GB1394662A - Apparatus for the rapid cooling of a small mass such as a semiconductor cell - Google Patents

Apparatus for the rapid cooling of a small mass such as a semiconductor cell

Info

Publication number
GB1394662A
GB1394662A GB1907166A GB1907166A GB1394662A GB 1394662 A GB1394662 A GB 1394662A GB 1907166 A GB1907166 A GB 1907166A GB 1907166 A GB1907166 A GB 1907166A GB 1394662 A GB1394662 A GB 1394662A
Authority
GB
United Kingdom
Prior art keywords
pipe
chamber
refrigerant
valve
space
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1907166A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hawker Siddeley Dynamics Ltd
Original Assignee
Hawker Siddeley Dynamics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hawker Siddeley Dynamics Ltd filed Critical Hawker Siddeley Dynamics Ltd
Priority to GB1907166A priority Critical patent/GB1394662A/en
Priority to IT36262/67A priority patent/IT988003B/en
Priority to US635953A priority patent/US3899976A/en
Priority to FR104608A priority patent/FR1605429A/fr
Publication of GB1394662A publication Critical patent/GB1394662A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

1394662 Cooling of semi-conductor devices HAWKER SIDDELEY DYNAMICS Ltd 1 May 1967 [29 April 1966] 19071/66 Heading H1K [Also in Divisions F3-F4] A proximity fuse for a missile warhead and sensitive to infra red radiation comprises a semiconductor cell 15 mounted on a copper plate 14 within a vented shroud 11 having a sapphire window 19. A cooling chamber 23 is formed on the rear of the plate 14 by a frusto-conical porous walled member 21 of sintered bronze constituting a heat sink, the rear of the chamber being closed by a heat-insulating bush 22. A layer of felt 24 surrounds the sink 21 and bush 22. Refrigerant liquid is supplied to the chamber 23 by an inner pipe 25 having spray jets 27, the pipe 25 being connected to a refrigerant reservoir through a pipe 29 including an electrically controlled valve (Fig. 3, not shown). An outer pipe 26 encloses an annular space 38 with the pipe 25 and in this space is a heat exchange coil 37 connected through a pipe 36 and an electrically controlled valve to a high pressure air reservoir. The other end of the coil 37 opens into the chamber 23. One end of the space 38 is blocked at 39 and adjacent this block is an orifice 40 permitting the refrigerant to expand into the space 38. In use, to arm the missile, the valve in the pipe 29 is opened (e.g. by a time delay switch or a transmitted signal) and refrigerant sprays into the chamber 23 for three seconds. Then, the valve in pipe 36 opens and simultaneously another valve opens to vent the refrigerant reservoir. Air enters the chamber 23 through the previously cooled coil 37 and the resulting increased evaporation of the refrigerant enhances the cooling effect by inducing supercooling. The air supply flows for ten seconds. The cell 15 may comprise an indium (antimonide patch 16 deposited on a Sintox (Registered Trade Mark) substrate 17.
GB1907166A 1966-04-29 1966-04-29 Apparatus for the rapid cooling of a small mass such as a semiconductor cell Expired GB1394662A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
GB1907166A GB1394662A (en) 1966-04-29 1966-04-29 Apparatus for the rapid cooling of a small mass such as a semiconductor cell
IT36262/67A IT988003B (en) 1966-04-29 1967-04-21 DEVICE FOR QUICKLY BRINGING SMALL MASSES TO A LOW TEMPERATURE
US635953A US3899976A (en) 1966-04-29 1967-04-25 Cell cooling
FR104608A FR1605429A (en) 1966-04-29 1967-04-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1907166A GB1394662A (en) 1966-04-29 1966-04-29 Apparatus for the rapid cooling of a small mass such as a semiconductor cell

Publications (1)

Publication Number Publication Date
GB1394662A true GB1394662A (en) 1975-05-21

Family

ID=10123284

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1907166A Expired GB1394662A (en) 1966-04-29 1966-04-29 Apparatus for the rapid cooling of a small mass such as a semiconductor cell

Country Status (4)

Country Link
US (1) US3899976A (en)
FR (1) FR1605429A (en)
GB (1) GB1394662A (en)
IT (1) IT988003B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2133868A (en) * 1983-01-21 1984-08-01 British Aerospace Cooling apparatus
CN108560758A (en) * 2018-01-31 2018-09-21 海南鑫申绿色建筑科技有限公司 A kind of multifunctional wall body for lightning protection

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7673565B1 (en) * 1976-10-14 2010-03-09 Bae Systems Plc Infra red proximity fuzes
US4079595A (en) * 1977-01-12 1978-03-21 The United States Of America As Represented By The Secretary Of The Air Force Fusible heat sink for a cryogenic refrigerator
US4679634A (en) * 1986-02-11 1987-07-14 Bulmahn Gerald L Apparatus for extending the frame of a tractor
GB2404009B (en) * 2003-07-17 2005-06-15 Enfis Ltd Cooling method and apparatus

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3315478A (en) * 1965-06-29 1967-04-25 Hughes Aircraft Co Cryogenic transfer arrangement
US3314473A (en) * 1965-07-16 1967-04-18 Gen Dynamics Corp Crystal growth control in heat exchangers
US3372556A (en) * 1966-03-25 1968-03-12 Gen Dynamics Corp Retractable cryogenic assembly

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2133868A (en) * 1983-01-21 1984-08-01 British Aerospace Cooling apparatus
CN108560758A (en) * 2018-01-31 2018-09-21 海南鑫申绿色建筑科技有限公司 A kind of multifunctional wall body for lightning protection
CN108560758B (en) * 2018-01-31 2019-02-26 海南鑫申绿色建筑科技有限公司 A kind of multifunctional wall body for lightning protection

Also Published As

Publication number Publication date
US3899976A (en) 1975-08-19
IT988003B (en) 1975-04-10
FR1605429A (en) 1975-10-17

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees