GB1405670A - Electrolytic soldering arrangement - Google Patents

Electrolytic soldering arrangement

Info

Publication number
GB1405670A
GB1405670A GB4719972A GB4719972A GB1405670A GB 1405670 A GB1405670 A GB 1405670A GB 4719972 A GB4719972 A GB 4719972A GB 4719972 A GB4719972 A GB 4719972A GB 1405670 A GB1405670 A GB 1405670A
Authority
GB
United Kingdom
Prior art keywords
electrolyte
container
capillary
drop
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4719972A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CII HONEYWELL BULL
Original Assignee
CII HONEYWELL BULL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CII HONEYWELL BULL filed Critical CII HONEYWELL BULL
Publication of GB1405670A publication Critical patent/GB1405670A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K28/00—Welding or cutting not covered by any of the preceding groups, e.g. electrolytic welding
    • B23K28/006—Welding metals by means of an electrolyte

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Filling, Topping-Up Batteries (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
GB4719972A 1971-10-13 1972-10-12 Electrolytic soldering arrangement Expired GB1405670A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7136714A FR2156981A5 (enrdf_load_stackoverflow) 1971-10-13 1971-10-13

Publications (1)

Publication Number Publication Date
GB1405670A true GB1405670A (en) 1975-09-10

Family

ID=9084282

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4719972A Expired GB1405670A (en) 1971-10-13 1972-10-12 Electrolytic soldering arrangement

Country Status (5)

Country Link
JP (1) JPS4846543A (enrdf_load_stackoverflow)
DE (1) DE2250366A1 (enrdf_load_stackoverflow)
FR (1) FR2156981A5 (enrdf_load_stackoverflow)
GB (1) GB1405670A (enrdf_load_stackoverflow)
IT (1) IT968765B (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001068951A1 (en) * 2000-03-13 2001-09-20 Technology Development Associate Operations Limited Electro-plating apparatus and a method of electro-plating
WO2001068949A1 (en) * 2000-03-13 2001-09-20 Technology Development Associate Operations Limited Electro-plating apparatus and method
CN112975212A (zh) * 2021-03-23 2021-06-18 贵研铂业股份有限公司 镍基/钛基/金基钎料用粘带钎料、制备方法及焊接工艺

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6547937B1 (en) * 2000-01-03 2003-04-15 Semitool, Inc. Microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4716582U (enrdf_load_stackoverflow) * 1971-03-23 1972-10-26

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001068951A1 (en) * 2000-03-13 2001-09-20 Technology Development Associate Operations Limited Electro-plating apparatus and a method of electro-plating
WO2001068949A1 (en) * 2000-03-13 2001-09-20 Technology Development Associate Operations Limited Electro-plating apparatus and method
AU775148B2 (en) * 2000-03-13 2004-07-22 Tdao Limited Electro-plating apparatus and method
CN112975212A (zh) * 2021-03-23 2021-06-18 贵研铂业股份有限公司 镍基/钛基/金基钎料用粘带钎料、制备方法及焊接工艺

Also Published As

Publication number Publication date
DE2250366A1 (de) 1973-04-19
IT968765B (it) 1974-03-20
JPS4846543A (enrdf_load_stackoverflow) 1973-07-03
FR2156981A5 (enrdf_load_stackoverflow) 1973-06-01

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee