GB2038079A - A semiconductor laser - Google Patents

Abstract

In a double heterostructure semiconductor laser comprising an active layer 33 epitaxially formed on a semiconductor substrate 31 and at least a current limiting layer 36 which defines a current injection region or a stripe shape, the substrate has a terrace step T on its principal face, and the active layer has two parallel bent parts defining an inclined stripe shaped active lasing region facing the current injection region. <IMAGE>

Description

SPECIFICATION A semiconductor laser The present invention relates to a semiconductor laser and a method of making the same. It may be made by the epitaxial growth method.

Hitherto various proposals for special configurations and methods of making have been made concerning semiconductor lasers for stable fundamental transverse mode operation.

In general, a fundamental transverse mode operation can be obtained by making the width of a stripe shaped active region narrow thereby confining only a lowest mode light in the narrow stripe shaped active region.

A typical example of a known laser with a fundamental transverse mode operation has a buried stripe layer structure as shown in Fig.

1. Such a conventional laser according to Fig.

1 may be made as follows: Firstly, the following layers are subsequently formed by a known epitaxial growth method on a substrate 1 of n±GaAs: a first clad layer 2 of n-Ga, xAlxAs, an active layer 5 of n-GaAs, a second clad layer 4 of p-Ga1 xAlxAs and an electrode contacting layer 5 of p±GaAs.

Secondly, an SiO2 film (not shown) is formed on all the face of the electrode contacting layer 5, then the SiO2 film is etched by a known photo-etching method retaining a stripe shape part, and then by utilizing the stripe shape SiO2 film as an etching mask, the abovementioned epitaxial growth layers 2 to 5 are mesa-etched to form a stripe shaped part.

Thirdly, into the mesa-etched spaces on both sides of the stripe shaped part are formed filled-in layers 6,6 having a high specific resistance and wider energy gap than those of layers 2 to 5 of the stripe shape part.

Then, on the electrode contacting layer 5 and the filled-in layers 6,6 is formed an ohmic electrode 7, and another ohmic electrode 7 is formed on the bottom face of the substrate 1.

The abovementioned conventional laser of Fig. 1 has the following shortcomings.

A first shortcoming is that there is a possibility of contamination and/or oxidation of side faces of the stripe part during the time between the step of mesa-etching to form the stripe part and the subsequent step of forming filled-in layers 6,6. Especially, since the side faces of the active layer 3 serves as side faces of a cavity of laser, such contamination and/or oxidation of the side faces of the stripe part is likely to form dark spots and causes a deterioration of the laser.

A second shortcoming is that, since the SiCo2 film is retained on the stripe part during a high temperature processing step for the forming of the filled-in layers 6, a difference of thermal coefficient between the SiO2 film and the p±GaAs layer 5 produces a stress in the active layer 3. This may be a cause of deterioration.

A third shortcoming is that an impurity such as Fe or Cr, contained in the filled-in layers 6,6 for giving the layer a deep energy level, is likely to diffuse into the side faces of the active layer 3, thereby adversely affecting the characteristics of the laser.

A fourth shortcoming is poor heat radiation due to the fact that the high resistivity layer 6 has poor heat conductivity.

Recently, some improvements have been proposed in order to eliminate the abovementioned shortcomings of the Fig. 1 type of semiconductor laser. One example of a proposed improved structure is known and is shown in Fig. 2. The device of Fig. 2 is made as follows: Firstly, the following layers are sequentially formed by an epitaxial growth method on a substrate 8 of n±GaAs: a specially shaped first clad layer 9 of n-Ga,~,AI,As, an active layer 10 of n-GaAs, a second clad layer 11 of p-Ga,~,AI,As, and an electrode contacting layer 1 2 of p±GaAs.

The shape of the first clad layer 9 shown in Fig. 2. It has a stripe shaped thicker part 9' at the central part and thinner parts 9" on both sides of the thicker part 9'.

Secondly, an SiO2 film 1 3 is formed all over the surface of the electrode contacting layer 12, and then the SiO2 film 1 3 is etched by a known photo-etching method to form a stripe shape opening 13' over the position on the stripe shape thicker part 9', thereby exposing a stripe shape part of the surface of the electrode contacting layer 1 2.

Thirdly, an ohmic electrode 14 is formed on the face of the SiO2 film 1 3 and on the exposed surface of the electrode contacting layer 12.

The conventional laser of Fig. 2 can operate a fundamental mode lasing in the part of the active layer 10 which is on the thicker part 9', since light leaking from the side parts of the active layer 10 passes through the thinner parts 9" and are absorbed in the substrate 8.

However, the abovementioned conventional laser of Fig. 2 has the shortcoming that the active region is flat, and hence, the light lased at the central part of the active layer 10 is likely to diverge in a horizontal direction.

Therefore, the lasing mode is distorted widthwise. Furthermore, the device of Fig. 2 has a poor heat radiation since the SiO2 film 1 3 is inserted between the electrode contacting layer 1 2 and the ohmic electrode 14.

Fig. 3 shows another laser device. The device of Fig. 3 has a rib shape active layer 1 7 having a stripe pattern thicker part 1 71 at the central part and thinner parts 17' on both sides thereof. The conventional semiconductor laser with rib shape active layer 1 7 is made as follows: Firstly, the following layers are subsequently formed by an epitaxial growth method on a substrate 1 5 of n + -GaAs: a first clad layer 16 of n-Ga, xAlxAs, and an active layer 1 7 of non-doped GaAs.

Secondly, the thinner parts 1 7', 1 7' are formed by slightly etching the active layer 1 7 by utilizing a stripe shape mask of known material, thereby forming the rib shape active layer 17.

Thirdly, again by the epitaxial growth method, the following layers are subsequently formed on the rib shape active layer 17: a second clad layer 1 8 of p-GaX xAIxAs, an an electrode contacting layer 19 of p±GaAs.

Fourthly, an SiO2 film 20 is formed over all the face of the electrode contacting layer 19, and the, the SiO2 film 20 is etched by a known photo-etching method to form a strip shape opening 201 over the position on the stripe shape thicker part 1 71, thereby exposing a stripe shape part of the surface of the electrode contacting layer 1 9.

Fifthly, an ohmic electrode 21 is formed on the face of the SiO2 film 10 and on the exposed surface o the electrode contacting layer 19.

The conventional laser of Fig. 3 has the advantage that by means of partly thickened active layer 17, the thicker part 1 71 and the thinner parts 17',17' has different values of effective refractive index. Therefore, the lased light can be effectively confined in the thicker part 171, and therefore, a stable transverse mode lasing is possible.

However, the conventional laser of Fig. 3 has the shortcomings that, since the etching of the active layer 1 7 is made to form the thinner parts 1 7', 1 7', two sequences of epitaxial growth and a delicate control of the etching process are necessary, and further that there is a considerable danger of introducing a number of non-radiative centres at the interface between the surface of the active layer 1 7 and the second clad layer 1 8 during exposing and etching the active layer 1 7.

The present invention provides a semiconductor laser comprising an active layer epitaxially formed on a semiconductor substrate and at least a current limiting layer which defines a current injection region of a narrow thin shape herein called a stripe shape, in which the active layer has two parallel bent parts defining a stripe shape active region facing said current injection region.

The invention will be better understood from the following non-limiting description of examples thereof given with reference to the accompanying drawings in which: Figure 1, Figure 2 and Figure 3 are, as stated, schematic vertical sectional views of three known stripe type semiconductor lasers.

Figure 4(a), Figure 4(b), Figure 4(c) and Figure 4(d) are schematic sectional views of steps in the making of a first example of a semiconductor laser in accordance with the present invention.

Figure 5tea), Figure 5(b), Figure 5(c) and Figure 5(d) are schematic sectional views of steps in the making of a second example of a semiconductor laser in accordance with the present invention.

Figure 6(a), Figure 6(b), Figure 6(c), Figure 6(d) and Figure 6(e) are schematic sectional views of steps in the making of a third example of a semiconductor laser in accordance with the present invention.

Figure 7(a) Figure 7(b), Figure 7tic), Figure 7(d), and Figure 7toe) are schematic sectional views of steps in the making of a fourth example of a semiconductor laser in accordance with the present invention Figure 8(a), Figure 8(b) and Figure 8(c) are schematic sectional views of steps in the making of a fifth example of a semiconductor laser in accordance with the present invention.

Figure 9(a), Figure 9(b), and Figure 9(c) are schematic sectional views of steps in the making of a sixth example of a semiconductor laser in accordance with the present invention.

Figure 10 is a graph showing far field intensity distributions.

Figure 11 (a) and Figure 11 (b) are graphs of relationships between injection current and output power intensity, respectively for DC operation and pulsed current operation.

Figure 12 is a front view photograph of the laser in operation of Fig. 9.

EXAMPLE 1: Example 1 shown in Fig. 4 is elucidated hereafter: Firstly, a terrace 311 is formed on a principal face of a substrate 31 of a n-type conductivity by, or example, etching a half part of the principal face to form a step T, as shown in Fig. 4(a).

Secondly, as shown in Fig. 4(b), the following layers are formed in sequence by epitaxial growing: on the substrate 31 of n±type conductivity: a thin first clad layer 32 of n-type conductivity, an active layer 33 of non-doping, a second clad layer 34 of p-type conductivity, and an electrode contacting layer 35 of p + -type conductivity.

In the abovementioned sequential epitaxial growths, a thick part 321 is formed at the foot of the step T in the first clad layer 32.

Thirdly, an insulating film 36 as current limiting layer is formed on all the face of the electrode contacting layer 35, and then, the insulating film 36 is etched so as to the expose a stripe shape part of the surface of the electrode contacting layer 35, by known photo-etching method, thus forming a stripe shape current injecting opening 361 over the thick part 321, as shown in Fig. 4(c). The width of the stripe shape current injecting opening 361 is preferably under 10ym in order to desirably limit the dispersion of the current.

Fourthly, after diffusing an impurity, such as zinc, for ohmic contact onto the exposed surface of the electrode contacting layer 35 through the opening 361, an ohmic contact electrode 37 is formed on the exposed surface of the electrode contacting layer 35 as well as on the surface of the insulating film 36. And, another ohmic contact electrode 38 is formed on the bottom face of the n±type substrate 31, as shown in Fig. 4(d).

For the semiconductor substances of the abovementioned example, for example, the followings can be used: (1) Ga, yAlyAs for the active layer and Ga, xAixAs for the clad layers (O < y < x < 1).

(2) InGaAsP for the active layer and InP for the clad layers.

(3) GalnAs for the active layer and GalnP for the clad layers.

(4) GaAIAsSb or the active layer and GaAIAs for the clad layers.

The device made by the abovementioned method has a structural feature that the first clad layer 32 has a thicker part 321 at the foot of the terrace and thinner parts 322,322 in other part than the thicker part 321. Therefore, through the thinner parts 322,322 the substrate 31 absorbs lights of the offcenter parts of the active layer 33. Furthermore, the first clad layer 32 forms a bent face consisting of an upper horizontal part, a lower horizontal part and a narrow stripe shaped oblique part inbetween. Accordingly, the thin active layer 33 formed on the bent face of the first clad layer 32 has a similar bent configuration, and hence two bent parts on both sides of its stripe shape oblique part. Such bent parts on both parts of the oblique part of the active layer 33 serves to confine light in the oblique part, thereby producing a stable fundamental mode lasing.

The laser of the example of Fig. 4(d) does not have the abovementioned shortcomings of the conventional lasers of Fig. 1 to Fig. 3.

And furthermore, the laser of the example of Fig. 4(d) has a higher stability of lasing mode, and also has simpler manufacturing process than the conventional laser, since the epitaxial growth process can be made in one sequence.

An example of making a laser of Fig. 4(d) where the active layer is of GaAs and the clad layers are of Ga, XAixAs is as follows: Firstly, on a principal face of a (100) plane of an n±GaAs substrate 31, a terrace is formed by selective chemical etching in a manner that the vertical plane of the step T of about 1ym of the terrace is vertical to a (110) plane, i.e., a cleavage plane, thereby forming the substrate of Fig. 4(a).

Secondly, on the substrate 31, the following layers are formed as shown in Fig. 4(b), by a sequential liquid phase epitaxial growth of starting temperature of 850"C and cooling rate of O.5'C/minute, a first clad layer 32 of 0.2,cm thick n-Ga, AIxAs by a growth period of 20 seconds, a non doped active layer 33 of 0.11lm thick GaAs by a growth period of 1 second, a second clad layer 34 of 1 .5m thick p-Ga, xAlxAs by a growth period of 1.5 minutes, and an electrode contacting layer 35 of iijm thick p-GaAs by a growth period of 1.5 minutes.

Thirdly, a 3000A thick 5i3N4 film 36 is formed on the electrode contacting layer 35 by a known method, and stripe shaped opening 361 of 5lim width is formed over an oblique part of the active layer 33 formed over the foot part of the step T, as shown in Fig. 4(c).

Fourthly, after diffusing zinc onto the exposed surface of the electrode contacting layer 35 through the opening 361, an ohmic contact electrode 37 is formed by sequential sputtering of Ti and Pt followed by vacuum deposition of Au. Also, after lapping and subsequent chemical etching of the bottom face of the substrate 31 to control thickness of the substrate, another ohmic contact electrode 38 is formed on the bottom face of the substrate 31 by vacuum deposition of a known alloy of Au-Ge-Ni, thus making the device shown in Fig. 4(d).

A number of lasers made continuously in lines and rows in a wafer are then divided into individual pieces, and the electrode 37 is heat-bonded to a heat sink and gold wire is bonded to the electrode 38.

The GaAs-Ga1 xAlxAs semiconductor laser manufactured by the abovementioned process performs a satisfactory operation of stable continuous lasing of fundamental mode at room temperature.

EXAMPLE 2: Example 2 shown in Fig. 5 is elucidated hereafter: Firstly, a terrace 311 is formed on a principlae face of a substrate 31 of a n-type conductivity by, for example, etching a half part of the principal face to form a step T, as shown in Fig. 5(a).

Secondly, as shown in Fig. 5(b), the following layers are formed in sequence by liquid phase epitaxial growing: on the substrate 31 of n±type conductivity: a thin first clad layer 32 of n-type conductivity, an active layer 33 of non-doping, a second clad layer 34 of p-type conductivity, an electrode contacting layer 35 of p±type conductivity, and a current limiting layer 46 of a n-type conductivity and capable of selective etching.

In the abovementioned sequential epitaxial growths, a thick part 321 is formed at the foot of the step T in the first clad layer 32.

Also, though not shown in the drawing, the active layer 33 becomes thicker on the thick part 321 than on other parts of the first clad layer 32.

Thirdly, an etching mask (not shown) is formed on the face of the current limiting layer 46, and then, a stripe shape opening 461 is formed in the etching mask so as to expose a stripe shape part of the surface of the current limiting layer 46 by known photoetching method. Then by etching the exposed stripe shaped surface of the current limiting layer 46 by utilizing the etching mask, the opening 461 is formed over the thick part 321, as shown in Fig. 5(c). The width of the stripe shape current injection opening 461 is preferably under 1 10ym in order to desirably limit the dispersion of the current.

Fourthly, after diffusing an impurity, such as zinc for ohmic contact onto the exposed surface of the electrode contacting layer 35 through the openings of the etching mask and of the current limiting layer 461, an ohmic contact electrode 37 is formed on the exposed surface of the electrode contacting layer 35, as well as on the surface of the current limiting layer 46, and, another ohmic contact electrode 38 is formed on the bottom face of the N±type substrate, as shown in Fig. 5(d).

For the semiconductor substances of the abovementioned example, for example, the following can be used: (1) Ga, yAlyAs for the active layer and Ga1 XAixAs for the clad layers (O < y < x < 1).

(3) InGaAsP for the active layer and InP for the clad layers.

(3) GalnAs for the active layer and GalnP for the clad layers.

(4) GaAIAsSb for the active layer and GaAIAs for the clad layers.

The device made by the abovementioned method has a structural feature that the first clad layer 32 has a thicker part 321 at the foot of the terrace and thinner parts 322,322 in other part than the thicker part 321. Therefore, through the thinner parts 322,322 the substrate 31 absorbs lights of the off-center parts of the active layer 33. Furthermore, the first clad layer 32 forms a bent face consisting of an upper horizontal part, a lower horizontal part and a narrow stripe shaped oblique part inbetween. Accordingly, the thin active layer 33 formed on the bent face of the first clad layer 32 has a similar bent configuration, and hence two bent parts on both sides of its stripe shape oblique parts. Such bent parts on both parts of the oblique part of the active layer 33 serves to confine light in the oblique part, thereby producing a stable fundamental mode lasing.

The laser of the example of Fig. 5(d) does not have the abovementioned shortcomings of the conventional lasers of Fig. 1 to Fig. 3.

The laser of the example of Fig. 5(d) has a higher stability of lasing mode, and also has simpler manufacturing process than the conventional laser, since the epitaxial growth process can be made in one sequence, Furthermore, the laser of this example has a current limiting layer 46 made by the epitaxial growth instead of SiO2 film. Therefore, heat radiation of the device is satisfactory and there is no problem of deterioration by stress caused by difference of thermal expansion coefficients in the device.

An example of making a laser of Fig. 5(d) where the active layer is of GaAs and the clad layers are of Ga, XAixAs is as follows: Firstly, on a principal face of a (100) plane of an n + -GaAs substrate 31, a terrace is formed by selective chemical etching in a manner that the vertical plane of the step T of about 1ym of the terrace is vertical to a (110) plane, i.e., a cleavage plane, thereby forming the substrate of Fig. 5(a).

Secondly, on the substrate 31, the following layers are formed as shown in Fig. 5(b), by a sequential liquid phase epitaxial growth of starting temperature of 850"C and cooling rate of 0.5 C/minute, a first clad layer 32 of 0.2m thick n-Gaa xAxAs by a growth period of 20 seconds, a non doped active layer 33 of 0.1m thick GaAs by a growth period of 1 second, a second clad layer 34 of 1.5film thick p-Ga, xAlxAs by a growth period of 1.5 minutes, an electrode contacting layer 35 of 1,um thick p-GaAs by a growth period of 1.5 minutes, and a current limiting layer 46 of 1lim thick n-Ga, yAlyAs by a growth period of 1.5 minutes.

Thirdly, an about 3000A thick 5i3N4 film (not shown) is formed on the current limiting layer 46 by a known method, and stripe shaped opening of 5ym width is formed over an oblique part of the active layer 33 formed over the foot part of the step T, as shown in Fig. 5(c). Then the exposed stripe shaped part of the underlying current limiting layer 46 is selectively etched by known chemical etching method by utilizing the 5i3N4 film with the stripe shaped opening as an etching mask, thereby forming an opening 461, through which the surface of the electrode contacting layer 35 is exposed. In the selective etching of the current limiting layer 46, in order not to etch the electrode contacting layer 35 a selective etchant such as 30% HC1 of 60"C, 30% H3PO4 of 130"C or their mixture of about 60"C is used.

Fourthly, after diffusing zinc onto the exposed surface of the electrode contacting layer 35 through the opening 461, an ohmic contact electrode 37 is formed by sequential sputtering of Ti and Pt followed by vacuum deposition of Au. Also, after lapping and subsequent chemical etching of the bottom face of the substrate 31 to control thickness of the substrate, another ohmic contact electrode 38 is formed on the bottom face of the substrate 31 by vacuum deposition of a known alloy of Au-Ge-Ni, thus making the device shown in Fig. 5(d).

A number of lasers made continuously in lines and rows in a wafer and then divided into individual pieces, and the electrode 37 is heat-bonded to a heat sink and gold wire is bonded to the electrode 38.

The GaAs-Ga, XAixAs semiconductor laser manufactured by the abovementioned process performs a satisfactory operation of stable continuous lasing of fundamental mode at room temperature and has a satisfactory heat radiation characteristic.

EXAMPLE 3: Example 3 shown in Fig. 6 is elucidated hereinafter: Firstly, a terrace is formed on a principal face of a substrate 51 of n±type conductivity by, for example, etching a half part of the principal face to form a step T. Then, a stripe shaped diffusion prevention mask 510 is formed at the foot of the step and a diffusion control mask 511 (e.g. an SiO2 mask) is formed on all the face of the substrate as shown in Fig. 6(a). And a p-type impurity is selectively diffused into the substrate 51 and thereafter the masks 511 and 510 are removed, thereby forming diffused layers 52, 52 on the face of the substrate as shown Fig.

6(b).

Secondly, as shown in Fig. 6(c), the following layers are formed in sequence by liquid phase epitaxial growing: on the substrate 51 of n±type conductivity with selectively diffused regions 52 of p-type conductivity.: a thin first clad layer 53 of n-type conductivity, an active layer 54 of non doping, a second clad layer 55 of p-type conductivity, an electrode contacting layer 56 of p±type conductivity, and a current limiting layer 57 of n-type conductivity and capable of selective etching.

In the abovementioned sequential epitaxial growths, a thick part 531 is formed at the foot of the step T in the first clad layer 53.

Also, though not shown in the drawing, the active layer 54 becomes thicker on the thick part 531 than on other parts of the clad layer 53.

Thirdly, an etching mask 58 is formed on all the face of the current limiting layer 57 and then, a stripe shape opening 581 is formed in the etching mask 58 so as to expose a stripe shape part of the surface of the current limiting layer 57 by known photoetching method as shown in Fig. 6(c). Then by etching the exposed stripe shaped surface of the current limiting layer 57 by utilizing the etching mask 58 the opening 571 is formed over the thick part 531. The width of the stripe shape current injection opening 571 is preferably under 10 pm in order to desirably limit the dispersion of the current.

Fourthly, after diffusing an impurity, such as zinc, for ohmic contact onto the exposed surface of the electrode contacting layer 56 through the openings of the etching mask and of the current limiting layer the etching mask 58 is removed as shown in Fig. 6(d).

Fifthly, an ohmic contact electrode 59 is formed on the exposed surface of the electrode contacting layer 56, as well as on the surface of the current limiting layer 57. And, another ohmic contact electrode 60 is formed on the bottom face of the n ±type substrate, as shown in Fig. 6(e).

For the semiconductor substances of the abovementioned example, for example, the following can be used: (1) Ga, yAlyAs for the active layer and Ga, xAlxAs for the clad layers (Oy < x < 1).

(2) InGaAsP for the active layer and InP for the clad layers.

(3) GalnAs for the active layer and GalnP for the clad layers.

(4) GaAIAsSb for the active layer and GaAIAs for the clad layers.

The device made by the abovementioned method has a structural feature that the first clad layer 53 has a thicker part 531 at the foot of the terrace and thinner parts in other part then the thicker part 531. Therefore, through the thinner parts the substrate 51 absorbs lights of the off-center parts of the active layer 54. Furthermore, the first clad layer 53 forms a bent face consisting of an upper horizontal part, a lower horizontal part and a narrow stripe shaped oblique part inbetween. Accordingly, the active layer 54 formed on the bent face of the first clad layer 53 has a similar bent configuration, and hence two bent parts on both sides of its stripe shape oblique part. Such bent parts on both parts of the oblique part of the active layer 54 serves to confine light in the oblique part, thereby producing a stable fundamental mode.Also, by means of cooperation of current path narrowings in the current limiting layer 57 and the p-n junction formed under the diffused layers 52, 52, the current injected to the active layer 54 is concentrated to a narrow part. Therefore, the mode of lasing is stable.

Furthermore, though not shown in the drawing, the active layer 54 is thick at the oblique part between two bent parts, and therefore, the fundamental mode is easily confined in the thick part of the active layer 54.

The laser of the example of Fig. 6(e) does not have the abovementioned shortcomings of the conventional lasers of Fig. 1 to Fig. 3.

And furthermore, the laser of the example of Fig. 6(e) has a higher stability of lasing mode and satisfactory heat radiation characterstic, and also has simpler manufacturing process then the conventional laser, since the epitaxial growth process can be made in one sequence.

Furthermore, the laser of this example has a current limiting layer 57 made by the epitaxial growth instead of SiO2 film. Therefore, heat radiation of the device is satisfactory and there is no problem of deterioration by stress caused by difference of thermal expansion coefficients in the device.

An example of making a laser of Fig. 6(e) where the active layer 54 is of GaAs and the clad layers 53 and 55 are of Ga, yAlyAs is as follows: Firstly, on a principal face of (100) plane of an n±GaAs substrate 51, a terrace is formed by selective chemical etching in a manner that the vertical plane of the step T of about 1ym of the terrace is vertical to a (110) plane, i.e., a cleavage plane. Then, a 5ym width stripe shaped diffusion prevention mask 510 of 3000A thick 5i3N4 is formed at the foot of the step and a diffusion control mask 511 of 1500A thick SiO2 is formed on all face of the substrate as shown in Fig. 6(a).And a p-type impurity of zinc is selectively diffused through the SiO2 film 511 at 800"C into the substrate 51 and thereafter the masks 510 and 511 are removed, thereby forming diffused layers 52, 52 on the face of the substrate as shown in Fig. 6(b). In the diffusion, there is no problem that the zinc diffuses underneath the diffusion prevention mask 511. The surface concentration of the diffused impurity was 1018 atoms/cms3.

Secondly, on the substrate 51 of the n + -GaAs the following layers are formed as shown in Fig. 6(b), by a sequential liquid phase epitaxial growth of starting temperature of 850"C and cooling rate of 0.5 C/minute, a first clad layer 53 of 0.2 jum thick n-Ga, xAIxAs by a growth period of 20 seconds,a non doped active layer 54 of 0.1 m thick n-GaAs by a growth period of 1 second, a second clad layer 55 of 1.5 jum thick p-Ga, XAixAs by a growth period of 1.5 minutes, an electrode contacting layer 56 of 1 jbm thick p-GaAs by a growth period of 1.5 minutes, and a current limiting layer 57 of 1 Sem thick n-Ga, yAlyAs by a growth period of 1.5 minutes.

Thirdly, an about 3000A thick Si3N4 film 58 is formed as an etching mask on the current limiting layer 57 by a known method, and stripe shaped opening of 5 jum width is formed over an oblique part of the active layer 54 formed over the foot part of the step T, as shown in Fig. 6(c). Then the exposed stripe shaped part of the underlying current limiting layer 57 is selectively etched by known chemical etching method by utilizing the 5i3N4 mask 58 with the stripe shaped opening as the etching mask, thereby forming an opening 571, through which the surface of the electrode contacting layer 56 is exposed.In the selective etching of the current limiting layer 57, in order not to etch the electrode contacting layer 56, a selective etchant such as 30% HCl of 60"C, 30%H3PO4 of 130"C or their mixture of about 60"C is used.

Fourthly, after diffusion zinc onto the exposed surface of the electrode contacting layer 56 through the opening 571 and removing the mask film 58, an ohmic contact electrode 59 is formed by sequential sputtering of Ti and Pt followed by vacuum deposition of Au.

Also, after lapping and subsequent chemical etching of the bottom face of the substrate 51 to control thickness of the substrate, another ohmic contact electrode 60 is formed on the bottom face of the substrate 51 by vacuum deposition of a known alloy of Au-Ge-Ni, thus making the device shown in Fig. 6(e).

A number of lasers made continuously in lines and rows in a wafer are then divided into individual pieces, and the electrode 59 is heat-bonded to a heat sink and a gold wire is bonded to the electrode 60.

The GaAs-Ga, XAixAs semiconductor laser manufactured by the abovementioned process performs a satisfactory operation of stable continuous lasing of fundamental mode at room temperature and has a satisfactory heat radiation characteric.

By the use of diffusing control mask 511 of SiO2, deterioration of the substrate surface, which adversely affect the characteristic of the epitaxial growth layers, can be satisfactorily eliminated.

EXAMPLE 4: Example 4 shown in Fig. 7 is elucidated hereafter: Firstly, a terrace 51 2 is formed on a principla face of a substrate 51 of n±type conductivity by, for example, etching a half part of the principal face to form a step T.

Then, a stripe shaped diffusion prevention mask 510 is formed at the foot of the step and a diffusion control mask 511 is formed on all the face of the substrate as shown in Fig. 7(a). And a p-type impurity is selectively diffused into the substrate 51 and thereafter the masks 511 and 510 are removed in sequence, thereby forming diffused layers 52, 52 on the face of the substrate as shown in Figl 7(b).

Secondly, as shown in Fig. 7(c), the following layers are formed in sequence by liquid phase epitaxial growing: on the substrate 51 of n±type conductivity with selectively diffused regions 52 of p-type conductivity: a thin first clad layer 53 of n-type conductiv ity, an active layer 54 of non doping, a second clad layer 55 of p-type conductivity.

and an electrode contacting layer 56 of p-type conductivity, In the abovementioned sequential epitaxial growths, a thick part 531 is formed at the foot of the step T in the first clad layer 53.

Also, through not shown in the drawing, the active layer 54 becomes thicker on the thick part 531 than on other parts of the first clad layer 53.

Thirdly, an insulating film 67 as current limiting layer is formed on all the face of the electrode contacting layer 56, and then, the insulating film 67 is etched so as to expose a stripe shape part of the surface of the electrode contacting layer 56, by known photoetching method, thus forming a stripe shape current injecting opening 671 over- the thick part 531, as shown in Fig. 7(d). The width of the stripe shape current injecting opening 671 is preferably under 10 ym in order to desirably limit the dispersion of the current.

Fourthly, after diffusing an impurity, such as zinc, for ohmic contact onto the exposed surface of the electrode contacting layer 56 through the opening 671, an ohmic contact electrode 59 is formd on the exposed surface of the electrode contacting layer 56 as well as on the surface of the insulating film 67. And, another ohmic contact electrode 60 is formed on the bottom face of the n ±type substrate 51, as shown in Fig. 7(e).

For the semiconductor substances of the abovementioned example, for example, the followings can be used: (1) Ga, yAlyAs for the active layer and Ga, xAixAs for the clad layer (0y < x < 1).

(2) InGaAsP for the active layer and InP for the clad layers.

(3) GalnAs for the active layer and GalnP for the clad layers.

(4) GaAIAsSb for the active layer and GaAIAs for the clad layers.

The device made by the abovementioned method has a structural feature that the first clad layers 53 has a thicker part 531 at the foot of the terrace and thinner parts in other part than the thicker part. Therefore, through the thinner parts the substrate 51 absorbs lights of the off-center parts of the active layer 54. Furthermore, the first clad layer 53 forms a bent face consisting of an upper horizontal part, a lower horizontal part and a narrow stripe shaped oblique part in between. Accordingly, the thin active layer 54 formed on the bent face of the first clad layer 53 has a similar bent configuration, and hence two bent parts on both sides of its stripe shape oblique part. Such bent parts on both parts of the oblique part of the active layer 54 serves to confine light in the oblique part, thereby producing a stable fundamental mode lasing.

Also, by means of cooperation of current path narrowings by the current limiting layer 57 and the p-n junction formed under the diffused layers 52, 52, the current injected to the active layer 54 is concentrated to a narrow part. Therefore, the mode of lasing is stable.

The laser of the example of Fig. 7(e) does not have the abovementioned shortcomings of the conventional lasers of Fig. 1 to Fig. 3.

And furthermore, the laser of the example of Fig. 7(e) has a higher stability of lasing mode, and also has simpler manufacturing process than the conventional laser, since the epitaxial growth process can be made in one sequence.

An example of making a laser of Fig. 7(e) where the active layer is of GaAs and the clad layers are of Ga, xAlxAs is as follows: Firstly, on a principal face of a (100) plane of an n±GaAs substrate 51, a terrace is formed by selective chemical etching in a manner that the vertical plane of the step T of about 1 fizm of the terrace is vertical to a (11 0) plane, i.e., a cleavage plane. Then, a 5 Ism width stripe shaped diffusion prevention mask 510 of 3000A thick 5i3N4 is formed at the foot of the step and a diffusion control mask 511 of 1500A thick SiO2 is formed on all the face of the substrate as shown in Fig. 7(a).

And a p-type impurity of zinc is selectively diffused through the SiO2 film 511 at 800 "C into the substrate 51, and thereafter the masks 511 and 510 are removed, thereby forming diffused layers 52, 52 on the face of the substrate as shown in Fig. 7(b). In the diffusion, there is no problem that the zinc diffuses underneath the diffusion prevention mask 511. The surface concentration of the diffused impurity was 1018 atoms/cm3.

Secondly, on the substrate 51, the following layers are formed as shown in Fig. 7(c), by a sequential liquid phase epitaxial growth of starting temperature of 850"C and cooling rate of 0.5 C/minute, a first clad layer 53 of 0.2 im thick n-Ga, xAlxAs by a growth period of 20 seconds, a non doped active layer 54 of 0.1 lim thick GaAs by a growth period of 1 second, a second clad layer 55 of 1.5 m thick p-Gaa xAlxAs by a growth period of 1.5 minutes, and an electrode contacting layer 56 of 1 lim thick p-GaAs by a growth period of 1.5 minutes.

Thirdly, a 300A thick 5i3N4 film 67 is formed on the electrode contacting layer 56 by a known method, and a stripe shaped opening 671 of 5 jum width is formed over an oblique part of the active layer 54 formed over the foot part of the step T, as shown in Fig. 7(d).

Fourthly, after diffusing zinc onto the exposed surface of the electrode contacting layer 56 through the opening 671, an ohmic contact electrode 59 is formed by sequential sputtering of Ti and Pt followed by vacuum deposition of Au. Also, after lapping and subsequent chemical etching of the bottom face of the substrate 51 to control thickness of the substrate, another ohmic contact electrode 60 is formed on the bottom face of the substrate 51 by vacuum deposition of a known alloy of Au-Ge-Ni, thus making the device shown in Fig. 7(e).

A number of lasers made continuously in lines and rows in a wafer are then divided into individual pieces, and the electrode 59 is heat-bonded to a heat sink and gold wire is bonded to the electrode 60.

The GaAs-Ga, XAixAs semiconductor laser manufactured by the abovementioned process performs a satisfactory operation of stable continuous lasing of fundamental mode at room temperature.

A modification of the laser of this example is made by replacing the diffused layers 52, 52 by a high resistivity layer on the semiconductor substrate having a terrace section.

EXAMPLE 5: Example 5 shown in Fig. 8 is elucidated hereafter: Firstly, a terrace 711 is formed on a principal face of a substrate 71 of n-type conductivity by, for example, etching a half part of the principal face to form a step T, as shown in Fig. 8(a).

Secondly, as shown in Fig. 8(b), the following layers are formed in sequence by liquid phase epitaxial growing: on the substrate 71 of n±type conductivity: a thin first clad layer 72 of n-type conductivity, an active layer 73 of non doping, a second clad layer 74 of p-type conductivity, and an electrode contacting layer 75 of p+type conductivity In the abovementioned sequential epitaxial growths, a thick part 721 is formed at the foot of the step T in the first clad layer 72.

Thirdly, an insulating film 76 as current limiting layer is formed on all the face of the electrode contacting layer 75, and then, the insulating film 76 is etched so as to expose a stripe shape part of the surface of the electrode contacting layer 75, by known photoetching method, thus forming a stripe shape current injecting opening 761 over the thick part 721 as shown in Fig. 8(c). The width of the stripe shape current injecting opening 761 is preferably under 10 ym *m in order to desira- bly limit the dispersion of the current.

Fourthly, after diffusing an inpurity, such as zinc, for ohmic contact onto the exposed surface of the electrode contacting layer 75 through the opening 761, an ohmic contact electrode 77 is formed on the exposed surface of the electrode contacting layer 75 as well as on the surface of the insulating film 76. And, another ohmic contact electrode 78 is formed on the bottom face of the n±type substrate 71, as shown in Fig. 7(c). Instead of the abovementioned insulating layer 76, a current limiting layer of the conductivity type of the substrate 71 can be used.

For the semiconductor substances of the abovementioned example, for example, the following can be used: (1) Ga, yAlyAs for the active layer and Ga1-xAlxAs for the clad layers (0y < x < 1).

(2) InGaAsP for the active layer and InP for the clad layers.

(3) GalnAs for the active layer and GalnP for the clad layers.

(4) GaAIAsSb for the active layer and GaAIAs for the clad layers.

In general, when an epitaxial growth layer is formed on a substrate having a terrace part, at an initial stage of the epitaxial growth the growth speed of the concave corner part, i.e., of the part at the foot of the step of the terrace, is greater than that of other parts, and this phenomena is dominant especially in the first grown layer, i.e., first clad layer 72.

Accordingly, by selecting the growth condition it is possible that the first clad layer 72 has a thick part 721 which is around the step and sufficiently thick for preventing light absoprtion by the substrate 71 and a thinner parts which are far from the step part and sufficiently thin for allowing absorption of light into the substrate 71 therethrough.

When the laser of this example is a GaAs GaAIAs laser and the first clad layer 72 is an n-type GaO7AI03As, the light absorption coefficients for several thicknesses of the first clad layer is as follows: 1 lim thick ... .....................10 cm- 0.5 ym thick ... . ...100 cm-' 0.3 ym thick ... ...... 300 cm-' 0.2 jbm thick ............... 1000 cm-'. cm-'.

Therefore, by making the thickness of the thick part 721 to be over 1 Ibm, the absorption of light in the oblique part of the active layer 73 through the thick part 721 into the substrate 71 is substantially prevented. Also, by making the far away thin part to be under 0.5 ym, the light in the far away part (horizontal part of the active layer 73) is considerably absorbed. through the thin part of the first clad layer 72 into the substrate.

Furthermore, the first clad layer 72 forms a bent face consisting of an upper horizontal part, a lower horizontal part and a narrow striped shaped oblique part inbetween as shown in Fig. 8(c). Accordingly, the thin active layer 73 formed on the bent face of the first clad layer 72 has a similar bent configuration, and hence two bent parts 80 and 81 on both sides of its stripe shape oblique part.

Such bent parts on both parts of the oblique part of the active layer 73 serves to prevent light from leaking therethrough. Therefore, the oblique part between the pair of bent parts 80 and 81 is optically isolated from the horizontal parts, thereby having a different lasing mode from the latter. Accordingly, a fundamental mode lasing is produced in the oblique part of the active layer 73.

Furthermore, it is confirmed that the thickness of the active layer 73 becomes 10 to 20% thicker at the oblique part which is between the bent parts 80 and 81, in comparison with other parts (i.e., horizontal parts) of the active layer 73. Therefore, the active layer 73 forms a rib shape waveguide configuration and the lased light is confined in the oblique part between the two bent parts 80 and 81. The difference of effective refractive indexes of light of the thicker part and the thinner part of the active layer 73 is of the order of 10-3. In order to obtain a lasing in TEoo mode for such value of the difference it is required that the width of the lasing region is preferably under 3 pm. For the width of about 5 ym, there is a possibility of lasing in TEo1 mode.However, in the construction of Fig. 8(c), since the thickness of the active layer continuously decreases as a position departs from the center of the oblique part of the active region, the light absorption by the substrate becomes large as the position departs from the center. Accordingly, the mode of lasing becomes fundamental at or around the center. Therefore, the present laser can perform a stable fundamental mode of lasing.

The laser of the example of Fig. 8(c) does not have the abovementioned shortcomings of the conventional lasers of Fig. 1 to Fig. 3.

And furthermore, the laser of the example of Fig. 8(c) has simpler manufacturing processes than the conventional laser, since the epitaxial growth process can be made in one sequence.

An example of making a laser of Fig. 8(c) where the active layer is of GaAs and the clad layers are of Ga, XAIxAs is as follows: Firstly, on a principal face of a (100) plane of an n + -GaAs substrate 71, a terrace is formed by selective chemical etching in a manner that the vertical plane of the step T about 2 ym of the terrace is vertical to a (110) plane, i.e., a cleavage plane, thereby forming the substrate of Fig. 8(a).

Secondly, on the substrate 71, the following layers are formed as shown in Fig. 8(b), by a sequential liquid phase epitaxial growth of starting temperature of 845'C and cooling rate of 0.5 C/minute.

a first clad layer 72 of n-Ga, xAixAs of 0.2 ym thickness at the horizontal part formed by a growth period of 20 seconds, a non doped active layer 73 of Ga, yAlyAs of 0.1 ym at the horizontal part formed by a growth period of 1 second, a second clad layer 74 of 1.5 ym thick p-Ga, xAs by a growth period of 1.5 minutes and an electrode contacting layer 75 of 1 lim thick p±GaAs by a growth period of 1.5 minutes.

In the epitaxial growth, the thicker part and thinner parts of the active layers are 1 sbm and 0.12 lim, respectively.

Thirdly, a 3000A thick SiO2 film 76 is formed on the electrode contacting layer 75 by a known method, and stripe shaped opening 761 of 5 im width is formed over an oblique part of the active layer 73 formed over the foot part of the step T, as shown in Fig. 8(c).

Fourthly, after diffusing zinc onto the exposed surface of the electrode contacting layer 75 through the opening 761, an ohmic contact electrode 77 is formed by sequential sputtering of Ti and Pt followed by vacuum deposition of Au. Also, after lapping and subsequent chemical etching of the bottom face of the substrate 71, to control thickness of the substrate another ohmic contact electrode 78 is formed on the bottom face of the substrate 71 by vacuum deposition of a known alloy of Au-Ge-Ni, thus making the device shown in Fig. 8(c).

A number of lasers made continuously in lines and rows in a wafer are then divided into individual pieces, and the electrode 77 is heat-bonded to a heat sink and gold wire is bonded to the electrode 78.

The GaAs-Ga,~,AI,As semiconductor laser manufactured by the abovementioned process performs a satisfactory operation of stable continous lasing of fundamental mode at room temperature. And the transverse mode remains stable even for operations at a current as large as 5 times of the threshold value of the laser.

A modification of the laser of this example is made by replacing the SiO2 film 76 by a high resistivity layer on the, semiconductor substrate having a terrace section.

EXAMPLE 6: Example 6 shown in Fig. 9 is elucidated hereafter: Firstly, a terrace 711 is formed on a principal face of a substrate 71 of n-type conductivity by, for example, etching a half part of the principal face to form a step T, as shown in Fig. 9(a).

Secondly, as shown in Fig. 9(b), the following layers are formed in sequence by liquid phase epitaxial growing: on the substrate 71 of n±type conductivity: a thin first clad layer 72 of n-type conductivity an active layer 73 of non-doping, a second clad layer 74 of p-type conductivity, and an electrode contacting layer 74 of p ±type conductivity.

In the abovementioned sequential epitaxial growths, a thick part 721 is formed at the foot of the step T in the first clad layer 72.

Thirdly, a current limiting layer 86 of n-type conductivity is formed on all the face of the electrode contacting layer 75, and then, and an etching mask (not shown) is formed. And the etching mask is etched so as to form a stripe shape opening, from which a part of the surface of the electrode contacting layer 75, is exposed. Then by utilizing the etching mask the current limiting layer 86 is etched by known photo-etching method, thus forming a stripe shape current injecting opening 861 over the thick part 721, as shown in Fig. 9(c).

The width of the stripe shape current injection opening 861 is preferably under 10 lim in order to desirably limit the dispersion of the current.

Fourthly, after diffusing an impurity, such as zinc, for ohmic contact onto the exposed surface of the electrode contacting layer 75 through the openings of the etching mask and of the current limiting layer 861, an ohmic contact electrode 77 is formed on the exposed surface of the electrode contacting layer 75 as well as on the surface of the insulating film 86. And, another ohmic contact electrode 78 is formed on the bottom face of the n ±type substrate 71 as shown in Fig. 7(c).

For the semiconductor substances of the abovementioned example, for example, the followings can be used: (1) Ga, yAlyAs for the active layer and Ga,~,AI,As for the clad layers (0'y < x < 1).

(2) InGaAsP for the active layer and InP for the clad layers.

(3) GalnAs for the active layer and GalnP for the clad layers.

(4) GaAIAsSb for the active layer and GaAIAs for the clad layers.

In general, when an epitaxial growth layer is formed on a substrate having a terrace part, at an initial stage of the epitaxial growth the growth speed of the concave corner part, i.e., of the part at the foot of the step of the terrace is greater than that of other parts, and this phenomena is dominant especially in the first grown layer, i.e., first clad layer 72.

Accordingly, by selecting the growth condition, it is possible that the first clad layer 72 has a thick part 721 which is around the step and sufficiently thick for preventing light absorption by the substrate 71 and a thinner parts which are far from the step part and sufficiently thin for allowing absorption of light into the substrate 71 therethrough.

When the laser of this example is GaAs GaAIAs laser and the first clad layer 72 is an n-type Ga07AI03As, the light absorption coefficients or several thicknesses of the first clad layer is follows: 1 pm thick .. . ...........10 10 cm-1 0.5 lim thick .... ....100cm-' 0.3 m thick ...... 300 cm-' 0.2 lim thick ...1000 cm-'.

Therefore, by making the thickness of the thick part 721 to be over 1 jum, the absorption of light in the oblique part of the active layer 73 through the thick part 721 into the substrate 71 is substantially prevented. Also, by making the far away thin part to be under 0.5 jum, the light in the far away part (horizontal part of the active layer 73) is considerably absorbed through the thin part of the first clad layer 72 into the substrate.

Furthermore, the first clad layer 72 forms a bent face consisting of an upper horizontal part, a lower horizontal part and a narrow striped shaped oblique part inbetween as shown in Fig. 9(c). Accordingly, the thin active layer 73 formed on the bent face of the first clad layer 72 has a similar bent configuration, and hence two bent parts 80 and 81 on both sides of its stripe shape oblique part.

Such bent parts on both parts of the oblique part of the active layer 73 serves to prevent light from leaking therethrough. Therefore, the oblique part between the pair of bent parts 80 and 81 is optically isolated from the horizontal parts, thereby having a different lasing mode from the latter. Accordingly, a fundamental mode lasing is produced in the oblique part of the active layer 73.

Furthermore, it is confirmed that the thickness of the active layer 73 becomes 10 to 20% thicker at the oblique part which is between the bent parts 80 and 81 in comparison with other parts (i.e., horizontal parts) of the activ layer 73. Therefore, the active layer 73 forms a rib shape waveguide configuration and the lased light is confined in the oblique part between the two bent parts 80 and 81.

The difference of effective refractive indexes of light of the thicker part and the thinner part of the active layer 73 is of the order of 10-3.

In order to obtain a lasing in TEoo mode for such value of the difference, it is required that the width of the lasing region is preferably under 3 Item. For the width of about 5 jum, there is a possibility of lasing in TEo1 mode.

However, in the construction of Fig. 9(c), since the thickness of the active layer continuously decreases as a position departs from the center of the oblique part of the active region, the light absorption by the substrate becomes large as the position departs from the center.

Accordingly, the mode of lasing becomes fundamental at or around the center. Therefore, the present laser can perform a stable fundamental mode of lasing.

The laser of the Fig. 9(c) has a satisfactory heat radiation characteristic due to its employment of semiconductor current limiting layer 86.

The laser of the example of Fig. 9(c) does not have the abovementioned shortcomings of the conventional lasers of Fig. 1 to Fig. 3.

And furthermore, the laser of the example of Fig. 9(c) has simpler manufacturing process than the conventional laser, since the epitaxial growth process can be made in one sequence.

An example of making a laser of Fig. 9(c) where the active layer is of GaAs and the clad layers are of Ga, xAIxAs is as follows: Firstly, on a principal face of a (100) plane of an n±GaAs substrate 71, a terrace is formed by selective chemical etching in a manner that the vertical plane of the step T of about 2 m of the terrace is perpendicular vertical to a (110) plane, i.e., a cleavage plane, thereby forming the substrate of Fig.

9(a).

Secondly, on the substrate 71, the following layers are formed as shown in Fig. 9 (b), by a sequential liquid phase epitaxial growth of starting temperature of 845"C and cooling rate of 0.5 C/minute, a first clad layer 72 of n-Ga, xAlxAs of 0.2 ym thickness at the horizontal part formed by a growth period of 20 seconds, a non doped active layer 73 of Ga, yAlyAs of 0.1 ym at the horizontal part formed by a growth period of 1 second, a second clad layer 74 of 1.5 ym thick p-Ga1 xAlxAs by a growth period of 1.5 minutes, an electrode contacting layer 75 of 1 jum thick p±GaAs by a growth period of 1.5 minutes and a current limiting layer 86 of 1 jum thick n-Ga1Al,As by a growth period of 1.5 minutes (0'y < x < 1, 0'z < x < 1).

In the epitaxial growth, the thicker part and thinner parts of the first clad layers 72 are 1 ,um and 0.12 ym thick, respectively, and the thicker part of the active layer 73 is about 0.2 m thick, the width between two parallel bents 80 and 81 of the active layer 72 is about 6-71lm and the cavity length is 250s1lm.

Thirdly, a 3000A thick SiO2 film 76 is formed on the electrode contacting layer 75 by a known method, and stripe shaped opening 761 of 11 ym width is formed over an oblique part of the active layer 73 formed over the foot part of the step T, as shown in Fig. 9(c).

Fourthly, after diffusing zinc onto the exposed surface of the electrode contacting layer 75 through the opening 761, an ohmic contact electrode 77 is formed by sequential sputtering of Ti and Pt followed by vacuum deposition of Au and alloying of them. Also, after lapping and subsequent chemical etching of the bottom face of the substrate 71 to control thickness of the substrate, another ohmic contact electrode 78 if formed on the bottom face of the substrate 71 by a vacuum deposition of a known alloy of Au-Ge-Ni, thus making the device shown in Fig. 9(c).

A number of laser made continuously in lines and rows in a wafer are then divided into individual pieces, and the electrode 77 is heat-bonded to a heat sink and gold wire is bonded to the electrode 78.

The GaAs-Ga1 XAIxAs semiconductor laser of Fig. 9(c) manufactured by the abovementioned process performs a satisfactory operation of stable continuous lasing of fundamental mode at room temperature. And the transverse mode remains stable even for operations at a current as large as 5 times of the threshold value of the laser.

Fig. 10 is a graph showing "far field intensity distributions" of the laser of Fig. 9. The left curves are for distributions in a plane of the junction between the first clad layer 72 and the active layer 73 and the right curves are for distributions in a plane perpendicular to the abovementioned junction plane and at the center of the obliique part of the active layer 73.

Characteristics of the laser of Fig. 9 is shown by Figs. 10 to 12. As shown in Fig.

10, the distribution pattern does not change even when the injected current is changed in a wide range. In other words, even for increased injection current, the mode of lasing does not split, and a fundamental mode remains stable. (If the lased mode splits, the curves of the far field intensity distribution vary to have plural peaks.) Fig. 11 (a) and Fig. 11 (b) are graphs showing relations between the injection current and output power intensity for DC operation and Pulse current operation of the laser of Fig. 9.

As shown in these graphs, there is no kink phenomenon (the phenomenon that the increase of the output with respect to the current increase stops at a certain value of current) on the curves, and a good linearity of injection current vs. output response and a stable lasing mode is obtainable. As shown in Fig. 11, by means of a pulse operation, a large injection current can be put in. In the curves, a low gradient parts at the low injection part show ranges of spontaneous emission (non coherent emission).

Fig. 1 2 is a front views photograph of the laser of Fig. 9 in operation. The photograph shows that the laser is operating in a fundamental mode (with a single light beam) in the oblique part of the active layer 73.

From the description for the abovementioned several examples, it becomes clear that the laser of the present invention has the following principal advantages: The first clad layer which is between the semiconductor substrate and the active layer has a triangular thicker part at the foot part of the terrace step and horizontal thinner parts on the raised plane face on the terrace and on the lower plane face. Accordingly, the lights in the parts of active layer on the thinner parts of the first clad layer are absorbed through the thinner parts by the substrate, while the light in the part of active layer on the thicker parts of the first clad layer is prevented from leaking to the substrate by the thicker part. Therefore, only the fundamental lasing mode in the part of the active layer on the thicker part is retained.

The active layer has a narrow stripe shaped oblique part between a pair of parallel bents.

The oblique part is 10 to 20% thicker than horizontal thinner parts connecting thereto.

The thicker part of the active layer forms a kind of rib shaped waveguide, which together with the parallel bents confines the light in the thicker part of the active layer.

From the description for the abovementioned several examples, it becomes clear that making method in accordance with the present invention has the following principal advantages: The making method utilizes only one epitaxial growth, and therefore, there is neither problem of contamination of the active layer and resultant crystal imperfection of the active layer, nor need of delicate control of etching to make a rib part.

Claims (11)

1. A semiconductor laser comprising an active layer epitaxially formed on a semiconductor substrate and at least a current limiting layer which defines a current injection region of a narrow thin shape herein called a stripe shape, in which the active layer has two parallel bent parts defining a stripe shape active region facing said current injection region.

2. A semiconductor laser in accordance with claim 1, in which the substrate has a terrace part on its principal face, and the stripe shape active region is disposed at a specified angle to the principal face.

3. A semiconductor laser in accordance with claim 1 or 2 in which the current limiting layer is an insulating film.

4. A semiconductor laser in accordance with claim 1 or 2 in which the current limiting layer is a layer having the same conductivitytype as the substrate.

5. A semiconductor laser in accordance with any one of claims 1 to 4 in which the substrate has thereon a layer of the opposite conductivity type to that of the substrate except at a region at the foot of a step bounding the terrace.

6. A semiconductor laser in accordance with claim 2 or any claim dependent thereon in which the active layer is thicker in its stripe shaped active region than in the remainder.

7. A semiconductor laser in accordance with any of claims 1 to 4 and 6 in which a first clad layer overlies the substate and is thicker under said active region then elsewhere.

8. A semiconductor laser in accordance with claim 5 in which a first clad layer overlies the said opposite conductivity type layer and the substrate, and is thicker under the active region then elsewhere.

9. A semiconductor laser in accordance with claim 4 when dependent on claim 2 which includes a high sensitivity layer which is located over all the substrate principal face except for a region at the foot of the step of the terrace.

10. A semiconductor laser according to claim 5 in which the said opposite conductivity type layer is replaced by a high resistivity layer on the substrate.

11. A semiconductor laser according to claim 3 modified in that the insulating film is omitted, and a high resistivity layer is placed over the semiconductor substrate.

1 2. A method of making a semiconductor laser comprising the steps of forming a stepped terrace part on a principal face of a semiconductor substrate, growing an active layer having an oblique portion located over a region at the foot of said step, in such a manner that the active layer is made up of a first portion at a lower level joined to the oblique portion and a second portion at an upper level also joined to the oblique portion, and forming a current limiting layer for limiting injection of current to the oblique portion.

1 3. A method in accordance with claim 1 2 which further comprises the steps of forming a diffusion prevention mask on a specified part of the principal face of said semiconductor substrate at the foot of said step, forming a diffusion control film on the principal face of said substrate diffusing an impurity of opposite conductivity type to that of said substrate through said diffusion control film onto the principal face of said semiconductor substrate, to form separated diffused layers on the substrate, and removing said diffusion control film and said diffusion prevention mask.

1 4. A method in accordance with claim 1 2 or 1 3 wherein said step of forming said current limiting layer comprises the steps of forming an insulating layer over all the face of a layer which underlies said insulating layer, and photochemically etching said insulating layer so that it constitutes the current limiting layer and has a stripe shaped opening over said oblique portion.

1 5. A method in accordance with claims 1 2 or 1 3 wherein said step of forming said current limiting layer comprises the steps of forming an epitaxial layer having the same conductivity type as that of the substrate, forming an etching mask over all the surface of said epitaxial layer photochemically etching said etching mask to form a stripe shaped opening over said oblique portion, chemically etching said eptiaxial layer by utilizing said etching mask to form a stripe shaped opening over said oblique part and removing said etching mask.

1 6. A method of making a semiconductor laser substantially as hereinbefore described with reference to and as illustrated in any one of Figs. 4 to 9 of the accompanying drawings.

1 7. A semiconductor laser substantially as hereinbefore described with reference to and as illustrated in any one of Figs. 4 to 9 of the accompanying drawings.

1 8. A semiconductor laser when made by the method of any one of claims 1 2 to 16.