GB1521130A - Selective electro-plating etching or electro-machining - Google Patents

Selective electro-plating etching or electro-machining

Info

Publication number
GB1521130A
GB1521130A GB49405/75A GB4940575A GB1521130A GB 1521130 A GB1521130 A GB 1521130A GB 49405/75 A GB49405/75 A GB 49405/75A GB 4940575 A GB4940575 A GB 4940575A GB 1521130 A GB1521130 A GB 1521130A
Authority
GB
United Kingdom
Prior art keywords
electro
machining
plating
workpieces
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB49405/75A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Priority to GB49405/75A priority Critical patent/GB1521130A/en
Priority to FR7635936A priority patent/FR2333876A1/en
Priority to ES453877A priority patent/ES453877A1/en
Priority to BE2055498A priority patent/BE848966A/en
Publication of GB1521130A publication Critical patent/GB1521130A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/20—Electroplating using ultrasonics, vibrations
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/07—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

1521130 Selective electro-plating, etching or electro-machining STANDARD TELEPHONES & CABLES Ltd 30 Nov 1976 [2 Dec 1975] 49405/75 Heading C7B Conductive workpieces are selectively electroplated e.g. connector parts mounted on a moving band, by at least partially immersing cathodically connected workpieces in a plating bath e.g. Ni and Au plating tanks, whilst selectively subjecting immersed portions of the workpieces to ultrasonic radiation of a wavelength shorter than the shortest dimension of the irradiated portions so that no cavitation of electrolyte is produced. The ultrasonic radiation may be generated from a lead zirconate/ titanate Piezo-electric transducer driven from an oscillator via an RF amplifier, the transducer resonating at the oscillator frequency; a polymethyl methacrylate lens may be mounted in front of the transducer. The process is also applicable to selective electro-machining and etching e.g. for producing Cu printed circuit board.
GB49405/75A 1975-12-02 1975-12-02 Selective electro-plating etching or electro-machining Expired GB1521130A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
GB49405/75A GB1521130A (en) 1975-12-02 1975-12-02 Selective electro-plating etching or electro-machining
FR7635936A FR2333876A1 (en) 1975-12-02 1976-11-29 SELECTIVE ELECTROLYTIC DEPOSIT METHOD AND DEVICE, USING ULTRASONIC RADIATION
ES453877A ES453877A1 (en) 1975-12-02 1976-12-02 Selective electro-plating etching or electro-machining
BE2055498A BE848966A (en) 1975-12-02 1976-12-02 SELECTIVE ELECTROLYTIC DEPOSIT METHOD AND DEVICE

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB49405/75A GB1521130A (en) 1975-12-02 1975-12-02 Selective electro-plating etching or electro-machining

Publications (1)

Publication Number Publication Date
GB1521130A true GB1521130A (en) 1978-08-16

Family

ID=10452230

Family Applications (1)

Application Number Title Priority Date Filing Date
GB49405/75A Expired GB1521130A (en) 1975-12-02 1975-12-02 Selective electro-plating etching or electro-machining

Country Status (4)

Country Link
BE (1) BE848966A (en)
ES (1) ES453877A1 (en)
FR (1) FR2333876A1 (en)
GB (1) GB1521130A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2313605A (en) * 1996-06-01 1997-12-03 Cope Chapman B Application of ultrasonic wave energy to electrolytic cell to reduce fume emission
WO2004057062A2 (en) * 2002-12-18 2004-07-08 Siemens Aktiengesellschaft Method and device for filling material separations on a surface

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4217183A (en) * 1979-05-08 1980-08-12 International Business Machines Corporation Method for locally enhancing electroplating rates
FR2932497B1 (en) * 2008-06-12 2011-03-11 C & K Components Sas METHOD FOR THE SELECTIVE DEPOSITION OF A PRECIOUS METAL ON A SUPPORT BY ULTRASONIC ABLATION OF A MASKING MEMBER AND ITS DEVICE

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2744860A (en) * 1951-11-13 1956-05-08 Robert H Rines Electroplating method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2313605A (en) * 1996-06-01 1997-12-03 Cope Chapman B Application of ultrasonic wave energy to electrolytic cell to reduce fume emission
WO2004057062A2 (en) * 2002-12-18 2004-07-08 Siemens Aktiengesellschaft Method and device for filling material separations on a surface
WO2004057062A3 (en) * 2002-12-18 2005-03-17 Siemens Ag Method and device for filling material separations on a surface
US7544282B2 (en) 2002-12-18 2009-06-09 Siemens Aktiengesellschaft Method for filling material separations on a surface

Also Published As

Publication number Publication date
BE848966A (en) 1977-06-02
FR2333876B1 (en) 1980-09-05
FR2333876A1 (en) 1977-07-01
ES453877A1 (en) 1977-11-16

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee