GB1319882A - Polishing thin elements - Google Patents

Polishing thin elements

Info

Publication number
GB1319882A
GB1319882A GB4880571A GB4880571A GB1319882A GB 1319882 A GB1319882 A GB 1319882A GB 4880571 A GB4880571 A GB 4880571A GB 4880571 A GB4880571 A GB 4880571A GB 1319882 A GB1319882 A GB 1319882A
Authority
GB
United Kingdom
Prior art keywords
wafer
polishing
pad
friction
polishing surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4880571A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Monsanto Co
Original Assignee
Monsanto Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Monsanto Co filed Critical Monsanto Co
Publication of GB1319882A publication Critical patent/GB1319882A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
GB4880571A 1970-10-21 1971-10-20 Polishing thin elements Expired GB1319882A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US8267370A 1970-10-21 1970-10-21

Publications (1)

Publication Number Publication Date
GB1319882A true GB1319882A (en) 1973-06-13

Family

ID=22172673

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4880571A Expired GB1319882A (en) 1970-10-21 1971-10-20 Polishing thin elements

Country Status (5)

Country Link
JP (1) JPS545160B1 (de)
BE (1) BE774209A (de)
DE (1) DE2152318A1 (de)
GB (1) GB1319882A (de)
NL (1) NL7114274A (de)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2241607A (en) * 1990-03-01 1991-09-04 Intel Corp Method of planarizing a dielectric formed over a semiconductor substrate
GB2287422A (en) * 1994-03-16 1995-09-20 Nec Corp Conditioning by abrading of polishing cloth for semiconductor devices
GB2299895A (en) * 1992-05-26 1996-10-16 Toshiba Kk Semiconductor wafer polishing
US6358114B1 (en) 1995-06-16 2002-03-19 Optical Generics Limited Method and apparatus for optical polishing

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5531582A (en) * 1978-08-15 1980-03-05 Ibm Free polishing device
JPS57149373U (de) * 1981-03-16 1982-09-20
JPS5871593U (ja) * 1981-11-04 1983-05-14 三菱重工業株式会社 水冷型熱交換器
US4811522A (en) * 1987-03-23 1989-03-14 Gill Jr Gerald L Counterbalanced polishing apparatus

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2241607A (en) * 1990-03-01 1991-09-04 Intel Corp Method of planarizing a dielectric formed over a semiconductor substrate
US5104828A (en) * 1990-03-01 1992-04-14 Intel Corporation Method of planarizing a dielectric formed over a semiconductor substrate
GB2241607B (en) * 1990-03-01 1994-01-12 Intel Corp Method of planarizing a dielectric formed over a semiconductor substrate
GB2299895A (en) * 1992-05-26 1996-10-16 Toshiba Kk Semiconductor wafer polishing
GB2299895B (en) * 1992-05-26 1997-01-08 Toshiba Kk polishing apparatus for planarizing layer on a semiconductor wafer
GB2287422A (en) * 1994-03-16 1995-09-20 Nec Corp Conditioning by abrading of polishing cloth for semiconductor devices
US5626509A (en) * 1994-03-16 1997-05-06 Nec Corporation Surface treatment of polishing cloth
GB2287422B (en) * 1994-03-16 1997-08-27 Nec Corp Surface treatment of polishing cloth
US6358114B1 (en) 1995-06-16 2002-03-19 Optical Generics Limited Method and apparatus for optical polishing

Also Published As

Publication number Publication date
BE774209A (fr) 1972-04-20
JPS545160B1 (de) 1979-03-14
NL7114274A (de) 1972-04-25
DE2152318A1 (de) 1972-04-27

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee