GB1408148A - Electrodeposition of tin-lead alloys - Google Patents

Electrodeposition of tin-lead alloys

Info

Publication number
GB1408148A
GB1408148A GB5712372A GB5712372A GB1408148A GB 1408148 A GB1408148 A GB 1408148A GB 5712372 A GB5712372 A GB 5712372A GB 5712372 A GB5712372 A GB 5712372A GB 1408148 A GB1408148 A GB 1408148A
Authority
GB
United Kingdom
Prior art keywords
bath
lead
dec
electro
tin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5712372A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
M&T Chemicals Inc
Original Assignee
M&T Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by M&T Chemicals Inc filed Critical M&T Chemicals Inc
Publication of GB1408148A publication Critical patent/GB1408148A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
GB5712372A 1971-12-16 1972-12-11 Electrodeposition of tin-lead alloys Expired GB1408148A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US20888571A 1971-12-16 1971-12-16

Publications (1)

Publication Number Publication Date
GB1408148A true GB1408148A (en) 1975-10-01

Family

ID=22776434

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5712372A Expired GB1408148A (en) 1971-12-16 1972-12-11 Electrodeposition of tin-lead alloys

Country Status (8)

Country Link
US (1) US3749649A (cg-RX-API-DMAC10.html)
JP (1) JPS5629758B2 (cg-RX-API-DMAC10.html)
CA (1) CA1115654A (cg-RX-API-DMAC10.html)
DE (1) DE2256845A1 (cg-RX-API-DMAC10.html)
FR (1) FR2163453B1 (cg-RX-API-DMAC10.html)
GB (1) GB1408148A (cg-RX-API-DMAC10.html)
IT (1) IT970627B (cg-RX-API-DMAC10.html)
NL (1) NL7217115A (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3228911A1 (de) * 1981-09-08 1983-03-24 Occidental Chemical Corp., 48089 Warren, Mich. Bad fuer die galvanische abscheidung einer zinn-blei-legierung

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3850765A (en) * 1973-05-21 1974-11-26 Oxy Metal Finishing Corp Bright solder plating
SE390986B (sv) * 1973-10-18 1977-01-31 Modo Kemi Ab Forfarande for elektropletering aw beleggningar av tenn eller tenn- blylegerinh ur ett surt elektrolytbad
US4135991A (en) * 1977-08-12 1979-01-23 R. O. Hull & Company, Inc. Bath and method for electroplating tin and/or lead
NZ190645A (en) * 1978-06-16 1980-11-14 M & T Chemicals Inc Aqueous acid tin plating bath containing 2,5-dimethoxy-benzaldehyde as brightening agent
US4377449A (en) * 1979-12-31 1983-03-22 Bell Telephone Laboratories, Incorporated Electrolytic silver plating
US4379738A (en) * 1979-12-31 1983-04-12 Bell Telephone Laboratories, Incorporated Electroplating zinc
US4377448A (en) * 1979-12-31 1983-03-22 Bell Telephone Laboratories, Incorporated Electrolytic gold plating
US4263106A (en) * 1979-12-31 1981-04-21 Bell Telephone Laboratories, Incorporated Solder plating process
US4376018A (en) * 1979-12-31 1983-03-08 Bell Telephone Laboratories, Incorporated Electrodeposition of nickel
US4347107A (en) * 1981-04-02 1982-08-31 Hooker Chemicals & Plastics Corp. Electroplating tin and tin alloys and baths therefor
US5066367B1 (en) * 1981-09-11 1993-12-21 I. Nobel Fred Limiting tin sludge formation in tin or tin/lead electroplating solutions
US4871429A (en) * 1981-09-11 1989-10-03 Learonal, Inc Limiting tin sludge formation in tin or tin/lead electroplating solutions
US5094726B1 (en) * 1981-09-11 1993-12-21 I. Nobel Fred Limiting tin sludge formation in tin or tin/lead electroplating solutions
US4701244A (en) * 1983-12-22 1987-10-20 Learonal, Inc. Bath and process for electroplating tin, lead and tin/alloys
US4717460A (en) * 1983-12-22 1988-01-05 Learonal, Inc. Tin lead electroplating solutions
US4688899A (en) * 1984-07-27 1987-08-25 Casio Computer Co., Ltd. Dual-frequency, dielectric anisotropy liquid crystal display
JPS61117297A (ja) * 1984-11-13 1986-06-04 Ebara Yuujiraito Kk スズ属金属めつき液
US5174887A (en) * 1987-12-10 1992-12-29 Learonal, Inc. High speed electroplating of tinplate
EP0652306B1 (en) * 1987-12-10 2000-09-27 LeaRonal, Inc. Tin, lead or tin/lead alloy electrolytes for high-speed electroplating
JP2752046B2 (ja) * 1989-12-05 1998-05-18 株式会社村田製作所 クエン酸系錫または錫合金系めっき浴
CA2047502C (en) * 1991-07-22 1995-05-09 Peter Tsuk Selectively plating electrically conductive pin
US6562221B2 (en) 2001-09-28 2003-05-13 David Crotty Process and composition for high speed plating of tin and tin alloys
TWI268292B (en) * 2002-03-05 2006-12-11 Shipley Co Llc Limiting the loss of tin through oxidation in tin or tin alloy electroplating bath solutions
US20060172064A1 (en) * 2003-01-10 2006-08-03 Henkel Kommanditgesellschaft Auf Aktien Process of coating metals prior to cold forming
WO2004063414A2 (en) * 2003-01-10 2004-07-29 Henkel Kommanditgesellschaft Auf Aktien A coating composition
US7063735B2 (en) * 2003-01-10 2006-06-20 Henkel Kommanditgesellschaft Auf Aktien Coating composition
ES2354045T3 (es) 2005-02-28 2011-03-09 Rohm And Haas Electronic Materials, Llc Procedimientos con fundente mejorados.
JP6099256B2 (ja) 2012-01-20 2017-03-22 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ スズおよびスズ合金のための改良されたフラックス方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1141284A (en) * 1965-02-13 1969-01-29 Philips Electronic Associated Improvements in acid tin electroplating solutions
FR1539596A (fr) * 1967-10-06 1968-09-13 Hyogo Prefectural Government Procédé de revêtement électrolytique par un alliage brillant étain-plomb et nouveaux produits ainsi obtenus
US3785939A (en) * 1970-10-22 1974-01-15 Conversion Chem Corp Tin/lead plating bath and method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3228911A1 (de) * 1981-09-08 1983-03-24 Occidental Chemical Corp., 48089 Warren, Mich. Bad fuer die galvanische abscheidung einer zinn-blei-legierung

Also Published As

Publication number Publication date
NL7217115A (cg-RX-API-DMAC10.html) 1973-06-19
IT970627B (it) 1974-04-20
CA1115654A (en) 1982-01-05
DE2256845A1 (de) 1973-06-20
US3749649A (en) 1973-07-31
JPS4866537A (cg-RX-API-DMAC10.html) 1973-09-12
AU4828472A (en) 1974-05-02
FR2163453B1 (cg-RX-API-DMAC10.html) 1977-01-14
JPS5629758B2 (cg-RX-API-DMAC10.html) 1981-07-10
FR2163453A1 (cg-RX-API-DMAC10.html) 1973-07-27

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee