GB1454836A - Cooling device for components which dissipate a large amount of heat - Google Patents

Cooling device for components which dissipate a large amount of heat

Info

Publication number
GB1454836A
GB1454836A GB1485174A GB1485174A GB1454836A GB 1454836 A GB1454836 A GB 1454836A GB 1485174 A GB1485174 A GB 1485174A GB 1485174 A GB1485174 A GB 1485174A GB 1454836 A GB1454836 A GB 1454836A
Authority
GB
United Kingdom
Prior art keywords
contact surface
heat
april
recess
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1485174A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Publication of GB1454836A publication Critical patent/GB1454836A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/08—Cooling, heating or ventilating arrangements
    • H01C1/082—Cooling, heating or ventilating arrangements using forced fluid flow
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
GB1485174A 1973-04-03 1974-04-03 Cooling device for components which dissipate a large amount of heat Expired GB1454836A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7311980A FR2224875B1 (enExample) 1973-04-03 1973-04-03

Publications (1)

Publication Number Publication Date
GB1454836A true GB1454836A (en) 1976-11-03

Family

ID=9117343

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1485174A Expired GB1454836A (en) 1973-04-03 1974-04-03 Cooling device for components which dissipate a large amount of heat

Country Status (6)

Country Link
JP (1) JPS49131385A (enExample)
BE (1) BE813190A (enExample)
DE (1) DE2415893A1 (enExample)
FR (1) FR2224875B1 (enExample)
GB (1) GB1454836A (enExample)
IT (1) IT1011209B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007042549A3 (en) * 2005-10-13 2007-07-12 Ibm Rotatable liquid reservoir for computer cooling
WO2010010495A1 (en) * 2008-07-25 2010-01-28 Koninklijke Philips Electronics N.V. A cooling device for cooling a semiconductor die

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5722449Y2 (enExample) * 1977-12-28 1982-05-15
CH659735A5 (de) * 1982-05-13 1987-02-13 Bbc Brown Boveri & Cie Kuehlkoerper zur fluessigkeitskuehlung von leistungshalbleiterelementen.
US4965658A (en) * 1988-12-29 1990-10-23 York International Corporation System for mounting and cooling power semiconductor devices
US5099311A (en) * 1991-01-17 1992-03-24 The United States Of America As Represented By The United States Department Of Energy Microchannel heat sink assembly
DE4217289C2 (de) * 1992-05-25 1996-08-29 Mannesmann Ag Fluidgekühlte Leistungstransistoranordnung
DE4217598A1 (de) * 1992-05-27 1993-12-02 Siemens Nixdorf Inf Syst Einbausystem für auf Leiterplatten montierte hochintegrierte, gehäuselose Bausteine
DE4217599C2 (de) * 1992-05-27 1994-08-25 Siemens Nixdorf Inf Syst Einbausystem für auf Leiterplatten montierte, hochintegrierte, gehäuselose Bausteine
DE4327895A1 (de) * 1993-08-19 1995-02-23 Abb Management Ag Stromrichtermodul
JP2010114121A (ja) * 2008-11-04 2010-05-20 Daikin Ind Ltd 電装部品の放熱器

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007042549A3 (en) * 2005-10-13 2007-07-12 Ibm Rotatable liquid reservoir for computer cooling
CN101288355B (zh) * 2005-10-13 2012-08-22 国际商业机器公司 用于计算机冷却的可旋转液体储存器
WO2010010495A1 (en) * 2008-07-25 2010-01-28 Koninklijke Philips Electronics N.V. A cooling device for cooling a semiconductor die
US8559175B2 (en) 2008-07-25 2013-10-15 Koninlijke Philips N.V. Cooling device for cooling a semiconductor die
RU2521785C2 (ru) * 2008-07-25 2014-07-10 Конинклейке Филипс Электроникс Н.В. Охлаждающее устройство для охлаждения полупроводникового кристалла

Also Published As

Publication number Publication date
BE813190A (fr) 1974-07-31
JPS49131385A (enExample) 1974-12-17
DE2415893A1 (de) 1974-10-17
FR2224875A1 (enExample) 1974-10-31
FR2224875B1 (enExample) 1978-10-27
IT1011209B (it) 1977-01-20

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee