GB1365261A - Interconnections for integrated arrangements - Google Patents

Interconnections for integrated arrangements

Info

Publication number
GB1365261A
GB1365261A GB2664372A GB2664372A GB1365261A GB 1365261 A GB1365261 A GB 1365261A GB 2664372 A GB2664372 A GB 2664372A GB 2664372 A GB2664372 A GB 2664372A GB 1365261 A GB1365261 A GB 1365261A
Authority
GB
United Kingdom
Prior art keywords
layer
interconnection
june
emitter
interconnections
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2664372A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Societe Europeenne de Semi Conducteurs de Microelectronique SA SESCOSEM
Original Assignee
Societe Europeenne de Semi Conducteurs de Microelectronique SA SESCOSEM
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Societe Europeenne de Semi Conducteurs de Microelectronique SA SESCOSEM filed Critical Societe Europeenne de Semi Conducteurs de Microelectronique SA SESCOSEM
Publication of GB1365261A publication Critical patent/GB1365261A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/43—Encapsulations, e.g. protective coatings characterised by their materials comprising oxides, nitrides or carbides, e.g. ceramics or glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Bipolar Transistors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
GB2664372A 1971-06-09 1972-06-07 Interconnections for integrated arrangements Expired GB1365261A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7120940A FR2140309B1 (enExample) 1971-06-09 1971-06-09

Publications (1)

Publication Number Publication Date
GB1365261A true GB1365261A (en) 1974-08-29

Family

ID=9078371

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2664372A Expired GB1365261A (en) 1971-06-09 1972-06-07 Interconnections for integrated arrangements

Country Status (4)

Country Link
US (1) US3826956A (enExample)
DE (1) DE2228293A1 (enExample)
FR (1) FR2140309B1 (enExample)
GB (1) GB1365261A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2640903A1 (de) * 1976-09-10 1978-03-16 Siemens Ag Verfahren zur herstellung definierter abmessungen von aus mindestens zwei schichten unterschiedlicher metalle zusammengesetzten leitbahnen integrierter schaltkreise
DE2902665A1 (de) * 1979-01-24 1980-08-07 Siemens Ag Verfahren zum herstellen von integrierten mos-schaltungen in silizium-gate- technologie

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3256588A (en) * 1962-10-23 1966-06-21 Philco Corp Method of fabricating thin film r-c circuits on single substrate
US3569796A (en) * 1968-05-10 1971-03-09 Solitron Devices Integrated circuit contact
US3559003A (en) * 1969-01-03 1971-01-26 Ibm Universal metallurgy for semiconductor materials
US3609294A (en) * 1969-10-10 1971-09-28 Ncr Co Thermal printing head with thin film printing elements

Also Published As

Publication number Publication date
FR2140309B1 (enExample) 1975-01-17
US3826956A (en) 1974-07-30
DE2228293A1 (de) 1972-12-28
FR2140309A1 (enExample) 1973-01-19

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee