GB1581726A - Method for diffusing an impurity into a semiconductor body - Google Patents
Method for diffusing an impurity into a semiconductor body Download PDFInfo
- Publication number
- GB1581726A GB1581726A GB53080/76A GB5308076A GB1581726A GB 1581726 A GB1581726 A GB 1581726A GB 53080/76 A GB53080/76 A GB 53080/76A GB 5308076 A GB5308076 A GB 5308076A GB 1581726 A GB1581726 A GB 1581726A
- Authority
- GB
- United Kingdom
- Prior art keywords
- impurity
- diffusion
- ammonia
- diffusing
- concentration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P32/00—Diffusion of dopants within, into or out of wafers, substrates or parts of devices
- H10P32/10—Diffusion of dopants within, into or out of semiconductor bodies or layers
- H10P32/14—Diffusion of dopants within, into or out of semiconductor bodies or layers within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase
- H10P32/1408—Diffusion of dopants within, into or out of semiconductor bodies or layers within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase from or through or into an external applied layer, e.g. photoresist or nitride layers
- H10P32/141—Diffusion of dopants within, into or out of semiconductor bodies or layers within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase from or through or into an external applied layer, e.g. photoresist or nitride layers the applied layer comprising oxides only
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P32/00—Diffusion of dopants within, into or out of wafers, substrates or parts of devices
- H10P32/10—Diffusion of dopants within, into or out of semiconductor bodies or layers
- H10P32/17—Diffusion of dopants within, into or out of semiconductor bodies or layers characterised by the semiconductor material
- H10P32/171—Diffusion of dopants within, into or out of semiconductor bodies or layers characterised by the semiconductor material being group IV material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/003—Anneal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/02—Contacts, special
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/033—Diffusion of aluminum
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/112—Nitridation, direct, of silicon
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/114—Nitrides of silicon
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/141—Self-alignment coat gate
Landscapes
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50152664A JPS5814741B2 (ja) | 1975-12-19 | 1975-12-19 | ハンドウタイチユウヘノフジユンブツカクサンホウホウ |
| JP50152662A JPS5275267A (en) | 1975-12-19 | 1975-12-19 | Production of semiconductor device |
| JP50152659A JPS5814740B2 (ja) | 1975-12-19 | 1975-12-19 | ハンドウタイチユウヘノフジユンブツカクサンホウホウ |
| JP50152660A JPS5275273A (en) | 1975-12-19 | 1975-12-19 | Method of forming boron nitride-boron oxidesilicon oxide mixed film |
| JP15266175A JPS5275266A (en) | 1975-12-19 | 1975-12-19 | Production of semiconductor device |
| JP50152668A JPS5275270A (en) | 1975-12-19 | 1975-12-19 | Method of diffusing impurity in semiconductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1581726A true GB1581726A (en) | 1980-12-17 |
Family
ID=27553110
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB53080/76A Expired GB1581726A (en) | 1975-12-19 | 1976-12-20 | Method for diffusing an impurity into a semiconductor body |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US4102715A (cg-RX-API-DMAC7.html) |
| DE (1) | DE2657415C2 (cg-RX-API-DMAC7.html) |
| FR (1) | FR2335950A1 (cg-RX-API-DMAC7.html) |
| GB (1) | GB1581726A (cg-RX-API-DMAC7.html) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5795625A (en) | 1980-12-04 | 1982-06-14 | Toshiba Corp | Manufacture of semiconductor device |
| US4782036A (en) * | 1986-08-29 | 1988-11-01 | Siemens Aktiengesellschaft | Process for producing a predetermined doping in side walls and bases of trenches etched into semiconductor substrates |
| JP3131436B2 (ja) * | 1990-02-26 | 2001-01-31 | 株式会社東芝 | 半導体装置の製造方法 |
| IL123799A0 (en) * | 1995-10-04 | 1998-10-30 | Intel Corp | Formation of source/drain from doped glass |
| US6333245B1 (en) | 1999-12-21 | 2001-12-25 | International Business Machines Corporation | Method for introducing dopants into semiconductor devices using a germanium oxide sacrificial layer |
| US7851339B2 (en) * | 2008-05-29 | 2010-12-14 | Promos Technologies Pte. Ltd. | Method of repairing deep subsurface defects in a silicon substrate that includes diffusing negatively charged ions into the substrate from a sacrificial oxide layer |
| TWI501292B (zh) * | 2012-09-26 | 2015-09-21 | 財團法人工業技術研究院 | 形成圖案化摻雜區的方法 |
| US20140361407A1 (en) * | 2013-06-05 | 2014-12-11 | SCHMID Group | Silicon material substrate doping method, structure and applications |
| JP6810578B2 (ja) * | 2016-11-18 | 2021-01-06 | 株式会社Screenホールディングス | ドーパント導入方法および熱処理方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3437533A (en) * | 1966-12-13 | 1969-04-08 | Rca Corp | Method of fabricating semiconductor devices |
| DE2109300A1 (en) * | 1971-02-26 | 1972-09-21 | Siemens Ag | Formation of masking, passivating or doping coatings - or contacts - on surfaces of semiconductors |
| GB1363121A (en) * | 1972-04-25 | 1974-08-14 | Ferranti Ltd | Manufacture of semiconductor devices |
| US3808060A (en) * | 1972-07-05 | 1974-04-30 | Motorola Inc | Method of doping semiconductor substrates |
| US3865655A (en) * | 1973-09-24 | 1975-02-11 | Rca Corp | Method for diffusing impurities into nitride semiconductor crystals |
| US3869322A (en) * | 1973-10-15 | 1975-03-04 | Ibm | Automatic P-N junction formation during growth of a heterojunction |
| US4006046A (en) * | 1975-04-21 | 1977-02-01 | Trw Inc. | Method for compensating for emitter-push effect in the fabrication of transistors |
-
1976
- 1976-12-16 US US05/751,124 patent/US4102715A/en not_active Expired - Lifetime
- 1976-12-17 DE DE2657415A patent/DE2657415C2/de not_active Expired
- 1976-12-20 FR FR7638415A patent/FR2335950A1/fr active Granted
- 1976-12-20 GB GB53080/76A patent/GB1581726A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE2657415A1 (de) | 1977-07-07 |
| FR2335950A1 (fr) | 1977-07-15 |
| US4102715A (en) | 1978-07-25 |
| FR2335950B1 (cg-RX-API-DMAC7.html) | 1981-06-12 |
| DE2657415C2 (de) | 1983-03-31 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 19951220 |