GB1450908A - Apparatus for soldering electric circuit elements by means of a laser beam - Google Patents

Apparatus for soldering electric circuit elements by means of a laser beam

Info

Publication number
GB1450908A
GB1450908A GB5621673A GB5621673A GB1450908A GB 1450908 A GB1450908 A GB 1450908A GB 5621673 A GB5621673 A GB 5621673A GB 5621673 A GB5621673 A GB 5621673A GB 1450908 A GB1450908 A GB 1450908A
Authority
GB
United Kingdom
Prior art keywords
mirror
laser
soldered
source
carriage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5621673A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mishima Kosan Co Ltd
Original Assignee
Mishima Kosan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mishima Kosan Co Ltd filed Critical Mishima Kosan Co Ltd
Publication of GB1450908A publication Critical patent/GB1450908A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/035—Aligning the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Laser Beam Processing (AREA)
  • Wire Bonding (AREA)
  • Lasers (AREA)
GB5621673A 1972-12-04 1973-12-04 Apparatus for soldering electric circuit elements by means of a laser beam Expired GB1450908A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP47121376A JPS4980990A (enrdf_load_stackoverflow) 1972-12-04 1972-12-04

Publications (1)

Publication Number Publication Date
GB1450908A true GB1450908A (en) 1976-09-29

Family

ID=14809683

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5621673A Expired GB1450908A (en) 1972-12-04 1973-12-04 Apparatus for soldering electric circuit elements by means of a laser beam

Country Status (3)

Country Link
JP (1) JPS4980990A (enrdf_load_stackoverflow)
DE (1) DE2360308A1 (enrdf_load_stackoverflow)
GB (1) GB1450908A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2618433A4 (en) * 2010-09-14 2014-06-18 Amada Co Ltd LASER PROCESSING DEVICE, AND METHOD FOR CONTROLLING LASER PROCESSING DEVICE

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4327277A (en) * 1978-08-24 1982-04-27 Raytheon Company Method for laser soldering
US4278867A (en) * 1978-12-29 1981-07-14 International Business Machines Corporation System for chip joining by short wavelength radiation
JPS55155314A (en) * 1979-05-21 1980-12-03 Nippon Telegr & Teleph Corp <Ntt> Connecting method of optical fiber and its connector
JPS5641088A (en) * 1979-09-12 1981-04-17 Hitachi Ltd Monitoring device for laser light axis
JPS5851591A (ja) * 1981-09-22 1983-03-26 富士通株式会社 ボンデイング装置
DE3247338A1 (de) * 1982-12-21 1984-06-28 Siemens AG, 1000 Berlin und 8000 München Verfahren zum laserloeten von flexiblen verdrahtungen
JPS63168084A (ja) * 1986-12-29 1988-07-12 株式会社東芝 電子部品の半田付け方法
FR2618606B1 (fr) * 1987-07-24 1990-02-16 Thomson Composants Militaires Four de soudure de puces de circuit integre
FR2659886A1 (fr) * 1990-03-26 1991-09-27 Mafond Luc Procede et dispositif destines au chauffage d'une matiere de soudage.

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2618433A4 (en) * 2010-09-14 2014-06-18 Amada Co Ltd LASER PROCESSING DEVICE, AND METHOD FOR CONTROLLING LASER PROCESSING DEVICE
US9362706B2 (en) 2010-09-14 2016-06-07 Amada Company, Limited Laser machine and controlling method of laser machine

Also Published As

Publication number Publication date
JPS4980990A (enrdf_load_stackoverflow) 1974-08-05
DE2360308A1 (de) 1974-06-12

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee