GB1484177A - Heat-recoverable cap - Google Patents
Heat-recoverable capInfo
- Publication number
- GB1484177A GB1484177A GB52318/74A GB5231874A GB1484177A GB 1484177 A GB1484177 A GB 1484177A GB 52318/74 A GB52318/74 A GB 52318/74A GB 5231874 A GB5231874 A GB 5231874A GB 1484177 A GB1484177 A GB 1484177A
- Authority
- GB
- United Kingdom
- Prior art keywords
- substrate
- sealing member
- wall
- component
- configuration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007789 sealing Methods 0.000 abstract 7
- 239000000758 substrate Substances 0.000 abstract 6
- 239000004065 semiconductor Substances 0.000 abstract 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 2
- 239000010963 304 stainless steel Substances 0.000 abstract 1
- 229910000730 Beta brass Inorganic materials 0.000 abstract 1
- 229910000589 SAE 304 stainless steel Inorganic materials 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- 229910001000 nickel titanium Inorganic materials 0.000 abstract 1
- 229910052757 nitrogen Inorganic materials 0.000 abstract 1
- 229920003023 plastic Polymers 0.000 abstract 1
- 239000004033 plastic Substances 0.000 abstract 1
- 229920000412 polyarylene Polymers 0.000 abstract 1
- 229910001285 shape-memory alloy Inorganic materials 0.000 abstract 1
- 239000010936 titanium Substances 0.000 abstract 1
- 229910052719 titanium Inorganic materials 0.000 abstract 1
- 230000007704 transition Effects 0.000 abstract 1
- 238000010792 warming Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Casings For Electric Apparatus (AREA)
- Cable Accessories (AREA)
- Connector Housings Or Holding Contact Members (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US42142973A | 1973-12-03 | 1973-12-03 | |
| US05/465,561 US4126758A (en) | 1973-12-03 | 1974-04-30 | Method for sealing integrated circuit components with heat recoverable cap and resulting package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1484177A true GB1484177A (en) | 1977-09-01 |
Family
ID=27025234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB52318/74A Expired GB1484177A (en) | 1973-12-03 | 1974-12-03 | Heat-recoverable cap |
Country Status (15)
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0154757A1 (en) * | 1983-12-21 | 1985-09-18 | Fujitsu Limited | Cap for semiconductor device |
| GB2181300A (en) * | 1985-09-26 | 1987-04-15 | Int Standard Electric Corp | Semiconductor chip housing and method of manufacture |
| EP0330176A3 (en) * | 1988-02-22 | 1990-10-31 | Kabushiki Kaisha Toshiba | Cover plate for semiconductor devices |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5427884Y2 (enrdf_load_stackoverflow) * | 1974-06-27 | 1979-09-08 | ||
| JPS57175442U (enrdf_load_stackoverflow) * | 1981-04-30 | 1982-11-05 | ||
| JPS58100446A (ja) * | 1981-12-10 | 1983-06-15 | Mitsubishi Electric Corp | 真空封止方法 |
| FR2710810B1 (fr) * | 1993-09-29 | 1995-12-01 | Sagem | Boîtier étanche de micro-composant et procédé d'encapsulation dans un tel boîtier. |
-
1974
- 1974-12-02 CA CA215,092A patent/CA1042116A/en not_active Expired
- 1974-12-02 JP JP49138271A patent/JPS5842622B2/ja not_active Expired
- 1974-12-03 SE SE7415124A patent/SE7415124L/xx unknown
- 1974-12-03 FR FR7439474A patent/FR2253283B1/fr not_active Expired
- 1974-12-03 GB GB52318/74A patent/GB1484177A/en not_active Expired
- 1974-12-03 DE DE19742457116 patent/DE2457116A1/de not_active Ceased
- 1974-12-03 NL NL7415764A patent/NL7415764A/xx not_active Application Discontinuation
- 1974-12-03 BE BE151117A patent/BE822904A/xx unknown
- 1974-12-03 CH CH1602274A patent/CH580379A5/xx not_active IP Right Cessation
- 1974-12-03 IT IT30149/74A patent/IT1033109B/it active
- 1974-12-03 IL IL46173A patent/IL46173A/en unknown
- 1974-12-03 ES ES432527A patent/ES432527A1/es not_active Expired
- 1974-12-03 AU AU76019/74A patent/AU502556B2/en not_active Expired
- 1974-12-03 AT AT964874A patent/ATA964874A/de not_active Application Discontinuation
-
1978
- 1978-04-04 HK HK184/78A patent/HK18478A/xx unknown
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0154757A1 (en) * | 1983-12-21 | 1985-09-18 | Fujitsu Limited | Cap for semiconductor device |
| US4604495A (en) * | 1983-12-21 | 1986-08-05 | Fujitsu Limited | Semiconductor device and process for producing same |
| GB2181300A (en) * | 1985-09-26 | 1987-04-15 | Int Standard Electric Corp | Semiconductor chip housing and method of manufacture |
| US4701573A (en) * | 1985-09-26 | 1987-10-20 | Itt Gallium Arsenide Technology Center | Semiconductor chip housing |
| EP0330176A3 (en) * | 1988-02-22 | 1990-10-31 | Kabushiki Kaisha Toshiba | Cover plate for semiconductor devices |
| US5096081A (en) * | 1988-02-22 | 1992-03-17 | Kabushiki Kaisha Toshiba | Cover plate for semiconductor devices |
Also Published As
| Publication number | Publication date |
|---|---|
| AU502556B2 (en) | 1979-08-02 |
| IL46173A (en) | 1977-08-31 |
| BE822904A (fr) | 1975-06-03 |
| JPS5842622B2 (ja) | 1983-09-21 |
| NL7415764A (nl) | 1975-06-05 |
| AU7601974A (en) | 1976-06-03 |
| JPS5087586A (enrdf_load_stackoverflow) | 1975-07-14 |
| HK18478A (en) | 1978-04-14 |
| CH580379A5 (enrdf_load_stackoverflow) | 1976-09-30 |
| ATA964874A (de) | 1980-04-15 |
| FR2253283B1 (enrdf_load_stackoverflow) | 1979-08-10 |
| CA1042116A (en) | 1978-11-07 |
| IL46173A0 (en) | 1975-03-13 |
| SE7415124L (enrdf_load_stackoverflow) | 1975-06-04 |
| IT1033109B (it) | 1979-07-10 |
| ES432527A1 (es) | 1977-03-01 |
| DE2457116A1 (de) | 1975-08-21 |
| FR2253283A1 (enrdf_load_stackoverflow) | 1975-06-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 19921203 |