GB1475831A - Method and apparatus for processing semi-conductor integrated circuit chips - Google Patents

Method and apparatus for processing semi-conductor integrated circuit chips

Info

Publication number
GB1475831A
GB1475831A GB117875A GB117875A GB1475831A GB 1475831 A GB1475831 A GB 1475831A GB 117875 A GB117875 A GB 117875A GB 117875 A GB117875 A GB 117875A GB 1475831 A GB1475831 A GB 1475831A
Authority
GB
United Kingdom
Prior art keywords
strip
chips
chip
integrated circuit
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB117875A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CII HONEYWELL BULL
Original Assignee
CII HONEYWELL BULL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CII HONEYWELL BULL filed Critical CII HONEYWELL BULL
Publication of GB1475831A publication Critical patent/GB1475831A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/453—Leadframes comprising flexible metallic tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor

Landscapes

  • Wire Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
GB117875A 1973-06-27 1975-01-10 Method and apparatus for processing semi-conductor integrated circuit chips Expired GB1475831A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7323502A FR2238247B1 (enExample) 1973-06-27 1973-06-27

Publications (1)

Publication Number Publication Date
GB1475831A true GB1475831A (en) 1977-06-10

Family

ID=9121656

Family Applications (1)

Application Number Title Priority Date Filing Date
GB117875A Expired GB1475831A (en) 1973-06-27 1975-01-10 Method and apparatus for processing semi-conductor integrated circuit chips

Country Status (5)

Country Link
JP (1) JPS5039068A (enExample)
DE (1) DE2500180A1 (enExample)
FR (1) FR2238247B1 (enExample)
GB (1) GB1475831A (enExample)
NL (1) NL7416624A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0326020A3 (en) * 1988-01-28 1991-10-16 Microelectronics and Computer Technology Corporation Laser bonding apparatus and method
CN112390011A (zh) * 2020-10-29 2021-02-23 苏州华兴源创科技股份有限公司 压紧机构

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2299724A1 (fr) * 1975-01-29 1976-08-27 Honeywell Bull Soc Ind Perfectionnements aux supports de conditionnement de micro-plaquettes de circuits integres
FR2379909A1 (fr) * 1977-02-04 1978-09-01 Cii Honeywell Bull Procede et appareil de montage de dispositifs sur un substrat
DE3019207A1 (de) * 1980-05-20 1981-11-26 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-chip
JPS57193203A (en) * 1981-05-26 1982-11-27 Nippon Kokan Kk <Nkk> Rolling method for h-steel
EP0087796B1 (de) * 1982-03-02 1989-05-17 Siemens Aktiengesellschaft Filmträger für ein elektrisches Leiterbild
FR2571923B1 (fr) * 1984-10-16 1987-02-20 Farco Sa Procede de soudage d'un composant electrique a un ensemble de pattes de connexion ainsi que machine et ruban pour la mise en oeuvre de ce procede
EP0208916A3 (en) * 1985-06-13 1987-08-12 Matsushita Electric Industrial Co., Ltd. Inner-lead bonding apparatus
JPS62151214A (ja) * 1985-12-25 1987-07-06 Kawasaki Steel Corp Ｈ形鋼の厚み制御方法
EP0456388A1 (en) * 1990-05-08 1991-11-13 International Business Machines Corporation Processing high-density circuit substrates and container for use in such processing

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0326020A3 (en) * 1988-01-28 1991-10-16 Microelectronics and Computer Technology Corporation Laser bonding apparatus and method
CN112390011A (zh) * 2020-10-29 2021-02-23 苏州华兴源创科技股份有限公司 压紧机构

Also Published As

Publication number Publication date
NL7416624A (nl) 1976-06-22
FR2238247A1 (enExample) 1975-02-14
DE2500180A1 (de) 1976-07-08
JPS5039068A (enExample) 1975-04-10
FR2238247B1 (enExample) 1976-11-12

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee