GB1414289A - Copper material and uses thereof - Google Patents

Copper material and uses thereof

Info

Publication number
GB1414289A
GB1414289A GB1433274A GB1433274A GB1414289A GB 1414289 A GB1414289 A GB 1414289A GB 1433274 A GB1433274 A GB 1433274A GB 1433274 A GB1433274 A GB 1433274A GB 1414289 A GB1414289 A GB 1414289A
Authority
GB
United Kingdom
Prior art keywords
alloy
copper
april
manufacture
chill
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1433274A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wieland Werke AG
Original Assignee
Wieland Werke AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wieland Werke AG filed Critical Wieland Werke AG
Publication of GB1414289A publication Critical patent/GB1414289A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Continuous Casting (AREA)
  • Molds, Cores, And Manufacturing Methods Thereof (AREA)
  • Mold Materials And Core Materials (AREA)
  • Laminated Bodies (AREA)
GB1433274A 1973-04-13 1974-04-01 Copper material and uses thereof Expired GB1414289A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2318662A DE2318662C2 (de) 1973-04-13 1973-04-13 Verwendung eines Kupferwerkstoffes

Publications (1)

Publication Number Publication Date
GB1414289A true GB1414289A (en) 1975-11-19

Family

ID=5877952

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1433274A Expired GB1414289A (en) 1973-04-13 1974-04-01 Copper material and uses thereof

Country Status (5)

Country Link
JP (1) JPS508729A (enrdf_load_stackoverflow)
BE (1) BE813124A (enrdf_load_stackoverflow)
DE (1) DE2318662C2 (enrdf_load_stackoverflow)
FR (1) FR2225532A1 (enrdf_load_stackoverflow)
GB (1) GB1414289A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2181742A (en) * 1985-09-13 1987-04-29 Mitsubishi Metal Corp Copper alloy lead material for use in semiconductor device
US5306465A (en) * 1992-11-04 1994-04-26 Olin Corporation Copper alloy having high strength and high electrical conductivity
US5370840A (en) * 1992-11-04 1994-12-06 Olin Corporation Copper alloy having high strength and high electrical conductivity
US5486244A (en) * 1992-11-04 1996-01-23 Olin Corporation Process for improving the bend formability of copper alloys

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4377424A (en) * 1980-05-26 1983-03-22 Chuetsu Metal Works Co., Ltd. Mold of precipitation hardenable copper alloy for continuous casting mold
JPS60238432A (ja) * 1984-12-27 1985-11-27 Mitsubishi Metal Corp 連続鋳造鋳型用Ｃｕ合金

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2181742A (en) * 1985-09-13 1987-04-29 Mitsubishi Metal Corp Copper alloy lead material for use in semiconductor device
US4749548A (en) * 1985-09-13 1988-06-07 Mitsubishi Kinzoku Kabushiki Kaisha Copper alloy lead material for use in semiconductor device
GB2181742B (en) * 1985-09-13 1990-05-23 Mitsubishi Metal Corp Copper alloy lead material for use in semiconductor device
US5306465A (en) * 1992-11-04 1994-04-26 Olin Corporation Copper alloy having high strength and high electrical conductivity
US5370840A (en) * 1992-11-04 1994-12-06 Olin Corporation Copper alloy having high strength and high electrical conductivity
US5486244A (en) * 1992-11-04 1996-01-23 Olin Corporation Process for improving the bend formability of copper alloys
US5601665A (en) * 1992-11-04 1997-02-11 Olin Corporation Process for improving the bend formability of copper alloys

Also Published As

Publication number Publication date
DE2318662C2 (de) 1975-03-20
BE813124A (fr) 1974-07-31
FR2225532A1 (enrdf_load_stackoverflow) 1974-11-08
DE2318662B1 (de) 1974-08-08
JPS508729A (enrdf_load_stackoverflow) 1975-01-29

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee