GB1429515A - Manufacture of encapsulated interconnection circuits, or inte grated magnetic memory matrices - Google Patents

Manufacture of encapsulated interconnection circuits, or inte grated magnetic memory matrices

Info

Publication number
GB1429515A
GB1429515A GB2420173A GB2420173A GB1429515A GB 1429515 A GB1429515 A GB 1429515A GB 2420173 A GB2420173 A GB 2420173A GB 2420173 A GB2420173 A GB 2420173A GB 1429515 A GB1429515 A GB 1429515A
Authority
GB
United Kingdom
Prior art keywords
strips
copper
manufacture
magnetic memory
applying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2420173A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Publication of GB1429515A publication Critical patent/GB1429515A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00—Thin magnetic films, e.g. of one-domain structure
    • H01F10/06—Thin magnetic films, e.g. of one-domain structure characterised by the coupling or physical contact with connecting or interacting conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0361—Etched tri-metal structure, i.e. metal layers or metal patterns on both sides of a different central metal layer which is later at least partly etched
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0376—Etching temporary metallic carrier substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
GB2420173A 1972-05-24 1973-05-21 Manufacture of encapsulated interconnection circuits, or inte grated magnetic memory matrices Expired GB1429515A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7218487A FR2185833B1 (US06653308-20031125-C00199.png) 1972-05-24 1972-05-24

Publications (1)

Publication Number Publication Date
GB1429515A true GB1429515A (en) 1976-03-24

Family

ID=9098999

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2420173A Expired GB1429515A (en) 1972-05-24 1973-05-21 Manufacture of encapsulated interconnection circuits, or inte grated magnetic memory matrices

Country Status (4)

Country Link
JP (1) JPS4956173A (US06653308-20031125-C00199.png)
DE (1) DE2326575A1 (US06653308-20031125-C00199.png)
FR (1) FR2185833B1 (US06653308-20031125-C00199.png)
GB (1) GB1429515A (US06653308-20031125-C00199.png)

Also Published As

Publication number Publication date
DE2326575A1 (de) 1973-12-06
FR2185833B1 (US06653308-20031125-C00199.png) 1976-08-06
JPS4956173A (US06653308-20031125-C00199.png) 1974-05-31
FR2185833A1 (US06653308-20031125-C00199.png) 1974-01-04

Similar Documents

Publication Publication Date Title
US4125441A (en) Isolated bump circuitry on tape utilizing electroforming
US3354360A (en) Integrated circuits with active elements isolated by insulating material
GB1445366A (en) Method of manufacturing a wafer holding conductor patterns upon two opposite faces electrochemical production of substituted pyridines
GB1239477A (US06653308-20031125-C00199.png)
JPS5334484A (en) Forming method for multi layer wiring
JPS5350686A (en) Production of semiconductor integrated circuit
GB1513116A (en) Formation of integrated circuits
GB1379558A (en) Methods of manufacture of multilayer circuit structures
US3401448A (en) Process for making photosensitive semiconductor devices
GB1239824A (en) Magnetic circuit element
JPS5571052A (en) Substrate for semiconductor device
GB1429515A (en) Manufacture of encapsulated interconnection circuits, or inte grated magnetic memory matrices
GB1221914A (en) Manufacture of integrated circuits
GB1143531A (US06653308-20031125-C00199.png)
GB1227090A (US06653308-20031125-C00199.png)
GB1522408A (en) Gang bonding interconnect tape for semiconductive devices and method of making same
JPS5283070A (en) Production of semiconductor device
GB1277172A (en) Method of making a large integrated circuit
GB1425732A (en) Methods of manufacturing printed circuits and a printed circuit produced by such method
JPS5299085A (en) Production of semiconductor device
FR2045025A5 (en) Thick-film circuits on flat substrates
JPS5645070A (en) Semiconductor integrated circuit device
JPS5649541A (en) Multilayer wiring structure for integrated circuit
JPS5263080A (en) Production of semiconductor integrated circuit device
JPS5211862A (en) Semiconductor device

Legal Events

Date Code Title Description
CSNS Application of which complete specification have been accepted and published, but patent is not sealed