BE813190A - Dispositif de refroidissement pour composants a forte dissipation thermique - Google Patents

Dispositif de refroidissement pour composants a forte dissipation thermique

Info

Publication number
BE813190A
BE813190A BE142753A BE142753A BE813190A BE 813190 A BE813190 A BE 813190A BE 142753 A BE142753 A BE 142753A BE 142753 A BE142753 A BE 142753A BE 813190 A BE813190 A BE 813190A
Authority
BE
Belgium
Prior art keywords
components
cooling system
high thermal
thermal dissipation
dissipation
Prior art date
Application number
BE142753A
Other languages
English (en)
French (fr)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of BE813190A publication Critical patent/BE813190A/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/08—Cooling, heating or ventilating arrangements
    • H01C1/082—Cooling, heating or ventilating arrangements using forced fluid flow
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Landscapes

  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
BE142753A 1973-04-03 1974-04-02 Dispositif de refroidissement pour composants a forte dissipation thermique BE813190A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7311980A FR2224875B1 (enExample) 1973-04-03 1973-04-03

Publications (1)

Publication Number Publication Date
BE813190A true BE813190A (fr) 1974-07-31

Family

ID=9117343

Family Applications (1)

Application Number Title Priority Date Filing Date
BE142753A BE813190A (fr) 1973-04-03 1974-04-02 Dispositif de refroidissement pour composants a forte dissipation thermique

Country Status (6)

Country Link
JP (1) JPS49131385A (enExample)
BE (1) BE813190A (enExample)
DE (1) DE2415893A1 (enExample)
FR (1) FR2224875B1 (enExample)
GB (1) GB1454836A (enExample)
IT (1) IT1011209B (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5722449Y2 (enExample) * 1977-12-28 1982-05-15
CH659735A5 (de) * 1982-05-13 1987-02-13 Bbc Brown Boveri & Cie Kuehlkoerper zur fluessigkeitskuehlung von leistungshalbleiterelementen.
US4965658A (en) * 1988-12-29 1990-10-23 York International Corporation System for mounting and cooling power semiconductor devices
US5099311A (en) * 1991-01-17 1992-03-24 The United States Of America As Represented By The United States Department Of Energy Microchannel heat sink assembly
DE4244721A1 (de) * 1992-05-25 1994-04-21 Mannesmann Ag Elektrische Maschine mit fluidgekühlten Halbleiterelementen
DE4217598A1 (de) * 1992-05-27 1993-12-02 Siemens Nixdorf Inf Syst Einbausystem für auf Leiterplatten montierte hochintegrierte, gehäuselose Bausteine
DE4217599C2 (de) * 1992-05-27 1994-08-25 Siemens Nixdorf Inf Syst Einbausystem für auf Leiterplatten montierte, hochintegrierte, gehäuselose Bausteine
DE4327895A1 (de) * 1993-08-19 1995-02-23 Abb Management Ag Stromrichtermodul
US7228888B2 (en) * 2005-10-13 2007-06-12 International Business Machines Corporation Rotatable liquid reservoir for computer cooling
WO2010010495A1 (en) * 2008-07-25 2010-01-28 Koninklijke Philips Electronics N.V. A cooling device for cooling a semiconductor die
JP2010114121A (ja) * 2008-11-04 2010-05-20 Daikin Ind Ltd 電装部品の放熱器

Also Published As

Publication number Publication date
IT1011209B (it) 1977-01-20
FR2224875A1 (enExample) 1974-10-31
JPS49131385A (enExample) 1974-12-17
DE2415893A1 (de) 1974-10-17
FR2224875B1 (enExample) 1978-10-27
GB1454836A (en) 1976-11-03

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