CA1042116A - Heat recoverable cap - Google Patents

Heat recoverable cap

Info

Publication number
CA1042116A
CA1042116A CA215,092A CA215092A CA1042116A CA 1042116 A CA1042116 A CA 1042116A CA 215092 A CA215092 A CA 215092A CA 1042116 A CA1042116 A CA 1042116A
Authority
CA
Canada
Prior art keywords
sealing member
package
substrate
wall
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA215,092A
Other languages
English (en)
French (fr)
Other versions
CA215092S (en
Inventor
John F. Krumme
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raychem Corp
Original Assignee
Raychem Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/465,561 external-priority patent/US4126758A/en
Application filed by Raychem Corp filed Critical Raychem Corp
Application granted granted Critical
Publication of CA1042116A publication Critical patent/CA1042116A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Casings For Electric Apparatus (AREA)
  • Cable Accessories (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CA215,092A 1973-12-03 1974-12-02 Heat recoverable cap Expired CA1042116A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US42142973A 1973-12-03 1973-12-03
US05/465,561 US4126758A (en) 1973-12-03 1974-04-30 Method for sealing integrated circuit components with heat recoverable cap and resulting package

Publications (1)

Publication Number Publication Date
CA1042116A true CA1042116A (en) 1978-11-07

Family

ID=27025234

Family Applications (1)

Application Number Title Priority Date Filing Date
CA215,092A Expired CA1042116A (en) 1973-12-03 1974-12-02 Heat recoverable cap

Country Status (15)

Country Link
JP (1) JPS5842622B2 (enrdf_load_stackoverflow)
AT (1) ATA964874A (enrdf_load_stackoverflow)
AU (1) AU502556B2 (enrdf_load_stackoverflow)
BE (1) BE822904A (enrdf_load_stackoverflow)
CA (1) CA1042116A (enrdf_load_stackoverflow)
CH (1) CH580379A5 (enrdf_load_stackoverflow)
DE (1) DE2457116A1 (enrdf_load_stackoverflow)
ES (1) ES432527A1 (enrdf_load_stackoverflow)
FR (1) FR2253283B1 (enrdf_load_stackoverflow)
GB (1) GB1484177A (enrdf_load_stackoverflow)
HK (1) HK18478A (enrdf_load_stackoverflow)
IL (1) IL46173A (enrdf_load_stackoverflow)
IT (1) IT1033109B (enrdf_load_stackoverflow)
NL (1) NL7415764A (enrdf_load_stackoverflow)
SE (1) SE7415124L (enrdf_load_stackoverflow)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5427884Y2 (enrdf_load_stackoverflow) * 1974-06-27 1979-09-08
JPS57175442U (enrdf_load_stackoverflow) * 1981-04-30 1982-11-05
JPS58100446A (ja) * 1981-12-10 1983-06-15 Mitsubishi Electric Corp 真空封止方法
JPS60133741A (ja) * 1983-12-21 1985-07-16 Fujitsu Ltd 半導体装置及びその製造方法
US4701573A (en) * 1985-09-26 1987-10-20 Itt Gallium Arsenide Technology Center Semiconductor chip housing
JPH0793393B2 (ja) * 1988-02-22 1995-10-09 株式会社東芝 半導体装置の金属製シェル
FR2710810B1 (fr) * 1993-09-29 1995-12-01 Sagem Boîtier étanche de micro-composant et procédé d'encapsulation dans un tel boîtier.

Also Published As

Publication number Publication date
AU502556B2 (en) 1979-08-02
IL46173A (en) 1977-08-31
BE822904A (fr) 1975-06-03
JPS5842622B2 (ja) 1983-09-21
NL7415764A (nl) 1975-06-05
GB1484177A (en) 1977-09-01
AU7601974A (en) 1976-06-03
JPS5087586A (enrdf_load_stackoverflow) 1975-07-14
HK18478A (en) 1978-04-14
CH580379A5 (enrdf_load_stackoverflow) 1976-09-30
ATA964874A (de) 1980-04-15
FR2253283B1 (enrdf_load_stackoverflow) 1979-08-10
IL46173A0 (en) 1975-03-13
SE7415124L (enrdf_load_stackoverflow) 1975-06-04
IT1033109B (it) 1979-07-10
ES432527A1 (es) 1977-03-01
DE2457116A1 (de) 1975-08-21
FR2253283A1 (enrdf_load_stackoverflow) 1975-06-27

Similar Documents

Publication Publication Date Title
EP2232646B1 (en) Hermetic feed-through with hybrid seal structure
US5268533A (en) Pre-stressed laminated lid for electronic circuit package
US6511866B1 (en) Use of diverse materials in air-cavity packaging of electronic devices
US4897508A (en) Metal electronic package
CA1200923A (en) Semiconductor packages
DE3442131C2 (enrdf_load_stackoverflow)
KR860001057B1 (ko) 하이브리드 반도체 전자 소자등에 사용하는 밀봉 패키지
EP0502887B1 (en) Metal pin grid array package including dielectric polymer sealant
CA1042116A (en) Heat recoverable cap
US3601667A (en) A semiconductor device with a heat sink having a foot portion
IE48638B1 (en) Semiconductor package having strengthening and sealing upper chamber
KR100407747B1 (ko) 반도체장치
US5317196A (en) Encapsulant method and apparatus
US6214152B1 (en) Lead frame moisture barrier for molded plastic electronic packages
JPS6328052A (ja) 電力用半導体モジュ−ル
US5000691A (en) Pin fastened to a printed circuit board by soldering
EP0754350A1 (en) Cavity filled metal electronic package
US20190126525A1 (en) Injection tool and method to seal insert parts
US6229088B1 (en) Low profile electronic enclosure
EP0382714A1 (en) Process for manufacturing plastic pin grid arrays and the product produced thereby
US5126511A (en) Copper cored enclosures for hybrid circuits
US20230360988A1 (en) Potted electronic circuit
JP2025083199A (ja) 半導体装置及び半導体装置の製造方法
WO1994013014A1 (en) Disc-formed, heat producing electronic element
US20200149635A1 (en) Hermetic glass-to-metal seal reinforced with a ceramic disc to prevent crack propagation