GB1433902A - Manufacturing a device comprising a semiconductor body - Google Patents

Manufacturing a device comprising a semiconductor body

Info

Publication number
GB1433902A
GB1433902A GB4068273A GB4068273A GB1433902A GB 1433902 A GB1433902 A GB 1433902A GB 4068273 A GB4068273 A GB 4068273A GB 4068273 A GB4068273 A GB 4068273A GB 1433902 A GB1433902 A GB 1433902A
Authority
GB
United Kingdom
Prior art keywords
sputtered
semiconductor body
etched
manufacturing
predoped
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4068273A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electronics UK Ltd
Original Assignee
Philips Electronic and Associated Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronic and Associated Industries Ltd filed Critical Philips Electronic and Associated Industries Ltd
Publication of GB1433902A publication Critical patent/GB1433902A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3063Electrolytic etching
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127Structure or manufacture of heads, e.g. inductive
    • G11B5/31Structure or manufacture of heads, e.g. inductive using thin films
    • G11B5/3103Structure or manufacture of integrated heads or heads mechanically assembled and electrically connected to a support or housing
    • G11B5/3106Structure or manufacture of integrated heads or heads mechanically assembled and electrically connected to a support or housing where the integrated or assembled structure comprises means for conditioning against physical detrimental influence, e.g. wear, contamination
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127Structure or manufacture of heads, e.g. inductive
    • G11B5/31Structure or manufacture of heads, e.g. inductive using thin films
    • G11B5/3163Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127Structure or manufacture of heads, e.g. inductive
    • G11B5/31Structure or manufacture of heads, e.g. inductive using thin films
    • G11B5/3176Structure of heads comprising at least in the transducing gap regions two magnetic thin films disposed respectively at both sides of the gaps
    • G11B5/3179Structure of heads comprising at least in the transducing gap regions two magnetic thin films disposed respectively at both sides of the gaps the films being mainly disposed in parallel planes
    • G11B5/3183Structure of heads comprising at least in the transducing gap regions two magnetic thin films disposed respectively at both sides of the gaps the films being mainly disposed in parallel planes intersecting the gap plane, e.g. "horizontal head structure"
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041Printed circuit coils
    • H01F41/046Printed circuit coils structurally combined with ferromagnetic material

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
  • Magnetic Heads (AREA)
GB4068273A 1972-09-01 1973-08-29 Manufacturing a device comprising a semiconductor body Expired GB1433902A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7211910A NL7211910A (ja) 1972-09-01 1972-09-01

Publications (1)

Publication Number Publication Date
GB1433902A true GB1433902A (en) 1976-04-28

Family

ID=19816833

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4068273A Expired GB1433902A (en) 1972-09-01 1973-08-29 Manufacturing a device comprising a semiconductor body

Country Status (7)

Country Link
JP (1) JPS5234346B2 (ja)
CA (1) CA991319A (ja)
DE (1) DE2341832C3 (ja)
FR (1) FR2198266B1 (ja)
GB (1) GB1433902A (ja)
IT (1) IT994704B (ja)
NL (1) NL7211910A (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2000190A (en) * 1977-06-14 1979-01-04 Sony Corp Methods of electrolytically etching ferrite bodies and magnetic transducer heads including bodies so etched
GB2271880A (en) * 1992-10-20 1994-04-27 Mitsubishi Electric Corp Magnetic structure and magnetic head
WO2000004534A1 (en) * 1998-07-13 2000-01-27 Koninklijke Philips Electronics N.V. Method of manufacturing a thin-film magnetic head
DE102016120884A1 (de) * 2016-11-02 2018-05-03 Infineon Technologies Ag Integrierte Vorrichtung und Verfahren zum integrieren eines Induktors in ein Halbleitersubstrat

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1982000507A1 (en) * 1980-07-31 1982-02-18 A Braun Hermetic seal for compressors or the like
US4743988A (en) * 1985-02-01 1988-05-10 Victor Company Of Japan, Ltd. Thin-film magnetic head

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2000190A (en) * 1977-06-14 1979-01-04 Sony Corp Methods of electrolytically etching ferrite bodies and magnetic transducer heads including bodies so etched
GB2000190B (en) * 1977-06-14 1982-03-17 Sony Corp Methods of electrolytically etching ferrite bodies and magnetic transducer heads including bodies so etched
GB2271880A (en) * 1992-10-20 1994-04-27 Mitsubishi Electric Corp Magnetic structure and magnetic head
GB2271880B (en) * 1992-10-20 1997-04-09 Mitsubishi Electric Corp Magnetic structure and magnetic head using the same
US5883760A (en) * 1992-10-20 1999-03-16 Mitsubishi Denki Kabushiki Kaisha Magnetic structure and magnetic head using the same
US6236538B1 (en) 1992-10-20 2001-05-22 Mitsubishi Denki Kabushiki Kaisha Magnetic structure and magnetic head using the same
WO2000004534A1 (en) * 1998-07-13 2000-01-27 Koninklijke Philips Electronics N.V. Method of manufacturing a thin-film magnetic head
DE102016120884A1 (de) * 2016-11-02 2018-05-03 Infineon Technologies Ag Integrierte Vorrichtung und Verfahren zum integrieren eines Induktors in ein Halbleitersubstrat

Also Published As

Publication number Publication date
DE2341832A1 (de) 1974-03-14
IT994704B (it) 1975-10-20
FR2198266A1 (ja) 1974-03-29
DE2341832B2 (de) 1978-04-20
FR2198266B1 (ja) 1980-01-25
JPS5234346B2 (ja) 1977-09-02
CA991319A (en) 1976-06-15
DE2341832C3 (de) 1978-12-21
NL7211910A (ja) 1974-03-05
JPS4965785A (ja) 1974-06-26

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee