GB1446636A - Treating a printed circuit board so that the conductive areas thereof have a substantially uniform coating of solder thereon - Google Patents

Treating a printed circuit board so that the conductive areas thereof have a substantially uniform coating of solder thereon

Info

Publication number
GB1446636A
GB1446636A GB5524773A GB5524773A GB1446636A GB 1446636 A GB1446636 A GB 1446636A GB 5524773 A GB5524773 A GB 5524773A GB 5524773 A GB5524773 A GB 5524773A GB 1446636 A GB1446636 A GB 1446636A
Authority
GB
United Kingdom
Prior art keywords
solder
board
bath
tank
tanks
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5524773A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xerox Corp
Original Assignee
Xerox Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US311206A external-priority patent/US3893409A/en
Application filed by Xerox Corp filed Critical Xerox Corp
Publication of GB1446636A publication Critical patent/GB1446636A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0002—Soldering by means of dipping in a fused salt bath
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
GB5524773A 1972-12-01 1973-11-28 Treating a printed circuit board so that the conductive areas thereof have a substantially uniform coating of solder thereon Expired GB1446636A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US31120572A 1972-12-01 1972-12-01
US311206A US3893409A (en) 1972-12-01 1972-12-01 Apparatus for solder coating printed circuit boards

Publications (1)

Publication Number Publication Date
GB1446636A true GB1446636A (en) 1976-08-18

Family

ID=26977779

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5524773A Expired GB1446636A (en) 1972-12-01 1973-11-28 Treating a printed circuit board so that the conductive areas thereof have a substantially uniform coating of solder thereon

Country Status (4)

Country Link
CA (1) CA984522A (enExample)
FR (1) FR2209274B1 (enExample)
GB (1) GB1446636A (enExample)
NL (1) NL7316549A (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4463891A (en) * 1981-11-18 1984-08-07 Rca Corporation Wave soldering apparatus and method
US4469716A (en) * 1980-09-09 1984-09-04 Sinter Limited Process for the application of solder on printed circuit boards and process for their placement in and removal from this device
GB2151528A (en) * 1983-12-22 1985-07-24 Peter Philip Andrew Lymn Solder leveller
USRE32982E (en) * 1978-04-18 1989-07-11 Hollis Automation, Inc. Mass soldering system
GB2265101A (en) * 1992-03-17 1993-09-22 Sun Ind Coatings Soldering apparatus and method
US6168065B1 (en) 1998-02-17 2001-01-02 Soltec B.V. Movable selective debridging apparatus for debridging soldered joints on printed circuit boards
CN113257690A (zh) * 2020-02-10 2021-08-13 赛米控电子股份有限公司 减小烧结糊膏层连接表面的表面粗糙度的方法及产生装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2021316A5 (en) * 1969-09-19 1970-07-17 Burroughs Corp Finishing process for welded junctions on a - printed circuit board

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE32982E (en) * 1978-04-18 1989-07-11 Hollis Automation, Inc. Mass soldering system
US4469716A (en) * 1980-09-09 1984-09-04 Sinter Limited Process for the application of solder on printed circuit boards and process for their placement in and removal from this device
US4463891A (en) * 1981-11-18 1984-08-07 Rca Corporation Wave soldering apparatus and method
GB2151528A (en) * 1983-12-22 1985-07-24 Peter Philip Andrew Lymn Solder leveller
US4599966A (en) * 1983-12-22 1986-07-15 Lymn Peter A P Solder leveller
GB2265101A (en) * 1992-03-17 1993-09-22 Sun Ind Coatings Soldering apparatus and method
US5361964A (en) * 1992-03-17 1994-11-08 Sun Industrial Coatings Private Limited Soldering apparatus and method
GB2265101B (en) * 1992-03-17 1995-05-10 Sun Ind Coatings Soldering apparatus and method
US6168065B1 (en) 1998-02-17 2001-01-02 Soltec B.V. Movable selective debridging apparatus for debridging soldered joints on printed circuit boards
CN113257690A (zh) * 2020-02-10 2021-08-13 赛米控电子股份有限公司 减小烧结糊膏层连接表面的表面粗糙度的方法及产生装置
CN113257690B (zh) * 2020-02-10 2025-12-12 赛米控电子股份有限公司 减小烧结糊膏层连接表面的表面粗糙度的方法及产生装置

Also Published As

Publication number Publication date
FR2209274A1 (enExample) 1974-06-28
FR2209274B1 (enExample) 1979-05-04
CA984522A (en) 1976-02-24
NL7316549A (enExample) 1974-06-05

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee