GB1363386A - Electron beam fabrication methods - Google Patents

Electron beam fabrication methods

Info

Publication number
GB1363386A
GB1363386A GB2956272A GB2956272A GB1363386A GB 1363386 A GB1363386 A GB 1363386A GB 2956272 A GB2956272 A GB 2956272A GB 2956272 A GB2956272 A GB 2956272A GB 1363386 A GB1363386 A GB 1363386A
Authority
GB
United Kingdom
Prior art keywords
resist
substrate
electron
silicon
nitride
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2956272A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of GB1363386A publication Critical patent/GB1363386A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/146—By vapour deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
GB2956272A 1971-06-30 1972-06-23 Electron beam fabrication methods Expired GB1363386A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US15846371A 1971-06-30 1971-06-30

Publications (1)

Publication Number Publication Date
GB1363386A true GB1363386A (en) 1974-08-14

Family

ID=22568245

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2956272A Expired GB1363386A (en) 1971-06-30 1972-06-23 Electron beam fabrication methods

Country Status (4)

Country Link
JP (1) JPS5432315B1 (de)
DE (1) DE2227342C2 (de)
FR (1) FR2143713B1 (de)
GB (1) GB1363386A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2733147A1 (de) * 1977-07-22 1979-01-25 Licentia Gmbh Verfahren zum beseitigen stoerender streueffekte bei der elektronenstrahlbelichtung

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2922642C2 (de) * 1979-06-02 1981-10-01 Kernforschungszentrum Karlsruhe Gmbh, 7500 Karlsruhe Verfahren zum Herstellen von Platten für den Aufbau von Trenndüsenelementen
DE3176140D1 (en) * 1981-10-30 1987-05-27 Ibm Deutschland Contact device for the detachable connection of electrical components

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1534173A (fr) * 1966-08-10 1968-07-26 Gen Precision Inc Procédé pour former des réserves photographiques sur des supports transparents outranslucides avec une résolution élevée

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2733147A1 (de) * 1977-07-22 1979-01-25 Licentia Gmbh Verfahren zum beseitigen stoerender streueffekte bei der elektronenstrahlbelichtung

Also Published As

Publication number Publication date
FR2143713B1 (de) 1976-01-16
JPS5432315B1 (de) 1979-10-13
DE2227342A1 (de) 1973-01-18
DE2227342C2 (de) 1982-10-28
FR2143713A1 (de) 1973-02-09

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee