GB2083064B - Radiation polymerizable composition for forming heat-resistant relief structures on electrical devices such as semiconductors and capacitors - Google Patents

Radiation polymerizable composition for forming heat-resistant relief structures on electrical devices such as semiconductors and capacitors

Info

Publication number
GB2083064B
GB2083064B GB8126576A GB8126576A GB2083064B GB 2083064 B GB2083064 B GB 2083064B GB 8126576 A GB8126576 A GB 8126576A GB 8126576 A GB8126576 A GB 8126576A GB 2083064 B GB2083064 B GB 2083064B
Authority
GB
United Kingdom
Prior art keywords
semiconductors
capacitors
polymerizable composition
electrical devices
relief structures
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8126576A
Other languages
English (en)
Other versions
GB2083064A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of GB2083064A publication Critical patent/GB2083064A/en
Application granted granted Critical
Publication of GB2083064B publication Critical patent/GB2083064B/en
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
    • G03C5/00—Photographic processes or agents therefor; Regeneration of such processing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C08F290/145—Polyamides; Polyesteramides; Polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymerisation Methods In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Paints Or Removers (AREA)
  • Graft Or Block Polymers (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Organic Insulating Materials (AREA)
  • Materials For Photolithography (AREA)
  • Formation Of Insulating Films (AREA)
GB8126576A 1980-09-03 1981-09-02 Radiation polymerizable composition for forming heat-resistant relief structures on electrical devices such as semiconductors and capacitors Expired GB2083064B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/183,648 US4329419A (en) 1980-09-03 1980-09-03 Polymeric heat resistant photopolymerizable composition for semiconductors and capacitors

Publications (2)

Publication Number Publication Date
GB2083064A GB2083064A (en) 1982-03-17
GB2083064B true GB2083064B (en) 1984-08-15

Family

ID=22673724

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8126576A Expired GB2083064B (en) 1980-09-03 1981-09-02 Radiation polymerizable composition for forming heat-resistant relief structures on electrical devices such as semiconductors and capacitors

Country Status (14)

Country Link
US (1) US4329419A (cg-RX-API-DMAC7.html)
EP (1) EP0047184B1 (cg-RX-API-DMAC7.html)
JP (2) JPS5776017A (cg-RX-API-DMAC7.html)
KR (1) KR900006352B1 (cg-RX-API-DMAC7.html)
AU (1) AU543702B2 (cg-RX-API-DMAC7.html)
CA (1) CA1165932A (cg-RX-API-DMAC7.html)
DE (1) DE3168153D1 (cg-RX-API-DMAC7.html)
ES (1) ES505185A0 (cg-RX-API-DMAC7.html)
GB (1) GB2083064B (cg-RX-API-DMAC7.html)
HK (1) HK69085A (cg-RX-API-DMAC7.html)
IE (1) IE51582B1 (cg-RX-API-DMAC7.html)
IL (1) IL63717A0 (cg-RX-API-DMAC7.html)
MY (1) MY8600180A (cg-RX-API-DMAC7.html)
SG (1) SG70685G (cg-RX-API-DMAC7.html)

Families Citing this family (42)

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US4414312A (en) * 1980-09-03 1983-11-08 E. I. Du Pont De Nemours & Co. Photopolymerizable polyamide ester resin compositions containing an oxygen scavenger
US4518473A (en) * 1981-08-06 1985-05-21 The Upjohn Company Compositions and process
CA1195039A (en) * 1982-01-04 1985-10-08 David L. Goff Radiation-sensitive polyimide precursor composition derived from a diaryl fluoro compound
JPS58223149A (ja) * 1982-06-22 1983-12-24 Toray Ind Inc 感光性ポリイミド用現像液
DE3227584A1 (de) * 1982-07-23 1984-01-26 Merck Patent Gmbh, 6100 Darmstadt Fotolacke
DE3233912A1 (de) * 1982-09-13 1984-03-15 Merck Patent Gmbh, 6100 Darmstadt Fotolacke zur ausbildung von reliefstrukturen aus hochwaermebestaendigen polymeren
GB8321379D0 (en) * 1982-10-22 1983-09-07 Ciba Geigy Ag Positive image formation
JPS5978339A (ja) * 1982-10-28 1984-05-07 Fuji Photo Film Co Ltd 光重合性組成物
EP0110285A3 (en) * 1982-11-27 1985-11-21 Prutec Limited Interconnection of integrated circuits
US4548891A (en) * 1983-02-11 1985-10-22 Ciba Geigy Corporation Photopolymerizable compositions containing prepolymers with olefin double bonds and titanium metallocene photoinitiators
EP0131992B1 (en) * 1983-07-01 1988-03-02 Koninklijke Philips Electronics N.V. Photosensitive polyamic acid derivative, method of manufacturing polyimide pattern on a substrate, and semiconductor device comprising a polyimide pattern obtained by using the said method
DE3342851A1 (de) * 1983-11-26 1985-06-05 Merck Patent Gmbh, 6100 Darmstadt Fotolacke
US4842893A (en) * 1983-12-19 1989-06-27 Spectrum Control, Inc. High speed process for coating substrates
US5032461A (en) * 1983-12-19 1991-07-16 Spectrum Control, Inc. Method of making a multi-layered article
US5097800A (en) * 1983-12-19 1992-03-24 Spectrum Control, Inc. High speed apparatus for forming capacitors
US4499520A (en) * 1983-12-19 1985-02-12 General Electric Company Capacitor with dielectric comprising poly-functional acrylate polymer and method of making
US5018048A (en) * 1983-12-19 1991-05-21 Spectrum Control, Inc. Miniaturized monolithic multi-layer capacitor and apparatus and method for making
US4513349A (en) * 1983-12-19 1985-04-23 General Electric Company Acrylate-containing mixed ester monomers and polymers thereof useful as capacitor dielectrics
US4490774A (en) * 1983-12-19 1984-12-25 General Electric Company Capacitors containing polyfunctional acrylate polymers as dielectrics
DE3485857T2 (de) * 1983-12-19 1992-12-10 Spectrum Control Inc Kondensator mit mehrfunktionelles acrylatpolymer enthaltendem dielektrikum und herstellungsverfahren.
US5125138A (en) * 1983-12-19 1992-06-30 Spectrum Control, Inc. Miniaturized monolithic multi-layer capacitor and apparatus and method for making same
US4568601A (en) * 1984-10-19 1986-02-04 International Business Machines Corporation Use of radiation sensitive polymerizable oligomers to produce polyimide negative resists and planarized dielectric components for semiconductor structures
EP0188205B1 (de) * 1985-01-15 1988-06-22 Ciba-Geigy Ag Polyamidester-Fotoresist-Formulierungen gesteigerter Empfindlichkeit
US4612210A (en) * 1985-07-25 1986-09-16 International Business Machines Corporation Process for planarizing a substrate
NL8601041A (nl) * 1986-04-23 1987-11-16 Philips Nv Werkwijze voor het vervaardigen van een inrichting en inrichting vervaardigd met de werkwijze.
US4943471A (en) * 1986-05-20 1990-07-24 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha Patterned thin film and process for preparing the same
JPH0770527B2 (ja) * 1987-02-27 1995-07-31 アメリカン テレフォン アンド テレグラフ カムパニー デバイス作製方法
DE3717933A1 (de) * 1987-05-27 1988-12-08 Hoechst Ag Photopolymerisierbares gemisch, dieses enthaltendes aufzeichnungsmaterial und verfahren zur herstellung von hochwaermebestaendigen reliefstrukturen
JPS6461746A (en) * 1987-09-02 1989-03-08 Hitachi Ltd Heat-resisting photosensitive polymer composition
CA1303281C (en) * 1987-09-25 1992-06-09 Masakazu Uekita Patterned thin film and process for preparing the same
DE3808927A1 (de) * 1988-03-17 1989-10-05 Ciba Geigy Ag Negativ-fotoresists von polyimid-typ mit 1,2-disulfonen
US4908096A (en) * 1988-06-24 1990-03-13 Allied-Signal Inc. Photodefinable interlevel dielectrics
US4987160A (en) * 1989-01-31 1991-01-22 Union Camp Corporation Radiation-curable aminoamide acrylate polymer
US5155177A (en) * 1991-03-18 1992-10-13 Union Camp Corporation Three component aminoamide acrylate resin compositions
JP2546940B2 (ja) * 1991-11-06 1996-10-23 住友ベークライト株式会社 感光性樹脂組成物
US6099783A (en) * 1995-06-06 2000-08-08 Board Of Trustees Operating Michigan State University Photopolymerizable compositions for encapsulating microelectronic devices
US5786086A (en) * 1996-01-02 1998-07-28 Union Camp Corporation Conductive wire coating
US7208260B2 (en) 1998-12-31 2007-04-24 Hynix Semiconductor Inc. Cross-linking monomers for photoresist, and process for preparing photoresist polymers using the same
KR100362937B1 (ko) * 1998-12-31 2003-10-04 주식회사 하이닉스반도체 신규의포토레지스트가교제,이를포함하는포토레지스트중합체및포토레지스트조성물
JP2007527804A (ja) * 2004-02-19 2007-10-04 スティッチング ダッチ ポリマー インスティテュート ポリマーレリーフ構造体の作製方法
WO2006085741A1 (en) * 2005-02-09 2006-08-17 Stichting Dutch Polymer Institute Process for preparing a polymeric relief structure
WO2015141618A1 (ja) * 2014-03-17 2015-09-24 旭化成イーマテリアルズ株式会社 感光性樹脂組成物、硬化レリーフパターンの製造方法、並びに半導体装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE635804A (cg-RX-API-DMAC7.html) * 1962-03-21
US3380831A (en) * 1964-05-26 1968-04-30 Du Pont Photopolymerizable compositions and elements
US3479185A (en) * 1965-06-03 1969-11-18 Du Pont Photopolymerizable compositions and layers containing 2,4,5-triphenylimidazoyl dimers
US3552973A (en) * 1967-07-20 1971-01-05 Du Pont Light sensitive hexaarylbiimidazole/p- aminophenyl ketone compositions
US3623870A (en) * 1969-07-22 1971-11-30 Bell Telephone Labor Inc Technique for the preparation of thermally stable photoresist
DE2326314C2 (de) * 1973-05-23 1983-10-27 Siemens AG, 1000 Berlin und 8000 München Verfahren zur Herstellung von Reliefstrukturen
NL177718C (nl) * 1973-02-22 1985-11-01 Siemens Ag Werkwijze ter vervaardiging van reliefstructuren uit warmte-bestendige polymeren.
US3897395A (en) * 1973-05-25 1975-07-29 Univ Notre Dame Du Lac Process for chain-extending unsaturated terminated polyimides and products prepared therefrom
DE2437348B2 (de) * 1974-08-02 1976-10-07 Ausscheidung in: 24 62 105 Verfahren zur herstellung von reliefstrukturen
CH615935A5 (cg-RX-API-DMAC7.html) * 1975-06-19 1980-02-29 Ciba Geigy Ag
US4093461A (en) * 1975-07-18 1978-06-06 Gaf Corporation Positive working thermally stable photoresist composition, article and method of using
US4188224A (en) * 1976-02-23 1980-02-12 Ciba-Geigy Corporation Photopolymerizable composition containing anthrones
US4132812A (en) * 1977-09-02 1979-01-02 W. R. Grace & Co. Photocurable imidizable polyene-polythiol compositions
US4080484A (en) * 1976-12-23 1978-03-21 W. R. Grace & Co. Photocurable imidizable polyene-polythiol compositions, method of coating therewith and coated articles
JPS5545748A (en) * 1978-09-29 1980-03-31 Hitachi Ltd Photosensitive polymer and its production

Also Published As

Publication number Publication date
KR830007762A (ko) 1983-11-07
CA1165932A (en) 1984-04-17
JPH02210712A (ja) 1990-08-22
EP0047184A2 (en) 1982-03-10
DE3168153D1 (en) 1985-02-21
EP0047184A3 (en) 1982-07-21
ES8303486A1 (es) 1983-02-01
AU543702B2 (en) 1985-04-26
IL63717A0 (en) 1981-12-31
SG70685G (en) 1986-05-02
IE51582B1 (en) 1987-01-21
AU7482281A (en) 1982-03-11
EP0047184B1 (en) 1985-01-09
JPS5776017A (en) 1982-05-12
HK69085A (en) 1985-09-20
JPH0233723B2 (cg-RX-API-DMAC7.html) 1990-07-30
ES505185A0 (es) 1983-02-01
GB2083064A (en) 1982-03-17
US4329419A (en) 1982-05-11
MY8600180A (en) 1986-12-31
KR900006352B1 (ko) 1990-08-28
IE812006L (en) 1982-03-03

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Legal Events

Date Code Title Description
PE20 Patent expired after termination of 20 years

Effective date: 20010901