GB1385282A - Iamge pick up devices - Google Patents

Iamge pick up devices

Info

Publication number
GB1385282A
GB1385282A GB5901672A GB5901672A GB1385282A GB 1385282 A GB1385282 A GB 1385282A GB 5901672 A GB5901672 A GB 5901672A GB 5901672 A GB5901672 A GB 5901672A GB 1385282 A GB1385282 A GB 1385282A
Authority
GB
United Kingdom
Prior art keywords
wafer
charge
transfer
wells
carriers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5901672A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of GB1385282A publication Critical patent/GB1385282A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/105Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including field-effect components
    • H01L27/1055Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including field-effect components comprising charge coupled devices of the so-called bucket brigade type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/148Charge coupled imagers
    • H01L27/14831Area CCD imagers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/10Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/107Substrate region of field-effect devices
    • H01L29/1091Substrate region of field-effect devices of charge coupled devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/762Charge transfer devices
    • H01L29/765Charge-coupled devices
    • H01L29/768Charge-coupled devices with field effect produced by an insulated gate

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Electromagnetism (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Abstract

1385282 Image pick-up devices WESTERN ELECTRIC CO Inc 21 Dec 1972 [23 Dec 1971] 59016/72 Heading H1K An image pick-up device comprises a wafer of photoconductive material, means for producing an array of potential wells at one face of the wafer in which optically generated charge carriers are stored, and at least one charge transfer channel at the opposite face of the wafer to which the stored carriers can be transferred in operation. A typical device consists of a 15Á thick N type wafer, e.g. of silicon having on one surface a layer of silicon oxide covered by a transparent electrode layer of gold or tin oxide. An array of potential wells is provided by constructing the oxide, layer with an array of thinner portions or forming an array of zones of immobile charge, e.g. in the oxide or preferably as P type zones in the silicon, beneath the electrode layer. In operation, with the electrode negative, minority carriers generated in the silicon by light incident on the electrode collect in the potential wells and are periodically transferred to charge transfer channels on the opposite wafer face which may be of the bucket brigade (Fig. 3, not shown) or charge-coupled (Figs. 1 and 4, not shown) type. Transfer is effected by appropriately biasing the field electrodes of the channels to cause diffusion of the carriers, in which case the wafer should be thinner than the diffusion length, or to provide depletion layers extending to the potential wells to produce a drift field, e.g. when using a wafer of GaAs, to speed up transfer. The wells generally form a co-ordinate matrix and are preferably aligned with field electrodes of the channels, though there may be more wells than field electrodes in which case the optical resolution is determined by the spacing of the latter. To facilitate mounting the wafer may have a thicker periphery and be attached by resin or rubber to a ceramic substrate carrying a suitable pattern of conductors. After transfer of the stored charge recharging of the wells continues while the transferred charge is read out by applying scanning voltages to the field electrodes of the channel to transfer it to a detector. The matrix may be scanned a row or a column at a time as described with reference to Figs. 5 and 6 respectively (not shown). Successful operation at low light levels can be achieved by biasing so that impact ionization of the light generated carriers occurs.
GB5901672A 1971-12-23 1972-12-21 Iamge pick up devices Expired GB1385282A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US21151471A 1971-12-23 1971-12-23

Publications (1)

Publication Number Publication Date
GB1385282A true GB1385282A (en) 1975-02-26

Family

ID=22787238

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5901672A Expired GB1385282A (en) 1971-12-23 1972-12-21 Iamge pick up devices

Country Status (13)

Country Link
JP (1) JPS5547506B2 (en)
AT (1) AT326741B (en)
BE (1) BE793094A (en)
CA (1) CA970864A (en)
CH (1) CH551693A (en)
DE (1) DE2262047C2 (en)
ES (1) ES410300A1 (en)
FR (1) FR2164912B1 (en)
GB (1) GB1385282A (en)
IL (1) IL41127A (en)
IT (1) IT974046B (en)
NL (1) NL7217547A (en)
SE (1) SE386045B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1987003388A1 (en) * 1985-11-26 1987-06-04 Jabali Pty Ltd., Photo-electric imaging device
EP1855321A2 (en) * 1996-11-01 2007-11-14 The Regents of the University of California Low-resistivity photon-transparent window attached to photo-senstive silicon detector

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4949579A (en) * 1972-09-14 1974-05-14
JPS5046033A (en) * 1973-08-28 1975-04-24
FR2259438B1 (en) * 1974-01-24 1976-10-08 Commissariat Energie Atomique
GB1532859A (en) * 1976-03-30 1978-11-22 Mullard Ltd Charge coupled circuit arrangements and devices
JPS537121A (en) * 1976-07-09 1978-01-23 Toshiba Corp Electric charge transfer unit
JPS5726481A (en) * 1980-07-23 1982-02-12 Matsushita Electric Ind Co Ltd Solid state image pickup device
JPS60173239A (en) * 1984-02-16 1985-09-06 日鐵建材工業株式会社 Deck plate for synthetic floor

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3700932A (en) * 1970-02-16 1972-10-24 Bell Telephone Labor Inc Charge coupled devices

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1987003388A1 (en) * 1985-11-26 1987-06-04 Jabali Pty Ltd., Photo-electric imaging device
US4771183A (en) * 1985-11-26 1988-09-13 Jabali Pty. Ltd. Photo-electric imaging device having overlaying row and column electrodes forming discrete, independently addressable areas
EP1855321A2 (en) * 1996-11-01 2007-11-14 The Regents of the University of California Low-resistivity photon-transparent window attached to photo-senstive silicon detector
EP1855321A3 (en) * 1996-11-01 2008-08-06 The Regents of the University of California Back-illuminated fully depleted charge coupled device comprising low-resistivity transparent window layer

Also Published As

Publication number Publication date
IL41127A0 (en) 1973-02-28
DE2262047C2 (en) 1983-03-17
BE793094A (en) 1973-04-16
AT326741B (en) 1975-12-29
FR2164912B1 (en) 1977-04-08
JPS4874190A (en) 1973-10-05
ES410300A1 (en) 1975-12-01
CH551693A (en) 1974-07-15
DE2262047A1 (en) 1973-07-05
SE386045B (en) 1976-07-26
CA970864A (en) 1975-07-08
IT974046B (en) 1974-06-20
JPS5547506B2 (en) 1980-12-01
FR2164912A1 (en) 1973-08-03
NL7217547A (en) 1973-06-26
IL41127A (en) 1976-03-31
ATA1099772A (en) 1975-03-15

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee