GB1484384A - Sputtering method and apparatus - Google Patents
Sputtering method and apparatusInfo
- Publication number
- GB1484384A GB1484384A GB4585274A GB4585274A GB1484384A GB 1484384 A GB1484384 A GB 1484384A GB 4585274 A GB4585274 A GB 4585274A GB 4585274 A GB4585274 A GB 4585274A GB 1484384 A GB1484384 A GB 1484384A
- Authority
- GB
- United Kingdom
- Prior art keywords
- sputtering
- magnetic field
- target electrode
- sputtering method
- target
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
1484384 Cathode sputtering NORDIKO Ltd 21 Jan 1976 [23 Oct 1974] 45852/74 Heading C7F In a sputtering process, a rotating magnetic field is established in the chamber, the flux lines of which intersect the target electrode, but not the substrate. The magnetic field may be achieved between polepieces 12 of electromagnets and a polepiece 11 of opposite polarity located beneath the target material 5 as target electrode 3. By connecting coils 13 to a 3-phase A.C. supply, the field rotates. D.C. or r.f. sputtering may be effected.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB4585274A GB1484384A (en) | 1974-10-23 | 1974-10-23 | Sputtering method and apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB4585274A GB1484384A (en) | 1974-10-23 | 1974-10-23 | Sputtering method and apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1484384A true GB1484384A (en) | 1977-09-01 |
Family
ID=10438844
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB4585274A Expired GB1484384A (en) | 1974-10-23 | 1974-10-23 | Sputtering method and apparatus |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB1484384A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2119817A (en) * | 1982-05-12 | 1983-11-23 | Dowty Electronics Ltd | Vacuum deposition apparatus |
GB2144772A (en) * | 1983-07-19 | 1985-03-13 | Varian Associates | Magnetron sputter coating source for both magnetic and nonmagnetic target materials |
-
1974
- 1974-10-23 GB GB4585274A patent/GB1484384A/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2119817A (en) * | 1982-05-12 | 1983-11-23 | Dowty Electronics Ltd | Vacuum deposition apparatus |
GB2144772A (en) * | 1983-07-19 | 1985-03-13 | Varian Associates | Magnetron sputter coating source for both magnetic and nonmagnetic target materials |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PCNP | Patent ceased through non-payment of renewal fee |