GB1405670A - Electrolytic soldering arrangement - Google Patents
Electrolytic soldering arrangementInfo
- Publication number
- GB1405670A GB1405670A GB4719972A GB4719972A GB1405670A GB 1405670 A GB1405670 A GB 1405670A GB 4719972 A GB4719972 A GB 4719972A GB 4719972 A GB4719972 A GB 4719972A GB 1405670 A GB1405670 A GB 1405670A
- Authority
- GB
- United Kingdom
- Prior art keywords
- electrolyte
- container
- capillary
- drop
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K28/00—Welding or cutting not covered by any of the preceding groups, e.g. electrolytic welding
- B23K28/006—Welding metals by means of an electrolyte
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Filling, Topping-Up Batteries (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR7136714A FR2156981A5 (enrdf_load_stackoverflow) | 1971-10-13 | 1971-10-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1405670A true GB1405670A (en) | 1975-09-10 |
Family
ID=9084282
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB4719972A Expired GB1405670A (en) | 1971-10-13 | 1972-10-12 | Electrolytic soldering arrangement |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPS4846543A (enrdf_load_stackoverflow) |
| DE (1) | DE2250366A1 (enrdf_load_stackoverflow) |
| FR (1) | FR2156981A5 (enrdf_load_stackoverflow) |
| GB (1) | GB1405670A (enrdf_load_stackoverflow) |
| IT (1) | IT968765B (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001068951A1 (en) * | 2000-03-13 | 2001-09-20 | Technology Development Associate Operations Limited | Electro-plating apparatus and a method of electro-plating |
| WO2001068949A1 (en) * | 2000-03-13 | 2001-09-20 | Technology Development Associate Operations Limited | Electro-plating apparatus and method |
| CN112975212A (zh) * | 2021-03-23 | 2021-06-18 | 贵研铂业股份有限公司 | 镍基/钛基/金基钎料用粘带钎料、制备方法及焊接工艺 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6547937B1 (en) * | 2000-01-03 | 2003-04-15 | Semitool, Inc. | Microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4716582U (enrdf_load_stackoverflow) * | 1971-03-23 | 1972-10-26 |
-
1971
- 1971-10-13 FR FR7136714A patent/FR2156981A5/fr not_active Expired
-
1972
- 1972-10-10 IT IT3028472A patent/IT968765B/it active
- 1972-10-12 GB GB4719972A patent/GB1405670A/en not_active Expired
- 1972-10-13 JP JP10195572A patent/JPS4846543A/ja active Pending
- 1972-10-13 DE DE19722250366 patent/DE2250366A1/de not_active Ceased
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001068951A1 (en) * | 2000-03-13 | 2001-09-20 | Technology Development Associate Operations Limited | Electro-plating apparatus and a method of electro-plating |
| WO2001068949A1 (en) * | 2000-03-13 | 2001-09-20 | Technology Development Associate Operations Limited | Electro-plating apparatus and method |
| AU775148B2 (en) * | 2000-03-13 | 2004-07-22 | Tdao Limited | Electro-plating apparatus and method |
| CN112975212A (zh) * | 2021-03-23 | 2021-06-18 | 贵研铂业股份有限公司 | 镍基/钛基/金基钎料用粘带钎料、制备方法及焊接工艺 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE2250366A1 (de) | 1973-04-19 |
| JPS4846543A (enrdf_load_stackoverflow) | 1973-07-03 |
| FR2156981A5 (enrdf_load_stackoverflow) | 1973-06-01 |
| IT968765B (it) | 1974-03-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed | ||
| PCNP | Patent ceased through non-payment of renewal fee |