GB1484384A - Sputtering method and apparatus - Google Patents

Sputtering method and apparatus

Info

Publication number
GB1484384A
GB1484384A GB4585274A GB4585274A GB1484384A GB 1484384 A GB1484384 A GB 1484384A GB 4585274 A GB4585274 A GB 4585274A GB 4585274 A GB4585274 A GB 4585274A GB 1484384 A GB1484384 A GB 1484384A
Authority
GB
United Kingdom
Prior art keywords
sputtering
magnetic field
target electrode
sputtering method
target
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4585274A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nordiko Ltd
Original Assignee
Nordiko Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nordiko Ltd filed Critical Nordiko Ltd
Priority to GB4585274A priority Critical patent/GB1484384A/en
Publication of GB1484384A publication Critical patent/GB1484384A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

1484384 Cathode sputtering NORDIKO Ltd 21 Jan 1976 [23 Oct 1974] 45852/74 Heading C7F In a sputtering process, a rotating magnetic field is established in the chamber, the flux lines of which intersect the target electrode, but not the substrate. The magnetic field may be achieved between polepieces 12 of electromagnets and a polepiece 11 of opposite polarity located beneath the target material 5 as target electrode 3. By connecting coils 13 to a 3-phase A.C. supply, the field rotates. D.C. or r.f. sputtering may be effected.
GB4585274A 1974-10-23 1974-10-23 Sputtering method and apparatus Expired GB1484384A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB4585274A GB1484384A (en) 1974-10-23 1974-10-23 Sputtering method and apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB4585274A GB1484384A (en) 1974-10-23 1974-10-23 Sputtering method and apparatus

Publications (1)

Publication Number Publication Date
GB1484384A true GB1484384A (en) 1977-09-01

Family

ID=10438844

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4585274A Expired GB1484384A (en) 1974-10-23 1974-10-23 Sputtering method and apparatus

Country Status (1)

Country Link
GB (1) GB1484384A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2119817A (en) * 1982-05-12 1983-11-23 Dowty Electronics Ltd Vacuum deposition apparatus
GB2144772A (en) * 1983-07-19 1985-03-13 Varian Associates Magnetron sputter coating source for both magnetic and nonmagnetic target materials

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2119817A (en) * 1982-05-12 1983-11-23 Dowty Electronics Ltd Vacuum deposition apparatus
GB2144772A (en) * 1983-07-19 1985-03-13 Varian Associates Magnetron sputter coating source for both magnetic and nonmagnetic target materials

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee