GB1326669A - Self-curing epoxy resins - Google Patents
Self-curing epoxy resinsInfo
- Publication number
- GB1326669A GB1326669A GB4082371A GB4082371A GB1326669A GB 1326669 A GB1326669 A GB 1326669A GB 4082371 A GB4082371 A GB 4082371A GB 4082371 A GB4082371 A GB 4082371A GB 1326669 A GB1326669 A GB 1326669A
- Authority
- GB
- United Kingdom
- Prior art keywords
- groups
- epoxy
- diisocyanate
- epoxy resins
- dihydric phenol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003822 epoxy resin Substances 0.000 title abstract 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 title abstract 4
- 229920000647 polyepoxide Polymers 0.000 title abstract 4
- 125000005442 diisocyanate group Chemical group 0.000 abstract 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract 3
- 125000003700 epoxy group Chemical group 0.000 abstract 3
- 125000005842 heteroatom Chemical group 0.000 abstract 3
- JOYRKODLDBILNP-UHFFFAOYSA-N urethane group Chemical group NC(=O)OCC JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 abstract 3
- 239000004215 Carbon black (E152) Substances 0.000 abstract 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract 2
- 150000002148 esters Chemical class 0.000 abstract 2
- 229930195733 hydrocarbon Natural products 0.000 abstract 2
- 239000012948 isocyanate Substances 0.000 abstract 2
- 150000002513 isocyanates Chemical class 0.000 abstract 2
- JSPLKZUTYZBBKA-UHFFFAOYSA-N trioxidane Chemical compound OOO JSPLKZUTYZBBKA-UHFFFAOYSA-N 0.000 abstract 2
- GJOWSEBTWQNKPC-UHFFFAOYSA-N 3-methyloxiran-2-ol Chemical compound CC1OC1O GJOWSEBTWQNKPC-UHFFFAOYSA-N 0.000 abstract 1
- 240000004064 Poterium sanguisorba Species 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 125000001931 aliphatic group Chemical group 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 238000005470 impregnation Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 abstract 1
- 238000000465 moulding Methods 0.000 abstract 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/28—Di-epoxy compounds containing acyclic nitrogen atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/2805—Compounds having only one group containing active hydrogen
- C08G18/2815—Monohydroxy compounds
- C08G18/2845—Monohydroxy epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/32—Polyhydroxy compounds; Polyamines; Hydroxyamines
- C08G18/3203—Polyhydroxy compounds
- C08G18/3215—Polyhydroxy compounds containing aromatic groups or benzoquinone groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Polyurethanes Or Polyureas (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19702043645 DE2043645A1 (de) | 1970-09-03 | 1970-09-03 | Selbsthaltende Epoxidharze |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1326669A true GB1326669A (en) | 1973-08-15 |
Family
ID=5781449
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB4082371A Expired GB1326669A (en) | 1970-09-03 | 1971-09-01 | Self-curing epoxy resins |
Country Status (6)
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4370461A (en) | 1981-07-27 | 1983-01-25 | The Dow Chemical Company | Organo phosphorus-containing compounds as catalysts for deblocking blocked isocyanates |
| US5168110A (en) * | 1990-02-16 | 1992-12-01 | DSM N.V. of Het Overloon | Powder coating based on a carboxyl-functional polyester and an epoxy-functional cross-linking agent |
| EP1498441A1 (de) * | 2003-07-16 | 2005-01-19 | Sika Technology AG | Hitzehärtende Zusammensetzungen mit Tieftemperatur-Schlagzähigkeitsmodifikatoren |
| WO2009094295A1 (en) * | 2008-01-22 | 2009-07-30 | Dow Global Technologies Inc. | Structural epoxy resin adhesives containing epoxide-functional, polyphenol-extended elastomeric tougheners |
| US7786214B2 (en) | 2002-05-03 | 2010-08-31 | Sika Technology Ag | Composition of epoxy resin, epoxy adduct, urea derivative thixotropic agent and curing agent |
| US8062468B2 (en) | 2005-07-05 | 2011-11-22 | Sika Technology Ag | Low-temperature impact resistant thermosetting epoxide resin compositions with solid epoxide resins |
| US9221969B2 (en) | 2002-12-17 | 2015-12-29 | Sika Technology Ag | Thermally hardenable epoxy resin composition having an improved impact resistance at low temperatures |
| CN112759741A (zh) * | 2020-12-18 | 2021-05-07 | 上海瀚岱化学有限公司 | 一种高稳定性水性环氧树脂及其制备方法 |
| CN114644746A (zh) * | 2022-04-21 | 2022-06-21 | 韶关东森合成材料有限公司 | 一种聚氨酯改性环氧树脂及其制备方法与应用 |
| US11453743B2 (en) * | 2020-06-05 | 2022-09-27 | Chanda Chemical Corp. | Thermoset epoxy resin, its preparing composition and making process thereof |
-
1971
- 1971-09-01 GB GB4082371A patent/GB1326669A/en not_active Expired
- 1971-09-01 AU AU32960/71A patent/AU3296071A/en not_active Expired
- 1971-09-02 ES ES394747A patent/ES394747A1/es not_active Expired
- 1971-09-02 BE BE772081A patent/BE772081A/xx unknown
- 1971-09-02 FR FR7131773A patent/FR2108217B1/fr not_active Expired
- 1971-09-03 ZA ZA715924A patent/ZA715924B/xx unknown
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4370461A (en) | 1981-07-27 | 1983-01-25 | The Dow Chemical Company | Organo phosphorus-containing compounds as catalysts for deblocking blocked isocyanates |
| US5168110A (en) * | 1990-02-16 | 1992-12-01 | DSM N.V. of Het Overloon | Powder coating based on a carboxyl-functional polyester and an epoxy-functional cross-linking agent |
| US7786214B2 (en) | 2002-05-03 | 2010-08-31 | Sika Technology Ag | Composition of epoxy resin, epoxy adduct, urea derivative thixotropic agent and curing agent |
| US9221969B2 (en) | 2002-12-17 | 2015-12-29 | Sika Technology Ag | Thermally hardenable epoxy resin composition having an improved impact resistance at low temperatures |
| US8076424B2 (en) | 2003-07-16 | 2011-12-13 | Sika Technology Ag | Heat-curable compositions comprising low-temperature impact strength modifiers |
| EP1498441A1 (de) * | 2003-07-16 | 2005-01-19 | Sika Technology AG | Hitzehärtende Zusammensetzungen mit Tieftemperatur-Schlagzähigkeitsmodifikatoren |
| WO2005007720A1 (de) * | 2003-07-16 | 2005-01-27 | Sika Technology Ag | Hitzehärtende zusammensetzungen mit tieftemperatur-schlagzähigkeitsmodifikatoren |
| US8062468B2 (en) | 2005-07-05 | 2011-11-22 | Sika Technology Ag | Low-temperature impact resistant thermosetting epoxide resin compositions with solid epoxide resins |
| WO2009094295A1 (en) * | 2008-01-22 | 2009-07-30 | Dow Global Technologies Inc. | Structural epoxy resin adhesives containing epoxide-functional, polyphenol-extended elastomeric tougheners |
| US11453743B2 (en) * | 2020-06-05 | 2022-09-27 | Chanda Chemical Corp. | Thermoset epoxy resin, its preparing composition and making process thereof |
| JP2024153927A (ja) * | 2020-06-05 | 2024-10-29 | 詮達化学股▲フン▼有限公司 | エポキシ樹脂、その原料組成物及び製造方法 |
| CN112759741A (zh) * | 2020-12-18 | 2021-05-07 | 上海瀚岱化学有限公司 | 一种高稳定性水性环氧树脂及其制备方法 |
| CN114644746A (zh) * | 2022-04-21 | 2022-06-21 | 韶关东森合成材料有限公司 | 一种聚氨酯改性环氧树脂及其制备方法与应用 |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2108217A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1972-05-19 |
| ES394747A1 (es) | 1974-03-01 |
| FR2108217B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1974-09-06 |
| AU3296071A (en) | 1973-03-08 |
| ZA715924B (en) | 1972-06-28 |
| BE772081A (fr) | 1972-03-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| CSNS | Application of which complete specification have been accepted and published, but patent is not sealed |