only under the influence of the plating potential applied between the anode and cathode. Thus the anolyte solution in the second chamber remains free of ions capable of immersion plating on to 55 the anode. 55
A further advantage of the use of a cation exchange membrane to physically separate the catholyte and anolyte solutions is that the composition of the catholyte may be controlled more readily since metal is not lost therefrom by immersion plating which in turn means that the electro-deposited alloys have more consistent compositions.
60 Other features of the invention will become apparent from the following description given 60
herein solely by way of example and with reference to the accompanying drawing which shows, in diagrammatic form, a plan view of a plating bath in accordance with the invention.
Referring to the drawings there is shown a first chamber 10 within which is locatable a member 12 to be plated and which comprises the cathode; such member may comprise a steel 65 backing member with a bronze substrate bonded thereto and on to which is to be co-deposited a 65
2
GB2 084 1 91A
2
ternary alloy as a bearing surface. This first chamber 10 is capable of being filled with the catholyte solution.
At the end of the first chamber 10 remote from the cathode 12 there is provided a second chamber 14 wholely contained within the first chamber and communicating therewith only - 5 through the medium of a cation exchange membrane 16. This second chamber 14 is 5
conveniently of box like rectangular configuration having an open top and an open front across which is secured the exchange membrane 1 6 by means of detachable clamping plates and gaskets. To provide support and protection for the exchange membrane 16a sheet 18 of porous polyethylene may be sealingly located by the gaskets on one or both sides of the membrane 16 10 the polyethylene sheeting 18 being provided to prevent physical damage to the exchange 10
membrane 1 6 and also providing support against sag or swelling of the exchange membrane which may occur in use. >
The cation exchange membrane is a proprietary item and may be of the type available from Permutit-Boby of Brentford, Middlesex, England.
15 The anode 20 is locatable within the second chamber 14 and the chamber 14 is capable of 15 being filled with an anolyte solution to at least the same level as that of the catholyte solution in the first chamber 10. It may be preferable for the level of the anolyte solution to be above that of the catholyte solution to provide a slight hydrostatic pressure in favour of the anolyte.
The following examples of use of the apparatus will serve to illustrate the invention:-20 20
Example 1
The apparatus was used for the electro-deposition of a ternary alloy of lead-antimony-tin to give a coating having a basis of lead and containing between 9.5% and 10.5% by weight of antimony and between 5.5% and 6.5% by weight of tin in the deposited alloy. The anode was 25 a lead-tin anode containing 5% to 25% by weight of tin. 25
The cathode comprised a steel backing member on to which was bonded a bronze substrate.
It is preferable to electroplate a base coating of cobalt or nickel on to the bronze substrate thereby to give a better surface for the deposition of the required ternary alloy particularly for the prevention of dispersal to tin into the bronze.
30 The catholyte solution in the first chamber was as follows:- 30
Lead 1 50 grammes/litre added as lead fluoroborate
Antimony 6 grammes/litre added as
35 antimony trifluoride 35
Tin (stannous) 22 grammes/litre added as tin fluoroborate Resorcinol 7.5 grammes/litre
Gelatin 0.75 grammes/litre
40 Free fluoroboric acid 20 grammes/litre 40
The temperature of the catholyte was maintained at 40°C and a cathode current density of 30 amperes per square foot was utilised for approximately 20 minutes to give a deposited alloy thickness of 25 um.
45 The second chamber was filled with an anolyte solution of the following composition 45
Lead 150 grammes/litre added as lead fluoroborate
Tin 22 grammes/litre added as tin
50 fluoroborate . 50
Resorcinol 7.5 grammes/litre
Gelatin 0.75 grammes/litre
Free fluoroboric acid 20 grammes/litre
55 The temperature of the anolyte solution was maintained at 40°C. 55
Example 2
In this example identical constructions of anode and cathode were utilised as in the preceding example but the electrolyte solutions were chosen to give a ternary alloy deposit on the cathode 60 of lead-tin-copper having a basis of lead and containing between 8% and 12% by weight of tin 60 and between 2% and 3% by weight of copper in the deposited alloy.
A catholyte solution of the following composition was used:-
3
GB2084 1 91A
3
Resorcinol Gelatin 10 Free fluoroboric acid
5
Tin (Stannous)
Copper
Lead
100 grammes/litre added as lead fluoroborate
10 grammes/litre added as tin fluoroborate
3 grammes/litre added as copper fluoroborate 5 grammes/litre 0.5 grammes/litre 40 grammes /litre
10
5
The temperature of the catholyte solution was maintained at 25°C and cathode current density of 20 amperes per square foot was utilised for approximately 20 minutes to give a deposited ternary alloy of 25 um thickness.
15 The anolyte solution was identical in all respects with the catholyte solution with the exception 15 that no copper fluoroborate was present in the anolyte.
In both examples it was found that the anode remained clean and that the plating elements had been lost from the catholyte to the cathode at a controlled rate.
2. Apparatus as claimed in Claim 1 wherein said second chamber is located within said first chamber.
3. Apparatus as claimed in either one of Claims 1 or 2 wherein the anode is a lead-tin anode.
30 4. Apparatus as claimed in any one of the preceding claims wherein the cathode is a steel 30 backed bearing member.
5. Apparatus for the electro-deposition of a bearing alloy on to the substrate of a steel backed bearing member constructed and arranged substantially as hereinbefore described with reference to and as shown in the accompanying drawings.
35 6. A method of electro-depositing an alloy on to a metal cathode comprising the steps of 35 immersing the cathode in a first chamber containing a catholyte solution; immersing a metal anode in a second chamber containing an anolyte solution communicating with said catholyte solution only through the medium of a cation exchange membrane and applying a direct current between the anode and cathode.
40 7. A method according to Claim 6 wherein the catholyte solution is a lead-antimony-tin 40
solution, the anolyte solution is a lead-tin solution and the anode is a lead-tin anode.
8. A method according to Claim 6 wherein the catholyte solution is a lead-tin-copper solution, the anolyte solution is a lead-tin solution and the anode is a lead-tin anode.
9. A method of electro-depositing a bearing alloy on to the substrate of a steel backed
45 bearing substantially as hereinbefore described. 45

Claims (1)

  1. 20 CLAIMS
    20
    1. Apparatus for the electro-deposition of an alloy on to a cathode comprising a first chamber within which the cathode is located and which contains a catholyte solution; a second chamber within which the anode is located and which contains an anolyte solution, and said first and second chambers communicating with one another only through the medium of a
    25 cation exchange membrane.
    25
    Printed for Her Majesty's Stationery Office by Burgess & Son (Abingdon) Ltd.—1982.
    Published at The Patent Office. 25 Southampton Buildings, London. WC2A 1AY. from which copies may be obtained.
GB8030638A 1980-09-23 1980-09-23 Electro-deposition of alloys Withdrawn GB2084191A (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
GB8030638A GB2084191A (en) 1980-09-23 1980-09-23 Electro-deposition of alloys
EP81304194A EP0048579B1 (en) 1980-09-23 1981-09-14 Method for the electro-deposition of lead alloys
DE8181304194T DE3167841D1 (en) 1980-09-23 1981-09-14 Method for the electro-deposition of lead alloys
AT81304194T ATE10862T1 (en) 1980-09-23 1981-09-14 PROCESS FOR ELECTROPLATING OF LEAD ALLOYS.
CA000386328A CA1172599A (en) 1980-09-23 1981-09-21 Method and apparatus for the electro-deposition of lead alloys
BR8106041A BR8106041A (en) 1980-09-23 1981-09-22 APPLIANCE AND PROCESS FOR ELECTRODEPOSITION OF A ALLOY ON A CATHOD

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8030638A GB2084191A (en) 1980-09-23 1980-09-23 Electro-deposition of alloys

Publications (1)

Publication Number Publication Date
GB2084191A true GB2084191A (en) 1982-04-07

Family

ID=10516222

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8030638A Withdrawn GB2084191A (en) 1980-09-23 1980-09-23 Electro-deposition of alloys

Country Status (6)

Country Link
EP (1) EP0048579B1 (en)
AT (1) ATE10862T1 (en)
BR (1) BR8106041A (en)
CA (1) CA1172599A (en)
DE (1) DE3167841D1 (en)
GB (1) GB2084191A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4591536A (en) * 1983-10-01 1986-05-27 Glyco Metall-Werke Daelen & Hofmann KG Plain bearing and method of manufacture
US5320912A (en) * 1991-05-31 1994-06-14 Honda Giken Kogyo Kabushiki Kaisha Slide member
US5340660A (en) * 1991-07-18 1994-08-23 Honda Giken Kogyo Kabushiki Kaisha Slide member
US5342698A (en) * 1991-06-11 1994-08-30 Honda Giken Kogyo Kabushiki Kaisha Slide bearing
US5468567A (en) * 1990-01-19 1995-11-21 Honda Giken Kogyo Kabushiki Kaisha Slide member
GB2324805A (en) * 1997-04-30 1998-11-04 Platt Electromeck Limited Electroplating
CN105350063A (en) * 2015-11-09 2016-02-24 科文特亚表面处理技术(苏州)有限公司 Electroplating-liquid-separated anode system

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3430945A1 (en) * 1984-08-22 1986-03-06 Miba Gleitlager Ag, Laakirchen Electrodeposited bearing layer for a sliding bearing
DE19606993C1 (en) * 1996-02-24 1997-04-03 Glyco Metall Werke Prodn. of layered material for friction bearing
US6740221B2 (en) 2001-03-15 2004-05-25 Applied Materials Inc. Method of forming copper interconnects
US7239747B2 (en) 2002-01-24 2007-07-03 Chatterbox Systems, Inc. Method and system for locating position in printed texts and delivering multimedia information
US7195702B2 (en) 2003-06-06 2007-03-27 Taskem, Inc. Tin alloy electroplating system
FR2864553B1 (en) * 2003-12-31 2006-09-01 Coventya INSTALLATION OF ZINC DEPOSITION OR ZINC ALLOYS
US20110226613A1 (en) 2010-03-19 2011-09-22 Robert Rash Electrolyte loop with pressure regulation for separated anode chamber of electroplating system
US9404194B2 (en) 2010-12-01 2016-08-02 Novellus Systems, Inc. Electroplating apparatus and process for wafer level packaging
US9534308B2 (en) 2012-06-05 2017-01-03 Novellus Systems, Inc. Protecting anodes from passivation in alloy plating systems
CN103849915B (en) * 2012-12-06 2016-08-31 北大方正集团有限公司 Electroplanting device and pcb board via copper coating
JP2021501268A (en) 2017-11-01 2021-01-14 ラム リサーチ コーポレーションLam Research Corporation Control of plating electrolyte concentration in electrochemical plating equipment
JP6750186B1 (en) * 2019-11-28 2020-09-02 ユケン工業株式会社 Method for suppressing increase in zinc concentration of plating solution and method for producing zinc-based plated member
RU2739899C1 (en) * 2020-07-27 2020-12-29 Алексей Игоревич Буянов Acid electrolyte for application of antifriction coating with lead-tin-copper alloy

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB577335A (en) * 1944-02-10 1946-05-14 Vandervell Products Ltd Improvements in and relating to bearings and bearing surfaces
GB628459A (en) * 1945-07-10 1949-08-30 Cleveland Graphite Bronze Co Electrodeposition of lead-antimony-tin alloys
GB679947A (en) * 1950-06-09 1952-09-24 Cleveland Graphite Bronze Co Improvements in bearings
GB741864A (en) * 1952-06-04 1955-12-14 Silvercrown Ltd Improvements in the electrodeposition of alloys containing copper and tin
FR1508573A (en) * 1967-01-18 1968-01-05 Eugene Arbez Ets Process for depositing a lead coating on solid plates, in particular with a view to their printing by stamping, as well as the plates conforming to those obtained by the present process or similar process
JPS6015716B2 (en) * 1977-10-21 1985-04-20 デイツプソ−ル株式会社 Method for stabilizing tin or tin alloy electroplating baths
US4217198A (en) * 1979-03-23 1980-08-12 Olin Corporation Coated perfluorosulfonic acid resin membranes and a method for their preparation

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4591536A (en) * 1983-10-01 1986-05-27 Glyco Metall-Werke Daelen & Hofmann KG Plain bearing and method of manufacture
US5468567A (en) * 1990-01-19 1995-11-21 Honda Giken Kogyo Kabushiki Kaisha Slide member
US5320912A (en) * 1991-05-31 1994-06-14 Honda Giken Kogyo Kabushiki Kaisha Slide member
US5322743A (en) * 1991-05-31 1994-06-21 Honda Giken Kogyo Kabushiki Kaisha Slide member
US5322742A (en) * 1991-05-31 1994-06-21 Honda Giken Kogyo Kabushiki Kaisha Slide member
US5324596A (en) * 1991-05-31 1994-06-28 Honda Giken Kogyo Kabushiki Kaisha Slide member
US5342698A (en) * 1991-06-11 1994-08-30 Honda Giken Kogyo Kabushiki Kaisha Slide bearing
US5340660A (en) * 1991-07-18 1994-08-23 Honda Giken Kogyo Kabushiki Kaisha Slide member
GB2324805A (en) * 1997-04-30 1998-11-04 Platt Electromeck Limited Electroplating
CN105350063A (en) * 2015-11-09 2016-02-24 科文特亚表面处理技术(苏州)有限公司 Electroplating-liquid-separated anode system
CN105350063B (en) * 2015-11-09 2018-10-30 科文特亚环保电镀技术(江苏)有限公司 A kind of anode system of electroplate liquid separation

Also Published As

Publication number Publication date
BR8106041A (en) 1982-06-08
ATE10862T1 (en) 1985-01-15
EP0048579B1 (en) 1984-12-19
DE3167841D1 (en) 1985-01-31
CA1172599A (en) 1984-08-14
EP0048579A1 (en) 1982-03-31

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