GB2047971A - Printed circuit fabrication - Google Patents

Printed circuit fabrication Download PDF

Info

Publication number
GB2047971A
GB2047971A GB8012699A GB8012699A GB2047971A GB 2047971 A GB2047971 A GB 2047971A GB 8012699 A GB8012699 A GB 8012699A GB 8012699 A GB8012699 A GB 8012699A GB 2047971 A GB2047971 A GB 2047971A
Authority
GB
United Kingdom
Prior art keywords
conductive sheet
support
sheet
adhesive
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB8012699A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CASTANET R
Original Assignee
CASTANET R
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CASTANET R filed Critical CASTANET R
Publication of GB2047971A publication Critical patent/GB2047971A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/043—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a moving tool for milling or cutting the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1028—Thin metal strips as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Insulating Bodies (AREA)
GB8012699A 1979-04-23 1980-04-17 Printed circuit fabrication Withdrawn GB2047971A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7911179A FR2455422A1 (fr) 1979-04-23 1979-04-23 Dispositif pour l'obtention de circuits imprimes

Publications (1)

Publication Number Publication Date
GB2047971A true GB2047971A (en) 1980-12-03

Family

ID=9224975

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8012699A Withdrawn GB2047971A (en) 1979-04-23 1980-04-17 Printed circuit fabrication

Country Status (3)

Country Link
DE (1) DE3015100A1 (de)
FR (1) FR2455422A1 (de)
GB (1) GB2047971A (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111096089A (zh) * 2017-07-13 2020-05-01 塞林克公司 互连电路方法和器件
FR3101748A1 (fr) * 2019-10-07 2021-04-09 Centiloc Procédé de fabrication d’un circuit imprimé et circuit imprimé
US12035459B2 (en) 2023-11-28 2024-07-09 Cellink Corporation Methods of forming flexible interconnect circuits

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0312631A1 (de) * 1987-10-21 1989-04-26 PRESSKONTAKT Ing. grad. Hartmuth Thaler KG Verfahren zur Herstellung elektrischer Verbindungen zwischen flachen elektrischen Leiterbahnen und danach hergestellte Leiterplatten
DE19809193A1 (de) * 1998-03-04 1999-09-23 Hannes Riebl Verfahren zur Herstellung einer Leiterbahnstruktur sowie damit hergestellte Flachtastatur
DE102017123291A1 (de) * 2017-10-06 2019-04-11 Eppsteinfoils Gmbh & Co.Kg Selbstklebende Folie und Verfahren zu deren Herstellung

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1589885A1 (de) * 1967-03-01 1970-10-22 Holtz Hermann Magnetisch haftende bzw. der magnetischen Haftung dienende Folie
FR2153383A1 (de) * 1971-09-22 1973-05-04 Dodge Ind Inc
FR2217906B3 (de) * 1973-02-15 1976-02-13 Radiall Fr
DE2334585A1 (de) * 1973-07-07 1975-03-13 Reulein Fa Georg Schaltplatte

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111096089A (zh) * 2017-07-13 2020-05-01 塞林克公司 互连电路方法和器件
EP3653027A4 (de) * 2017-07-13 2021-04-28 CelLink Corporation Verbindungsschaltungsverfahren und -vorrichtungen
CN111096089B (zh) * 2017-07-13 2023-11-17 塞林克公司 互连电路方法和器件
US11979976B2 (en) 2017-07-13 2024-05-07 Cellink Corporation Methods of forming interconnect circuits
FR3101748A1 (fr) * 2019-10-07 2021-04-09 Centiloc Procédé de fabrication d’un circuit imprimé et circuit imprimé
US12035459B2 (en) 2023-11-28 2024-07-09 Cellink Corporation Methods of forming flexible interconnect circuits

Also Published As

Publication number Publication date
DE3015100A1 (de) 1980-11-13
FR2455422B1 (de) 1983-11-10
FR2455422A1 (fr) 1980-11-21

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)