GB1382203A - Package for microwave semiconductor device - Google Patents

Package for microwave semiconductor device

Info

Publication number
GB1382203A
GB1382203A GB2331873A GB2331873A GB1382203A GB 1382203 A GB1382203 A GB 1382203A GB 2331873 A GB2331873 A GB 2331873A GB 2331873 A GB2331873 A GB 2331873A GB 1382203 A GB1382203 A GB 1382203A
Authority
GB
United Kingdom
Prior art keywords
package
conductive films
header
semi
insert
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2331873A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Northrop Grumman Space and Mission Systems Corp
Original Assignee
TRW Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TRW Inc filed Critical TRW Inc
Publication of GB1382203A publication Critical patent/GB1382203A/en
Expired legal-status Critical Current

Links

Classifications

    • H10W44/20—
    • H10W44/226—
    • H10W72/50—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Microwave Amplifiers (AREA)
GB2331873A 1972-05-31 1973-05-16 Package for microwave semiconductor device Expired GB1382203A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US25815872A 1972-05-31 1972-05-31

Publications (1)

Publication Number Publication Date
GB1382203A true GB1382203A (en) 1975-01-29

Family

ID=22979338

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2331873A Expired GB1382203A (en) 1972-05-31 1973-05-16 Package for microwave semiconductor device

Country Status (4)

Country Link
US (1) US3801938A (cg-RX-API-DMAC10.html)
JP (1) JPS5126785B2 (cg-RX-API-DMAC10.html)
FR (1) FR2186738A1 (cg-RX-API-DMAC10.html)
GB (1) GB1382203A (cg-RX-API-DMAC10.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2132015A (en) * 1982-12-01 1984-06-27 Ates Componenti Elettron Improvements in or relating to semiconductor device encapsulations and mountings
EP2165360A1 (en) * 2007-06-14 2010-03-24 Raytheon Company Method for packaging semiconductors at a wafer level

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3916434A (en) * 1972-11-30 1975-10-28 Power Hybrids Inc Hermetically sealed encapsulation of semiconductor devices
JPS5758783B2 (cg-RX-API-DMAC10.html) * 1973-02-22 1982-12-11 Nippon Electric Co
US3936864A (en) * 1973-05-18 1976-02-03 Raytheon Company Microwave transistor package
US4107728A (en) * 1977-01-07 1978-08-15 Varian Associates, Inc. Package for push-pull semiconductor devices
US4193083A (en) * 1977-01-07 1980-03-11 Varian Associates, Inc. Package for push-pull semiconductor devices
JPS53116173U (cg-RX-API-DMAC10.html) * 1977-02-23 1978-09-14
US4266090A (en) * 1978-09-14 1981-05-05 Isotronics, Incorporated All metal flat package
JPS5834755Y2 (ja) * 1978-09-18 1983-08-04 富士通株式会社 半導体装置
US4630174A (en) * 1983-10-31 1986-12-16 Kaufman Lance R Circuit package with external circuit board and connection
CA1264380C (en) * 1985-01-30 1990-01-09 SEMICONDUCTOR DEVICE BOX WITH INTEGRATED GROUNDING CONDUCTOR AND SIDEWALL
US4805420A (en) * 1987-06-22 1989-02-21 Ncr Corporation Cryogenic vessel for cooling electronic components
US5334962A (en) * 1987-09-18 1994-08-02 Q-Dot Inc. High-speed data supply pathway systems
US6072211A (en) * 1998-08-03 2000-06-06 Motorola, Inc. Semiconductor package
JP6852841B2 (ja) * 2016-12-28 2021-03-31 住友電工デバイス・イノベーション株式会社 半導体装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202925C (cg-RX-API-DMAC10.html) * 1969-04-30 1900-01-01
US3515959A (en) * 1967-04-19 1970-06-02 Gen Electric Plural motor proportional speed control using pulse responsive speed controls
US3649872A (en) * 1970-07-15 1972-03-14 Trw Inc Packaging structure for high-frequency semiconductor devices
US3681513A (en) * 1971-01-26 1972-08-01 American Lava Corp Hermetic power package
US3683241A (en) * 1971-03-08 1972-08-08 Communications Transistor Corp Radio frequency transistor package

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2132015A (en) * 1982-12-01 1984-06-27 Ates Componenti Elettron Improvements in or relating to semiconductor device encapsulations and mountings
EP2165360A1 (en) * 2007-06-14 2010-03-24 Raytheon Company Method for packaging semiconductors at a wafer level

Also Published As

Publication number Publication date
US3801938A (en) 1974-04-02
JPS4951878A (cg-RX-API-DMAC10.html) 1974-05-20
JPS5126785B2 (cg-RX-API-DMAC10.html) 1976-08-09
FR2186738A1 (cg-RX-API-DMAC10.html) 1974-01-11

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees