GB1089514A - Transistor circuits - Google Patents

Transistor circuits

Info

Publication number
GB1089514A
GB1089514A GB428964A GB428964A GB1089514A GB 1089514 A GB1089514 A GB 1089514A GB 428964 A GB428964 A GB 428964A GB 428964 A GB428964 A GB 428964A GB 1089514 A GB1089514 A GB 1089514A
Authority
GB
United Kingdom
Prior art keywords
jig
contact lands
transistor circuits
substrate
transistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB428964A
Inventor
Geoffrey Joseph Shrank
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ultra Electronics Ltd
Original Assignee
Ultra Electronics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ultra Electronics Ltd filed Critical Ultra Electronics Ltd
Priority to GB428964A priority Critical patent/GB1089514A/en
Publication of GB1089514A publication Critical patent/GB1089514A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

Abstract

1,089,514. Semi-conductor devices. ULTRA ELECTRONICS Ltd. Feb. 25, 1965 [Jan. 31, 1964], No. 4289/64. Heading H1K. A transistor formed in a wafer of semiconductor material and having large contact lands on one face is soldered directly on to a thin film circuit board. As shown, transistors 16, each comprising a silicon substrate 11 with a transistor element 12 surrounded by contact lands 13 which are vapour deposited and then tinned, Fig. 1 (not shown), are placed in recesses 15 in a jig 14 which is then heated. A substrate 17 carrying a circuit 18 is lowered on to the jig which is then allowed to cool.
GB428964A 1964-01-31 1964-01-31 Transistor circuits Expired GB1089514A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB428964A GB1089514A (en) 1964-01-31 1964-01-31 Transistor circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB428964A GB1089514A (en) 1964-01-31 1964-01-31 Transistor circuits

Publications (1)

Publication Number Publication Date
GB1089514A true GB1089514A (en) 1967-11-01

Family

ID=9774341

Family Applications (1)

Application Number Title Priority Date Filing Date
GB428964A Expired GB1089514A (en) 1964-01-31 1964-01-31 Transistor circuits

Country Status (1)

Country Link
GB (1) GB1089514A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0103889A2 (en) * 1982-09-20 1984-03-28 Siemens Aktiengesellschaft Method and device to mount single integrated circuits on film (micropacks)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0103889A2 (en) * 1982-09-20 1984-03-28 Siemens Aktiengesellschaft Method and device to mount single integrated circuits on film (micropacks)
EP0103889A3 (en) * 1982-09-20 1985-10-30 Siemens Aktiengesellschaft Method and device to mount single integrated circuits on film (micropacks)

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