GB1376909A - Manufacturing process for printed electric circuits - Google Patents

Manufacturing process for printed electric circuits

Info

Publication number
GB1376909A
GB1376909A GB5996971A GB5996971A GB1376909A GB 1376909 A GB1376909 A GB 1376909A GB 5996971 A GB5996971 A GB 5996971A GB 5996971 A GB5996971 A GB 5996971A GB 1376909 A GB1376909 A GB 1376909A
Authority
GB
United Kingdom
Prior art keywords
metallic coating
resist
coating
circuits
aluminium base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5996971A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Calor y Frio Industrial SA CYFISA
Original Assignee
Calor y Frio Industrial SA CYFISA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Calor y Frio Industrial SA CYFISA filed Critical Calor y Frio Industrial SA CYFISA
Priority to GB5996971A priority Critical patent/GB1376909A/en
Publication of GB1376909A publication Critical patent/GB1376909A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/1344—Spraying small metal particles or droplets of molten metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

1376909 Printed circuits CALOR Y FRIO INDUSTRIAL SA 23 Dec 1971 59969/71 Heading H1R A method of manufacturing printed electric circuits comprises heating the surface of a dielectric coated conductive substrate to render it sufficiently adhesive to receive a metallic coating without impairing the insulating properties of the coating. The substrate preferably comprises vitreous coated steel. The metallic coating, preferably of an aluminium base material, is applied by spraying such that the surface is covered in a uniform manner. Resist material, suitably synthetic resin, is applied over the metallic coating in a predetermined configuration either by the use of a mask or screen or by covering the entire coating and then removing selected portions of the resist. The exposed regions of the metallic coating are then removed by exposure to a chemical solution, preferably an aqueous solution o sodium hydroxide if the metallic coating is an aluminium base material, such that the remaining metallic coating conforms to the configuration of the resist material which is itself removed chemically and/or mechanically. In some cases the resist is only removed where terminal end connections to external circuits are required, said terminal ends being widened by the application of conducting material, e.g. copper.
GB5996971A 1971-12-23 1971-12-23 Manufacturing process for printed electric circuits Expired GB1376909A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB5996971A GB1376909A (en) 1971-12-23 1971-12-23 Manufacturing process for printed electric circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB5996971A GB1376909A (en) 1971-12-23 1971-12-23 Manufacturing process for printed electric circuits

Publications (1)

Publication Number Publication Date
GB1376909A true GB1376909A (en) 1974-12-11

Family

ID=10484770

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5996971A Expired GB1376909A (en) 1971-12-23 1971-12-23 Manufacturing process for printed electric circuits

Country Status (1)

Country Link
GB (1) GB1376909A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1199915A2 (en) * 2000-10-21 2002-04-24 Hella KG Hueck & Co. Circuit structures on thermally sprayed layers

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1199915A2 (en) * 2000-10-21 2002-04-24 Hella KG Hueck & Co. Circuit structures on thermally sprayed layers
EP1199915A3 (en) * 2000-10-21 2004-04-07 Hella KG Hueck & Co. Circuit structures on thermally sprayed layers

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee