CA984522A - Method for solder coating printed circuit boards - Google Patents

Method for solder coating printed circuit boards

Info

Publication number
CA984522A
CA984522A CA187,043A CA187043A CA984522A CA 984522 A CA984522 A CA 984522A CA 187043 A CA187043 A CA 187043A CA 984522 A CA984522 A CA 984522A
Authority
CA
Canada
Prior art keywords
printed circuit
circuit boards
solder coating
coating printed
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA187,043A
Other languages
English (en)
Other versions
CA187043S (en
Inventor
Everett A. Rote
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xerox Corp
Original Assignee
Xerox Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US311206A external-priority patent/US3893409A/en
Application filed by Xerox Corp filed Critical Xerox Corp
Application granted granted Critical
Publication of CA984522A publication Critical patent/CA984522A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0002—Soldering by means of dipping in a fused salt bath
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
CA187,043A 1972-12-01 1973-11-30 Method for solder coating printed circuit boards Expired CA984522A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US31120572A 1972-12-01 1972-12-01
US311206A US3893409A (en) 1972-12-01 1972-12-01 Apparatus for solder coating printed circuit boards

Publications (1)

Publication Number Publication Date
CA984522A true CA984522A (en) 1976-02-24

Family

ID=26977779

Family Applications (1)

Application Number Title Priority Date Filing Date
CA187,043A Expired CA984522A (en) 1972-12-01 1973-11-30 Method for solder coating printed circuit boards

Country Status (4)

Country Link
CA (1) CA984522A (enExample)
FR (1) FR2209274B1 (enExample)
GB (1) GB1446636A (enExample)
NL (1) NL7316549A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE32982E (en) * 1978-04-18 1989-07-11 Hollis Automation, Inc. Mass soldering system
CH656769A5 (de) * 1980-09-09 1986-07-15 Sinter Ltd Vorrichtung zum aufbringen von lot auf leiterplatten.
US4463891A (en) * 1981-11-18 1984-08-07 Rca Corporation Wave soldering apparatus and method
GB8334122D0 (en) * 1983-12-22 1984-02-01 Lymn P P A Solder leveller
GB2265101B (en) * 1992-03-17 1995-05-10 Sun Ind Coatings Soldering apparatus and method
US6168065B1 (en) 1998-02-17 2001-01-02 Soltec B.V. Movable selective debridging apparatus for debridging soldered joints on printed circuit boards
DE102020103288B3 (de) * 2020-02-10 2020-10-29 Semikron Elektronik Gmbh & Co. Kg Verfahren zur Reduzierung der Oberflächenrauheit einer Verbindungsoberfläche einer Sinterpastenschicht und Drucksinterverfahren damit und Sinterverbindungsherstellungseinrichtung zur Durchführung

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2021316A5 (en) * 1969-09-19 1970-07-17 Burroughs Corp Finishing process for welded junctions on a - printed circuit board

Also Published As

Publication number Publication date
FR2209274A1 (enExample) 1974-06-28
FR2209274B1 (enExample) 1979-05-04
GB1446636A (en) 1976-08-18
NL7316549A (enExample) 1974-06-05

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