GB1401114A - Etching semiconductor devices - Google Patents

Etching semiconductor devices

Info

Publication number
GB1401114A
GB1401114A GB3800073A GB3800073A GB1401114A GB 1401114 A GB1401114 A GB 1401114A GB 3800073 A GB3800073 A GB 3800073A GB 3800073 A GB3800073 A GB 3800073A GB 1401114 A GB1401114 A GB 1401114A
Authority
GB
United Kingdom
Prior art keywords
etching
etchant
aug
concentration
semi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3800073A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of GB1401114A publication Critical patent/GB1401114A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/60—Wet etching
    • H10P50/64—Wet etching of semiconductor materials
    • H10P50/642—Chemical etching
    • H10P50/646—Chemical etching of Group III-V materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices

Landscapes

  • Weting (AREA)
  • ing And Chemical Polishing (AREA)
GB3800073A 1972-08-15 1973-08-10 Etching semiconductor devices Expired GB1401114A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/280,784 US3947304A (en) 1972-08-15 1972-08-15 Etching of group III-V semiconductors

Publications (1)

Publication Number Publication Date
GB1401114A true GB1401114A (en) 1975-07-16

Family

ID=23074635

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3800073A Expired GB1401114A (en) 1972-08-15 1973-08-10 Etching semiconductor devices

Country Status (9)

Country Link
US (1) US3947304A (enExample)
JP (1) JPS525231B2 (enExample)
BE (1) BE803610A (enExample)
CA (1) CA988817A (enExample)
FR (1) FR2196604A5 (enExample)
GB (1) GB1401114A (enExample)
IT (1) IT994153B (enExample)
NL (1) NL176412C (enExample)
SE (1) SE387198B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5631320A (en) * 1979-08-22 1981-03-30 Mitsubishi Electric Corp Grounddfault current detector
JPS5631321A (en) * 1979-08-22 1981-03-30 Mitsubishi Electric Corp Grounddfault current detector
JPS5635626A (en) * 1979-08-24 1981-04-08 Mitsubishi Electric Corp Dc leakage breaker
JPS5635627A (en) * 1979-08-24 1981-04-08 Mitsubishi Electric Corp Dc leakage breaker
US4354898A (en) * 1981-06-24 1982-10-19 Bell Telephone Laboratories, Incorporated Method of preferentially etching optically flat mirror facets in InGaAsP/InP heterostructures
US4765865A (en) * 1987-05-04 1988-08-23 Ford Motor Company Silicon etch rate enhancement
US20230230897A1 (en) * 2022-01-17 2023-07-20 Amulaire Thermal Technology, Inc. Automobile heat dissipation device having modified surface and surface modification and joint method for automobile heat dissipation device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3674580A (en) * 1970-05-08 1972-07-04 Bell Telephone Labor Inc Zirconium mask for semiconductor fabricated using alkaline etchants
US3716429A (en) * 1970-06-18 1973-02-13 Rca Corp Method of making semiconductor devices

Also Published As

Publication number Publication date
CA988817A (en) 1976-05-11
BE803610A (fr) 1973-12-03
SE387198B (sv) 1976-08-30
JPS525231B2 (enExample) 1977-02-10
US3947304A (en) 1976-03-30
NL176412B (nl) 1984-11-01
DE2340479A1 (de) 1974-03-14
IT994153B (it) 1975-10-20
FR2196604A5 (enExample) 1974-03-15
NL7311019A (enExample) 1974-02-19
NL176412C (nl) 1985-04-01
JPS4960478A (enExample) 1974-06-12
DE2340479B2 (de) 1977-04-14

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee