JPS495265A - - Google Patents

Info

Publication number
JPS495265A
JPS495265A JP47043061A JP4306172A JPS495265A JP S495265 A JPS495265 A JP S495265A JP 47043061 A JP47043061 A JP 47043061A JP 4306172 A JP4306172 A JP 4306172A JP S495265 A JPS495265 A JP S495265A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP47043061A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP47043061A priority Critical patent/JPS495265A/ja
Priority to FR7315498A priority patent/FR2182216B1/fr
Priority to DE2321501A priority patent/DE2321501A1/de
Priority to NL7305945A priority patent/NL7305945A/xx
Priority to GB2048273A priority patent/GB1383165A/en
Publication of JPS495265A publication Critical patent/JPS495265A/ja
Priority to US05/515,105 priority patent/US3936328A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Weting (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
JP47043061A 1972-04-28 1972-04-28 Pending JPS495265A (https=)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP47043061A JPS495265A (https=) 1972-04-28 1972-04-28
FR7315498A FR2182216B1 (https=) 1972-04-28 1973-04-27
DE2321501A DE2321501A1 (de) 1972-04-28 1973-04-27 Herstellungsverfahren fuer halbleiterelemente
NL7305945A NL7305945A (https=) 1972-04-28 1973-04-27
GB2048273A GB1383165A (en) 1972-04-28 1973-04-30 Manufacturing semiconductor devices
US05/515,105 US3936328A (en) 1972-04-28 1974-10-15 Process of manufacturing semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP47043061A JPS495265A (https=) 1972-04-28 1972-04-28

Publications (1)

Publication Number Publication Date
JPS495265A true JPS495265A (https=) 1974-01-17

Family

ID=12653339

Family Applications (1)

Application Number Title Priority Date Filing Date
JP47043061A Pending JPS495265A (https=) 1972-04-28 1972-04-28

Country Status (5)

Country Link
JP (1) JPS495265A (https=)
DE (1) DE2321501A1 (https=)
FR (1) FR2182216B1 (https=)
GB (1) GB1383165A (https=)
NL (1) NL7305945A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5255537A (en) * 1975-10-31 1977-05-07 Sumitomo Electric Ind Ltd Chargning device
JPS5421727A (en) * 1977-07-19 1979-02-19 Ricoh Co Ltd Detecting and treating method for wire rupture of corona discharge of copier

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3840588C1 (en) * 1988-12-02 1990-02-22 Westdeutsche Quarzschmelze Gmbh & Co. Kg, 2054 Geesthacht, De Quartz glass container for the thermal treatment of semiconductor wafers
AUPR174800A0 (en) 2000-11-29 2000-12-21 Australian National University, The Semiconductor processing
MY144264A (en) 2001-11-29 2011-08-29 Transform Solar Pty Ltd Semiconductur texturing process
DE102006060195A1 (de) * 2006-12-18 2008-06-26 Jacobs University Bremen Ggmbh Kantenverrundung von Wafern

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3128213A (en) * 1961-07-20 1964-04-07 Int Rectifier Corp Method of making a semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3128213A (en) * 1961-07-20 1964-04-07 Int Rectifier Corp Method of making a semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5255537A (en) * 1975-10-31 1977-05-07 Sumitomo Electric Ind Ltd Chargning device
JPS5421727A (en) * 1977-07-19 1979-02-19 Ricoh Co Ltd Detecting and treating method for wire rupture of corona discharge of copier

Also Published As

Publication number Publication date
GB1383165A (en) 1975-02-05
FR2182216B1 (https=) 1977-08-19
DE2321501A1 (de) 1973-11-15
NL7305945A (https=) 1973-10-30
FR2182216A1 (https=) 1973-12-07

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