GB1311019A - Copper-clad laminate and production thereof - Google Patents

Copper-clad laminate and production thereof

Info

Publication number
GB1311019A
GB1311019A GB6141170A GB6141170A GB1311019A GB 1311019 A GB1311019 A GB 1311019A GB 6141170 A GB6141170 A GB 6141170A GB 6141170 A GB6141170 A GB 6141170A GB 1311019 A GB1311019 A GB 1311019A
Authority
GB
United Kingdom
Prior art keywords
impregnated
allyl
copper foil
copper
thermosetting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB6141170A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Publication of GB1311019A publication Critical patent/GB1311019A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0036—Heat treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Laminated Bodies (AREA)

Abstract

1311019 Laminates MATSUSHITA ELECTRIC WORKS Ltd 29 Dec 1970 [28 Dec 1969(4)] 61411/70 Heading B5N Copper clad laminates are made by superposing a base material (e.g. glass cloth or mat, asbestos sheet, synthetic fibre fabrics or mats, paper or cotton cloth) impregnated with a thermosetting resin which is a prepolymer of an unsaturated polyester and/or a prepolymer of a polydiallylphthalate, a copper foil on at least one surface thereof and between the base material and the copper foil a thermosetting adhesive comprising a curable epoxy resin and a curing agent selected from (a) compounds having at least one amino or imino radical and at least one allyl or vinyl radical or (b) aromatic polycarboxylic acids partially esterified with an unsaturated compound having at least one allyl, substituted allyl, vinyl or substituted vinyl radical; and then heating the laminated assembly under pressure to form a unitary copper clad structure. The adhesive may be applied as a varnish to the copper foil or it may be impregnated into a fibrous sheet material which is then dried and placed between the foil at the impregnated base. The curing agent is preferably used in amounts of 5 to 40 parts by weight of the epoxy resin. The thermosetting resin used to impregnate the base suitably comprises prepolymers having a melting point greater than 40‹ C., cross-linking agents of melting point greater than 40‹ C. and initiators. Several examples of suitable thermosetting resins and curing agents are specified.
GB6141170A 1969-12-28 1970-12-29 Copper-clad laminate and production thereof Expired GB1311019A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP95469 1969-12-28
JP95269 1969-12-28
JP95369 1969-12-28
JP95569 1969-12-28

Publications (1)

Publication Number Publication Date
GB1311019A true GB1311019A (en) 1973-03-21

Family

ID=27453285

Family Applications (1)

Application Number Title Priority Date Filing Date
GB6141170A Expired GB1311019A (en) 1969-12-28 1970-12-29 Copper-clad laminate and production thereof

Country Status (1)

Country Link
GB (1) GB1311019A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0056713A2 (en) * 1981-01-21 1982-07-28 Scott Bader Company Limited Composites and methods for providing metal clad articles
EP0803499A1 (en) * 1996-04-26 1997-10-29 Tatsuta Electric Wire & Cable Co., Ltd. 1, 2 - N - acyl - N - methylene - ethylenediamine, and electroconductive paste comprising it

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0056713A2 (en) * 1981-01-21 1982-07-28 Scott Bader Company Limited Composites and methods for providing metal clad articles
EP0056713A3 (en) * 1981-01-21 1982-10-20 Scott Bader Company Limited Composites and methods for providing metal clad articles and articles produced thereby
EP0803499A1 (en) * 1996-04-26 1997-10-29 Tatsuta Electric Wire & Cable Co., Ltd. 1, 2 - N - acyl - N - methylene - ethylenediamine, and electroconductive paste comprising it
US5779941A (en) * 1996-04-26 1998-07-14 Tatsuta Electric Wire And Cable Co., Ltd. 1,2-N-acyl-N-methylene-ethylenediamine, and electroconductive paste comprising it

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee