GB1330600A - Method for forming copper-containing aluminium conductors - Google Patents

Method for forming copper-containing aluminium conductors

Info

Publication number
GB1330600A
GB1330600A GB3100772A GB3100772A GB1330600A GB 1330600 A GB1330600 A GB 1330600A GB 3100772 A GB3100772 A GB 3100772A GB 3100772 A GB3100772 A GB 3100772A GB 1330600 A GB1330600 A GB 1330600A
Authority
GB
United Kingdom
Prior art keywords
containing aluminium
substrate
forming copper
aluminium conductors
coated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3100772A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of GB1330600A publication Critical patent/GB1330600A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Physical Vapour Deposition (AREA)
GB3100772A 1971-08-24 1972-07-03 Method for forming copper-containing aluminium conductors Expired GB1330600A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US17450971A 1971-08-24 1971-08-24

Publications (1)

Publication Number Publication Date
GB1330600A true GB1330600A (en) 1973-09-19

Family

ID=22636426

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3100772A Expired GB1330600A (en) 1971-08-24 1972-07-03 Method for forming copper-containing aluminium conductors

Country Status (4)

Country Link
JP (1) JPS4830887A (enExample)
DE (1) DE2233427A1 (enExample)
FR (1) FR2150337B1 (enExample)
GB (1) GB1330600A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4395437A (en) 1979-04-02 1983-07-26 U.S. Philips Corporation Method of forming a secondary emissive coating on a dynode
GB2139248A (en) * 1983-05-04 1984-11-07 Gen Electric Co Plc Copper alloy solderable contact pad produced by vapour deposition
CN104353966A (zh) * 2011-08-26 2015-02-18 孙华桥 一种塑性和韧性较好的铜包铝排的生产方法
CN104384857A (zh) * 2011-08-26 2015-03-04 孙华桥 一种电阻率较低的铜包铝排的生产方法
CN104439923A (zh) * 2011-08-26 2015-03-25 孙华桥 一种电阻率较低且塑性和韧性较好的铜包铝排的生产方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4395437A (en) 1979-04-02 1983-07-26 U.S. Philips Corporation Method of forming a secondary emissive coating on a dynode
GB2139248A (en) * 1983-05-04 1984-11-07 Gen Electric Co Plc Copper alloy solderable contact pad produced by vapour deposition
CN104353966A (zh) * 2011-08-26 2015-02-18 孙华桥 一种塑性和韧性较好的铜包铝排的生产方法
CN104384857A (zh) * 2011-08-26 2015-03-04 孙华桥 一种电阻率较低的铜包铝排的生产方法
CN104439923A (zh) * 2011-08-26 2015-03-25 孙华桥 一种电阻率较低且塑性和韧性较好的铜包铝排的生产方法

Also Published As

Publication number Publication date
DE2233427A1 (de) 1973-03-08
FR2150337B1 (enExample) 1974-12-27
JPS4830887A (enExample) 1973-04-23
FR2150337A1 (enExample) 1973-04-06

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Legal Events

Date Code Title Description
CSNS Application of which complete specification have been accepted and published, but patent is not sealed