GB1440148A - Coating of surfaces - Google Patents

Coating of surfaces

Info

Publication number
GB1440148A
GB1440148A GB524474A GB524474A GB1440148A GB 1440148 A GB1440148 A GB 1440148A GB 524474 A GB524474 A GB 524474A GB 524474 A GB524474 A GB 524474A GB 1440148 A GB1440148 A GB 1440148A
Authority
GB
United Kingdom
Prior art keywords
carrier
suspension
particles
glass
chlorofluoroethane
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB524474A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of GB1440148A publication Critical patent/GB1440148A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/12Protection against corrosion
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00Processes for applying liquids or other fluent materials
    • B05D1/18Processes for applying liquids or other fluent materials performed by dipping
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23DENAMELLING OF, OR APPLYING A VITREOUS LAYER TO, METALS
    • C23D5/00Coating with enamels or vitreous layers
    • C23D5/02Coating with enamels or vitreous layers by wet methods
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C17/00Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/02Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J17/00Gas-filled discharge tubes with solid cathode
    • H01J17/38Cold-cathode tubes
    • H01J17/48Cold-cathode tubes with more than one cathode or anode, e.g. sequence-discharge tube, counting tube, dekatron
    • H01J17/49Display panels, e.g. with crossed electrodes, e.g. making use of direct current
    • H01J17/492Display panels, e.g. with crossed electrodes, e.g. making use of direct current with crossed electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/284Applying non-metallic protective coatings for encapsulating mounted components
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2401/00Form of the coating product, e.g. solution, water dispersion, powders or the like
    • B05D2401/10Organic solvent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333Deposition techniques, e.g. coating
    • H05K2203/1355Powder coating of insulating material

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Paints Or Removers (AREA)
GB524474A 1974-01-25 1974-02-05 Coating of surfaces Expired GB1440148A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7402586A FR2258965B1 (enrdf_load_stackoverflow) 1974-01-25 1974-01-25

Publications (1)

Publication Number Publication Date
GB1440148A true GB1440148A (en) 1976-06-23

Family

ID=9134016

Family Applications (1)

Application Number Title Priority Date Filing Date
GB524474A Expired GB1440148A (en) 1974-01-25 1974-02-05 Coating of surfaces

Country Status (3)

Country Link
US (1) US3914466A (enrdf_load_stackoverflow)
FR (1) FR2258965B1 (enrdf_load_stackoverflow)
GB (1) GB1440148A (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4009306A (en) * 1974-09-26 1977-02-22 Matsushita Electric Industrial Co., Ltd. Encapsulation method
FR2485806A1 (fr) * 1980-06-24 1981-12-31 Lignes Telegraph Telephon Procede d'encapsulation d'un circuit electronique et circuit obtenu par ce procede
FR2488767A1 (fr) * 1980-08-13 1982-02-19 Thomson Csf Procede de vernissage de carte equipee de broches de connexion et carte ainsi obtenue
AU631966B2 (en) * 1990-02-16 1992-12-10 International Partners In Glass Research Method and apparatus for coating articles
US20070000131A1 (en) * 2005-05-04 2007-01-04 Sonion Nederland Bv Solid coated coil and a method of coating a coil
JP2014194921A (ja) * 2013-03-01 2014-10-09 Tokyo Electron Ltd マイクロ波処理装置及びマイクロ波処理方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US597277A (en) * 1898-01-11 Method of producing engravings
US2191352A (en) * 1937-01-19 1940-02-20 Julia Oprean Frozen confection and coating
US2427417A (en) * 1945-07-14 1947-09-16 Western Electric Co Method of manufacturing electrical resistors
US2976188A (en) * 1955-11-25 1961-03-21 Gen Mills Inc Method of producing a humidity senser
US3167451A (en) * 1959-08-26 1965-01-26 Sprague Electric Co Method of resistor production
BE653909A (enrdf_load_stackoverflow) * 1963-10-03
US3584379A (en) * 1968-12-27 1971-06-15 Corning Glass Works Method of forming a fused substrate resistor
NL141933B (nl) * 1970-04-24 1974-04-16 Bekaert Sa Nv Werkwijze voor het bekleden van een langgerekt metalen voorwerp met metaal, alsmede voorwerpen bekleed volgens deze werkwijze.
NL7007041A (enrdf_load_stackoverflow) * 1970-05-15 1971-11-17
US3722077A (en) * 1971-03-05 1973-03-27 South Wire Co A method of cooling and drying a wire utilizing an induced air wipe
US3773579A (en) * 1971-07-15 1973-11-20 Olin Corp Method of treating aluminum strip

Also Published As

Publication number Publication date
DE2405429B2 (de) 1975-11-27
DE2405429A1 (de) 1975-08-07
FR2258965A1 (enrdf_load_stackoverflow) 1975-08-22
US3914466A (en) 1975-10-21
FR2258965B1 (enrdf_load_stackoverflow) 1976-10-08

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
746 Register noted 'licences of right' (sect. 46/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19930205