BE813190A - Dispositif de refroidissement pour composants a forte dissipation thermique - Google Patents

Dispositif de refroidissement pour composants a forte dissipation thermique

Info

Publication number
BE813190A
BE813190A BE142753A BE142753A BE813190A BE 813190 A BE813190 A BE 813190A BE 142753 A BE142753 A BE 142753A BE 142753 A BE142753 A BE 142753A BE 813190 A BE813190 A BE 813190A
Authority
BE
Belgium
Prior art keywords
components
cooling system
high thermal
thermal dissipation
dissipation
Prior art date
Application number
BE142753A
Other languages
English (en)
French (fr)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of BE813190A publication Critical patent/BE813190A/xx

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/40Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C1/00Details
    • H01C1/08Cooling, heating or ventilating arrangements
    • H01C1/082Cooling, heating or ventilating arrangements using forced fluid flow
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages

Landscapes

  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
BE142753A 1973-04-03 1974-04-02 Dispositif de refroidissement pour composants a forte dissipation thermique BE813190A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7311980A FR2224875B1 (enExample) 1973-04-03 1973-04-03

Publications (1)

Publication Number Publication Date
BE813190A true BE813190A (fr) 1974-07-31

Family

ID=9117343

Family Applications (1)

Application Number Title Priority Date Filing Date
BE142753A BE813190A (fr) 1973-04-03 1974-04-02 Dispositif de refroidissement pour composants a forte dissipation thermique

Country Status (6)

Country Link
JP (1) JPS49131385A (enExample)
BE (1) BE813190A (enExample)
DE (1) DE2415893A1 (enExample)
FR (1) FR2224875B1 (enExample)
GB (1) GB1454836A (enExample)
IT (1) IT1011209B (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5722449Y2 (enExample) * 1977-12-28 1982-05-15
CH659735A5 (de) * 1982-05-13 1987-02-13 Bbc Brown Boveri & Cie Kuehlkoerper zur fluessigkeitskuehlung von leistungshalbleiterelementen.
US4965658A (en) * 1988-12-29 1990-10-23 York International Corporation System for mounting and cooling power semiconductor devices
US5099311A (en) * 1991-01-17 1992-03-24 The United States Of America As Represented By The United States Department Of Energy Microchannel heat sink assembly
DE4217289C2 (de) * 1992-05-25 1996-08-29 Mannesmann Ag Fluidgekühlte Leistungstransistoranordnung
DE4217599C2 (de) * 1992-05-27 1994-08-25 Siemens Nixdorf Inf Syst Einbausystem für auf Leiterplatten montierte, hochintegrierte, gehäuselose Bausteine
DE4217598A1 (de) * 1992-05-27 1993-12-02 Siemens Nixdorf Inf Syst Einbausystem für auf Leiterplatten montierte hochintegrierte, gehäuselose Bausteine
DE4327895A1 (de) * 1993-08-19 1995-02-23 Abb Management Ag Stromrichtermodul
US7228888B2 (en) * 2005-10-13 2007-06-12 International Business Machines Corporation Rotatable liquid reservoir for computer cooling
CN102105980B (zh) * 2008-07-25 2013-07-24 皇家飞利浦电子股份有限公司 用于冷却半导体管芯的冷却装置
JP2010114121A (ja) * 2008-11-04 2010-05-20 Daikin Ind Ltd 電装部品の放熱器

Also Published As

Publication number Publication date
FR2224875B1 (enExample) 1978-10-27
DE2415893A1 (de) 1974-10-17
GB1454836A (en) 1976-11-03
FR2224875A1 (enExample) 1974-10-31
IT1011209B (it) 1977-01-20
JPS49131385A (enExample) 1974-12-17

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