GB1369029A - Method of and apparatus for the removal of film layers from a surface - Google Patents

Method of and apparatus for the removal of film layers from a surface

Info

Publication number
GB1369029A
GB1369029A GB5573671A GB5573671A GB1369029A GB 1369029 A GB1369029 A GB 1369029A GB 5573671 A GB5573671 A GB 5573671A GB 5573671 A GB5573671 A GB 5573671A GB 1369029 A GB1369029 A GB 1369029A
Authority
GB
United Kingdom
Prior art keywords
aperture
cutter
layer
removal
film layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5573671A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
INT COMUPUTERS Ltd
Original Assignee
INT COMUPUTERS Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by INT COMUPUTERS Ltd filed Critical INT COMUPUTERS Ltd
Priority to GB5573671A priority Critical patent/GB1369029A/en
Publication of GB1369029A publication Critical patent/GB1369029A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/288—Removal of non-metallic coatings, e.g. for repairing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/043—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a moving tool for milling or cutting the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0242—Cutting around hole, e.g. for disconnecting land or Plated Through-Hole [PTH] or for partly removing a PTH
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1394—Covering open PTHs, e.g. by dry film resist or by metal disc
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

1369029 Punching apparatus INTERNATIONAL COMPUTERS Ltd 28 Nov 1972 [1 Dec 1971] 55736/71 Heading B4B [Also in Division H1] A method of removing a portion of a layer of material 4 from a planar structure 1, the portion extending over an aperture 6 in the structure comprises positioning an annular cutter 7 above the aperture, aligning a support (or a second cutter 10) below the aperture on the other side of the structure, ensuring accurate location of the cutter(s) using a location member 13 extending at least partly into the aperture, bringing the cutter 7 down on to the layer 4 to cut same, and removing the severed portion through the aperture using a punch 16. The method may be used to remove a photoresist layer 4 and its protective layer 5 from a printed circuit board supporting a copper layer 3, the aperture being used later accurately to align the pattern mask. As shown two cutters 7, 10 may be used to sever layers 4 on both sides of the structure 1.
GB5573671A 1972-11-28 1972-11-28 Method of and apparatus for the removal of film layers from a surface Expired GB1369029A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB5573671A GB1369029A (en) 1972-11-28 1972-11-28 Method of and apparatus for the removal of film layers from a surface

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB5573671A GB1369029A (en) 1972-11-28 1972-11-28 Method of and apparatus for the removal of film layers from a surface

Publications (1)

Publication Number Publication Date
GB1369029A true GB1369029A (en) 1974-10-02

Family

ID=10474749

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5573671A Expired GB1369029A (en) 1972-11-28 1972-11-28 Method of and apparatus for the removal of film layers from a surface

Country Status (1)

Country Link
GB (1) GB1369029A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2121344A (en) * 1982-05-29 1983-12-21 Bielomatik Leuze & Co Device for the introduction of holes into thick piles of paper
EP0108254A1 (en) * 1982-10-28 1984-05-16 International Business Machines Corporation Pressure foot assembly for an end mill delete cutter
DE102005021495A1 (en) * 2005-05-10 2006-11-16 Robert Bosch Gmbh Method for local removal of covering compound e.g. for circuit board, has part-surface not to be processed covered with hole-mask

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2121344A (en) * 1982-05-29 1983-12-21 Bielomatik Leuze & Co Device for the introduction of holes into thick piles of paper
EP0108254A1 (en) * 1982-10-28 1984-05-16 International Business Machines Corporation Pressure foot assembly for an end mill delete cutter
US4515505A (en) * 1982-10-28 1985-05-07 International Business Machines Corporation Pressure foot assembly for an end mill delete cutter
DE102005021495A1 (en) * 2005-05-10 2006-11-16 Robert Bosch Gmbh Method for local removal of covering compound e.g. for circuit board, has part-surface not to be processed covered with hole-mask

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee