GB2047596A - Method of wire-bonding and wire-bonder - Google Patents

Method of wire-bonding and wire-bonder Download PDF

Info

Publication number
GB2047596A
GB2047596A GB8013084A GB8013084A GB2047596A GB 2047596 A GB2047596 A GB 2047596A GB 8013084 A GB8013084 A GB 8013084A GB 8013084 A GB8013084 A GB 8013084A GB 2047596 A GB2047596 A GB 2047596A
Authority
GB
United Kingdom
Prior art keywords
bonding
wire
tool
distance
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB8013084A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of GB2047596A publication Critical patent/GB2047596A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
GB8013084A 1979-04-23 1980-04-21 Method of wire-bonding and wire-bonder Withdrawn GB2047596A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4902779A JPS55141736A (en) 1979-04-23 1979-04-23 Method for wirebonding and wirebonder

Publications (1)

Publication Number Publication Date
GB2047596A true GB2047596A (en) 1980-12-03

Family

ID=12819608

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8013084A Withdrawn GB2047596A (en) 1979-04-23 1980-04-21 Method of wire-bonding and wire-bonder

Country Status (3)

Country Link
JP (1) JPS55141736A (cg-RX-API-DMAC10.html)
DE (1) DE3015683A1 (cg-RX-API-DMAC10.html)
GB (1) GB2047596A (cg-RX-API-DMAC10.html)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2125720A (en) * 1982-08-24 1984-03-14 Asm Assembly Automation Ltd Wire bonding apparatus
US4603803A (en) * 1982-08-24 1986-08-05 Asm Assembly Automation, Ltd. Wire bonding apparatus
WO1987006864A3 (en) * 1986-05-16 1988-02-25 Farassat Farhad Device for manual wire bonding
EP0390036A1 (en) * 1989-03-27 1990-10-03 Kabushiki Kaisha Toshiba Motor-driving circuit and wire-bonding apparatus
US12308340B2 (en) * 2020-11-26 2025-05-20 Mb Automation Gmbh & Co. Kg Thermocompression apparatus and method for bonding electrical components to a substrate

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2549191B2 (ja) * 1990-09-10 1996-10-30 株式会社日立製作所 ワイヤボンディング方法、およびその装置
US5443200A (en) * 1993-10-13 1995-08-22 Matsushita Electric Industrial Co., Ltd. Bonding apparatus and bonding method

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2125720A (en) * 1982-08-24 1984-03-14 Asm Assembly Automation Ltd Wire bonding apparatus
US4603803A (en) * 1982-08-24 1986-08-05 Asm Assembly Automation, Ltd. Wire bonding apparatus
WO1987006864A3 (en) * 1986-05-16 1988-02-25 Farassat Farhad Device for manual wire bonding
US4878609A (en) * 1986-05-16 1989-11-07 Emhart Industries Inc. Apparatus for manual wire bonding
EP0390036A1 (en) * 1989-03-27 1990-10-03 Kabushiki Kaisha Toshiba Motor-driving circuit and wire-bonding apparatus
US5080276A (en) * 1989-03-27 1992-01-14 Kabushiki Kaisha Toshiba Motor-driving circuit and wire-bonding apparatus
US5317242A (en) * 1989-03-27 1994-05-31 Kabushiki Kaisha Toshiba Motor-driving circuit and wire-bonding apparatus
US12308340B2 (en) * 2020-11-26 2025-05-20 Mb Automation Gmbh & Co. Kg Thermocompression apparatus and method for bonding electrical components to a substrate

Also Published As

Publication number Publication date
DE3015683A1 (de) 1980-11-13
JPS55141736A (en) 1980-11-05
JPS6341215B2 (cg-RX-API-DMAC10.html) 1988-08-16

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)