GB1417802A - Lead frame and process facilitating the manufacture of electric devices having semiconductor chips placed in a face-to-face relation - Google Patents

Lead frame and process facilitating the manufacture of electric devices having semiconductor chips placed in a face-to-face relation

Info

Publication number
GB1417802A
GB1417802A GB627973A GB627973A GB1417802A GB 1417802 A GB1417802 A GB 1417802A GB 627973 A GB627973 A GB 627973A GB 627973 A GB627973 A GB 627973A GB 1417802 A GB1417802 A GB 1417802A
Authority
GB
United Kingdom
Prior art keywords
chips
members
lead
semi
apertures
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB627973A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of GB1417802A publication Critical patent/GB1417802A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
    • H10F55/20—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers
    • H10F55/25—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers wherein the radiation-sensitive devices and the electric light source are all semiconductor devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Device Packages (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
GB627973A 1972-03-15 1973-02-08 Lead frame and process facilitating the manufacture of electric devices having semiconductor chips placed in a face-to-face relation Expired GB1417802A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US23495572A 1972-03-15 1972-03-15

Publications (1)

Publication Number Publication Date
GB1417802A true GB1417802A (en) 1975-12-17

Family

ID=22883463

Family Applications (1)

Application Number Title Priority Date Filing Date
GB627973A Expired GB1417802A (en) 1972-03-15 1973-02-08 Lead frame and process facilitating the manufacture of electric devices having semiconductor chips placed in a face-to-face relation

Country Status (4)

Country Link
JP (1) JPS517979B2 (enExample)
DE (2) DE2312254C3 (enExample)
FR (1) FR2176103B1 (enExample)
GB (1) GB1417802A (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4952463U (enExample) * 1972-08-18 1974-05-09
DE3278187D1 (en) * 1982-09-09 1988-04-07 Gen Electric Semiconductor optocoupler
DE3424876A1 (de) * 1984-07-06 1986-02-06 Telefunken Fernseh Und Rundfunk Gmbh, 3000 Hannover Integrierter schaltkreis
US4694183A (en) * 1985-06-25 1987-09-15 Hewlett-Packard Company Optical isolator fabricated upon a lead frame
US5148243A (en) * 1985-06-25 1992-09-15 Hewlett-Packard Company Optical isolator with encapsulation
US5049527A (en) * 1985-06-25 1991-09-17 Hewlett-Packard Company Optical isolator
US4633582A (en) * 1985-08-14 1987-01-06 General Instrument Corporation Method for assembling an optoisolator and leadframe therefor
EP0273364B1 (en) * 1986-12-26 1992-03-25 Idec Izumi Corporation Electronic part carrying strip and method of manufacturing the same
DE4411345C1 (de) * 1994-03-31 1995-05-24 Amphenol Tuchel Elect Kontaktschalter
JP5889753B2 (ja) * 2012-08-31 2016-03-22 新電元工業株式会社 リードフレーム及び樹脂封止型半導体装置の製造方法
JP6189222B2 (ja) * 2014-01-20 2017-08-30 新電元工業株式会社 リードフレーム及びリードフレームの製造方法
JP6258044B2 (ja) * 2014-01-20 2018-01-10 新電元工業株式会社 リードフレーム及びリードフレームの製造方法
JP6352508B2 (ja) * 2017-07-27 2018-07-04 新電元工業株式会社 リードフレーム及びリードフレームの製造方法

Also Published As

Publication number Publication date
DE7309359U (de) 1973-07-12
FR2176103A1 (enExample) 1973-10-26
DE2312254B2 (de) 1980-05-22
DE2312254A1 (de) 1973-09-27
DE2312254C3 (de) 1981-02-05
JPS494979A (enExample) 1974-01-17
JPS517979B2 (enExample) 1976-03-12
FR2176103B1 (enExample) 1976-09-10

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee