GB1383165A - Manufacturing semiconductor devices - Google Patents

Manufacturing semiconductor devices

Info

Publication number
GB1383165A
GB1383165A GB2048273A GB2048273A GB1383165A GB 1383165 A GB1383165 A GB 1383165A GB 2048273 A GB2048273 A GB 2048273A GB 2048273 A GB2048273 A GB 2048273A GB 1383165 A GB1383165 A GB 1383165A
Authority
GB
United Kingdom
Prior art keywords
wafers
rod
plane
spine
april
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2048273A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of GB1383165A publication Critical patent/GB1383165A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Weting (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
GB2048273A 1972-04-28 1973-04-30 Manufacturing semiconductor devices Expired GB1383165A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP47043061A JPS495265A (https=) 1972-04-28 1972-04-28

Publications (1)

Publication Number Publication Date
GB1383165A true GB1383165A (en) 1975-02-05

Family

ID=12653339

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2048273A Expired GB1383165A (en) 1972-04-28 1973-04-30 Manufacturing semiconductor devices

Country Status (5)

Country Link
JP (1) JPS495265A (https=)
DE (1) DE2321501A1 (https=)
FR (1) FR2182216B1 (https=)
GB (1) GB1383165A (https=)
NL (1) NL7305945A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3840588C1 (en) * 1988-12-02 1990-02-22 Westdeutsche Quarzschmelze Gmbh & Co. Kg, 2054 Geesthacht, De Quartz glass container for the thermal treatment of semiconductor wafers
EP1575087A3 (en) * 2000-11-29 2006-01-18 Origin Energy Solar Pty.Ltd Semiconductor wafer processing to increase the usable planar surface area
US7828983B2 (en) 2001-11-29 2010-11-09 Transform Solar Pty Ltd Semiconductor texturing process

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5255537A (en) * 1975-10-31 1977-05-07 Sumitomo Electric Ind Ltd Chargning device
JPS5421727A (en) * 1977-07-19 1979-02-19 Ricoh Co Ltd Detecting and treating method for wire rupture of corona discharge of copier
DE102006060195A1 (de) * 2006-12-18 2008-06-26 Jacobs University Bremen Ggmbh Kantenverrundung von Wafern

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3128213A (en) * 1961-07-20 1964-04-07 Int Rectifier Corp Method of making a semiconductor device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3840588C1 (en) * 1988-12-02 1990-02-22 Westdeutsche Quarzschmelze Gmbh & Co. Kg, 2054 Geesthacht, De Quartz glass container for the thermal treatment of semiconductor wafers
EP1575087A3 (en) * 2000-11-29 2006-01-18 Origin Energy Solar Pty.Ltd Semiconductor wafer processing to increase the usable planar surface area
EP1342259A4 (en) * 2000-11-29 2006-04-05 Origin Energy Solar Pty Ltd SEMICONDUCTOR-WAFER PROCESSING TO ENLARGE THE USEFUL PLANAR SURFACE CONTENT
US7595543B2 (en) 2000-11-29 2009-09-29 Australian National University Semiconductor processing method for increasing usable surface area of a semiconductor wafer
US7875794B2 (en) 2000-11-29 2011-01-25 Transform Solar Pty Ltd Semiconductor wafer processing to increase the usable planar surface area
US9583668B2 (en) 2000-11-29 2017-02-28 The Australian National University Semiconductor device
US7828983B2 (en) 2001-11-29 2010-11-09 Transform Solar Pty Ltd Semiconductor texturing process

Also Published As

Publication number Publication date
FR2182216B1 (https=) 1977-08-19
JPS495265A (https=) 1974-01-17
DE2321501A1 (de) 1973-11-15
NL7305945A (https=) 1973-10-30
FR2182216A1 (https=) 1973-12-07

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PE20 Patent expired after termination of 20 years

Effective date: 19930429