FR2030257A1 - Binder resins for crp backed copper foil - laminates for printed circuit boards - Google Patents

Binder resins for crp backed copper foil - laminates for printed circuit boards

Info

Publication number
FR2030257A1
FR2030257A1 FR7003362A FR7003362A FR2030257A1 FR 2030257 A1 FR2030257 A1 FR 2030257A1 FR 7003362 A FR7003362 A FR 7003362A FR 7003362 A FR7003362 A FR 7003362A FR 2030257 A1 FR2030257 A1 FR 2030257A1
Authority
FR
France
Prior art keywords
printed circuit
circuit boards
copper foil
laminates
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7003362A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Milacron Inc
Original Assignee
Milacron Inc
Cincinnati Milling Machine Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Milacron Inc, Cincinnati Milling Machine Co filed Critical Milacron Inc
Publication of FR2030257A1 publication Critical patent/FR2030257A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
    • B29C70/28—Shaping operations therefor
    • B29C70/30—Shaping by lay-up, i.e. applying fibres, tape or broadsheet on a mould, former or core; Shaping by spray-up, i.e. spraying of fibres on a mould, former or core
    • B29C70/38—Automated lay-up, e.g. using robots, laying filaments according to predetermined patterns
    • B29C70/382—Automated fiber placement [AFP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0293—Non-woven fibrous reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)

Abstract

Mould lamination of copper foil with a mat or resin bonded continuous glass fibres impregnated with a polymerisable composition where the glass is bound by an unsaturated polyester resin and the impregnation resin is a mixture of methylmethacrylate (pref. polymer dissolved in more monomer) and an unsaturated polyester pref. also containing an epoxide resin. The foil and fibre layers are bonded to form laminates for making printed circuit boards (by selective etchings) featuring a high surface polish and flex resistance.
FR7003362A 1969-02-03 1970-01-30 Binder resins for crp backed copper foil - laminates for printed circuit boards Withdrawn FR2030257A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US79586569A 1969-02-03 1969-02-03

Publications (1)

Publication Number Publication Date
FR2030257A1 true FR2030257A1 (en) 1970-11-13

Family

ID=25166646

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7003362A Withdrawn FR2030257A1 (en) 1969-02-03 1970-01-30 Binder resins for crp backed copper foil - laminates for printed circuit boards

Country Status (6)

Country Link
BE (1) BE745204A (en)
BR (1) BR7016450D0 (en)
DE (1) DE2003982A1 (en)
ES (1) ES376142A1 (en)
FR (1) FR2030257A1 (en)
NL (1) NL7001492A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2543780B1 (en) * 1983-03-31 1990-02-23 Rogers Corp FLEXIBLE ELECTRIC CIRCUIT RETAINING ITS SHAPE AND MANUFACTURING METHOD THEREOF
US4828961A (en) * 1986-07-02 1989-05-09 W. R. Grace & Co.-Conn. Imaging process for forming ceramic electronic circuits
BE1004560A3 (en) * 1990-08-20 1992-12-15 Wallone Region Basic thermoplastic products for the production of continuous fibrereinforced thermoplastic plates, sheets or tubes

Also Published As

Publication number Publication date
DE2003982A1 (en) 1970-08-06
NL7001492A (en) 1970-08-05
ES376142A1 (en) 1972-03-16
BR7016450D0 (en) 1973-02-20
BE745204A (en) 1970-07-30

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Legal Events

Date Code Title Description
ST Notification of lapse