ATE10862T1 - PROCESS FOR ELECTROPLATING OF LEAD ALLOYS. - Google Patents

PROCESS FOR ELECTROPLATING OF LEAD ALLOYS.

Info

Publication number
ATE10862T1
ATE10862T1 AT81304194T AT81304194T ATE10862T1 AT E10862 T1 ATE10862 T1 AT E10862T1 AT 81304194 T AT81304194 T AT 81304194T AT 81304194 T AT81304194 T AT 81304194T AT E10862 T1 ATE10862 T1 AT E10862T1
Authority
AT
Austria
Prior art keywords
lead
tin
electroplating
bearing member
ternary
Prior art date
Application number
AT81304194T
Other languages
German (de)
Inventor
William John Waterman
Miachel Gordon Brook
Lita Elizabeth Jenni
Original Assignee
Gkn Vandervell Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gkn Vandervell Limited filed Critical Gkn Vandervell Limited
Application granted granted Critical
Publication of ATE10862T1 publication Critical patent/ATE10862T1/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002Cell separation, e.g. membranes, diaphragms

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Conductive Materials (AREA)
  • Manufacture And Refinement Of Metals (AREA)

Abstract

Apparatus and method for the electro-deposition of a ternary alloy on to a cathode comprises an anolyte containing chamber 14 and a catholyte containing chamber 10 in communication with one another only through the medium of a cation exchange membrane 16. The apparatus is used for depositing a ternary bearing alloy, such as lead-antimony-tin or lead-tin-copper on to the bronze substrate of a steel backed bearing member; the bearing member comprising the cathode 12. Use of the method and apparatus prevents undesirable immersion plating of the lead-containing anode 20 by metals from the plating solution which are more noble than lead.
AT81304194T 1980-09-23 1981-09-14 PROCESS FOR ELECTROPLATING OF LEAD ALLOYS. ATE10862T1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB8030638A GB2084191A (en) 1980-09-23 1980-09-23 Electro-deposition of alloys
EP81304194A EP0048579B1 (en) 1980-09-23 1981-09-14 Method for the electro-deposition of lead alloys

Publications (1)

Publication Number Publication Date
ATE10862T1 true ATE10862T1 (en) 1985-01-15

Family

ID=10516222

Family Applications (1)

Application Number Title Priority Date Filing Date
AT81304194T ATE10862T1 (en) 1980-09-23 1981-09-14 PROCESS FOR ELECTROPLATING OF LEAD ALLOYS.

Country Status (6)

Country Link
EP (1) EP0048579B1 (en)
AT (1) ATE10862T1 (en)
BR (1) BR8106041A (en)
CA (1) CA1172599A (en)
DE (1) DE3167841D1 (en)
GB (1) GB2084191A (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3335716A1 (en) * 1983-10-01 1985-05-02 Glyco-Metall-Werke Daelen & Loos Gmbh, 6200 Wiesbaden SLIDING BEARING AND METHOD FOR THE PRODUCTION THEREOF
DE3430945A1 (en) * 1984-08-22 1986-03-06 Miba Gleitlager Ag, Laakirchen Electrodeposited bearing layer for a sliding bearing
GB2240343B (en) * 1990-01-19 1993-11-17 Honda Motor Co Ltd Slide member
CA2069988C (en) * 1991-05-31 1997-03-04 Yoshikazu Fujisawa Slide member with surface composed of pyramidal microprojections
CA2070932C (en) * 1991-06-11 1995-11-07 Yoshikazu Fujisawa Slide bearing
CA2074114C (en) * 1991-07-18 1999-01-19 Yoshikazu Fujisawa Slide member
DE19606993C1 (en) * 1996-02-24 1997-04-03 Glyco Metall Werke Prodn. of layered material for friction bearing
GB2324805A (en) * 1997-04-30 1998-11-04 Platt Electromeck Limited Electroplating
US6740221B2 (en) 2001-03-15 2004-05-25 Applied Materials Inc. Method of forming copper interconnects
WO2003063067A1 (en) 2002-01-24 2003-07-31 Chatterbox Systems, Inc. Method and system for locating positions in printed texts and delivering multimedia information
US7195702B2 (en) 2003-06-06 2007-03-27 Taskem, Inc. Tin alloy electroplating system
FR2864553B1 (en) * 2003-12-31 2006-09-01 Coventya INSTALLATION OF ZINC DEPOSITION OR ZINC ALLOYS
US20110226613A1 (en) 2010-03-19 2011-09-22 Robert Rash Electrolyte loop with pressure regulation for separated anode chamber of electroplating system
US9404194B2 (en) 2010-12-01 2016-08-02 Novellus Systems, Inc. Electroplating apparatus and process for wafer level packaging
US9534308B2 (en) * 2012-06-05 2017-01-03 Novellus Systems, Inc. Protecting anodes from passivation in alloy plating systems
CN103849915B (en) * 2012-12-06 2016-08-31 北大方正集团有限公司 Electroplanting device and pcb board via copper coating
CN105350063B (en) * 2015-11-09 2018-10-30 科文特亚环保电镀技术(江苏)有限公司 A kind of anode system of electroplate liquid separation
JP2021501268A (en) 2017-11-01 2021-01-14 ラム リサーチ コーポレーションLam Research Corporation Control of plating electrolyte concentration in electrochemical plating equipment
JP6750186B1 (en) * 2019-11-28 2020-09-02 ユケン工業株式会社 Method for suppressing increase in zinc concentration of plating solution and method for producing zinc-based plated member
RU2739899C1 (en) * 2020-07-27 2020-12-29 Алексей Игоревич Буянов Acid electrolyte for application of antifriction coating with lead-tin-copper alloy

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB577335A (en) * 1944-02-10 1946-05-14 Vandervell Products Ltd Improvements in and relating to bearings and bearing surfaces
GB628459A (en) * 1945-07-10 1949-08-30 Cleveland Graphite Bronze Co Electrodeposition of lead-antimony-tin alloys
GB679947A (en) * 1950-06-09 1952-09-24 Cleveland Graphite Bronze Co Improvements in bearings
GB741864A (en) * 1952-06-04 1955-12-14 Silvercrown Ltd Improvements in the electrodeposition of alloys containing copper and tin
FR1508573A (en) * 1967-01-18 1968-01-05 Eugene Arbez Ets Process for depositing a lead coating on solid plates, in particular with a view to their printing by stamping, as well as the plates conforming to those obtained by the present process or similar process
JPS6015716B2 (en) * 1977-10-21 1985-04-20 デイツプソ−ル株式会社 Method for stabilizing tin or tin alloy electroplating baths
US4217198A (en) * 1979-03-23 1980-08-12 Olin Corporation Coated perfluorosulfonic acid resin membranes and a method for their preparation

Also Published As

Publication number Publication date
CA1172599A (en) 1984-08-14
DE3167841D1 (en) 1985-01-31
GB2084191A (en) 1982-04-07
BR8106041A (en) 1982-06-08
EP0048579B1 (en) 1984-12-19
EP0048579A1 (en) 1982-03-31

Similar Documents

Publication Publication Date Title
ATE10862T1 (en) PROCESS FOR ELECTROPLATING OF LEAD ALLOYS.
US4062737A (en) Electrodeposition of chromium
US2545566A (en) Electrodeposition of metals and alloys
US3730853A (en) Electroplating bath for depositing tin-lead alloy plates
EP1292724A4 (en) Zinc-nickel electroplating
ATE6527T1 (en) GALVANIC BATH FOR DEPOSITION OF GOLD AND GOLD ALLOY COATINGS.
US3920526A (en) Process for the electrodeposition of ductile palladium and electroplating bath useful therefor
US4478692A (en) Electrodeposition of palladium-silver alloys
US4053372A (en) Tin-lead acidic plating bath
US3249520A (en) Process of providing an electrolytic deposit on a face of a workpiece
US4465563A (en) Electrodeposition of palladium-silver alloys
US3729396A (en) Rhodium plating composition and method for plating rhodium
US4155817A (en) Low free cyanide high purity silver electroplating bath and method
US4297179A (en) Palladium electroplating bath and process
US3775267A (en) Electrodeposition of rhodium
ES306840A1 (en) Electrodeposition of lead and polytetrafluoroethylene
SU603709A1 (en) Silver-plating electrolyte
Waterman et al. Electrodeposition of Alloys
DE3262272D1 (en) Process for the galvanic deposit of a zinc-nickel-alloy layer on a metal object, in particular on steel strip
DE59107541D1 (en) Method and device for the electrolytic discharge of metals from a solution containing metal ions and electrode for carrying out the method
US4197172A (en) Gold plating composition and method
US2439935A (en) Indium electroplating
CA1132939A (en) Rhodium plating
Birkle et al. Electrodeposited Aluminum Using the Sigal Process
ATE136066T1 (en) ELECTROLYTIC PROCESS FOR OBTAINING HIGH PURITY PLATINUM FROM CONTAMINATED PLATINUM

Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
EEIH Change in the person of patent owner
EELA Cancelled due to lapse of time