JPS644628A - Copper-clad epoxy resin laminate - Google Patents
Copper-clad epoxy resin laminateInfo
- Publication number
- JPS644628A JPS644628A JP15751587A JP15751587A JPS644628A JP S644628 A JPS644628 A JP S644628A JP 15751587 A JP15751587 A JP 15751587A JP 15751587 A JP15751587 A JP 15751587A JP S644628 A JPS644628 A JP S644628A
- Authority
- JP
- Japan
- Prior art keywords
- obtd
- epoxy resin
- component
- paper
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
PURPOSE:To obtain the title laminate which is excellent in punchability, moisture resistance and heat (soldering) resistance, by consolidating a plurality of prepreg sheets obtd. by impregnating paper or cloth substrates with a resin composition consisting of an epoxy resin, a specified curing agent and a cure accelerator together with copper foil which is placed at least on one side of said sheet into a laminate molding. CONSTITUTION:A resin composition B is obtd. by blending an epoxy resin having at least two epoxy groups in a molecule (a) with a dicyclopentadiene- phenol resin of the formula as shown (where n is 0-10) as a curing agent (b) in an equivalent ratio of the OH groups of the component (b) to the epoxy groups of the component (a) of 0.3-1.1 and adding thereto a cure accelerator such as imidazoles (c). A plurality of prepreg sheets, obtd. by impregnating paper or cloth substrates A such as (non-)woven glass fabric, (cotton) linter paper or kraft paper with the component B and drying the, are laminated together with copper foil which is placed at least on one side of said sheet, and the layers are consolidated into a laminate molding under application of heat and pressure.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15751587A JPS644628A (en) | 1987-06-26 | 1987-06-26 | Copper-clad epoxy resin laminate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15751587A JPS644628A (en) | 1987-06-26 | 1987-06-26 | Copper-clad epoxy resin laminate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS644628A true JPS644628A (en) | 1989-01-09 |
Family
ID=15651363
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15751587A Pending JPS644628A (en) | 1987-06-26 | 1987-06-26 | Copper-clad epoxy resin laminate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS644628A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4110219A1 (en) * | 1991-03-28 | 1992-10-01 | Huels Troisdorf | METHOD FOR PRODUCING PREPREGS WITH SOLVENT-FREE EPOXY RESIN |
JPH05156130A (en) * | 1991-12-04 | 1993-06-22 | Shin Kobe Electric Mach Co Ltd | Resin composition for laminate and laminate |
JPH06100660A (en) * | 1992-09-22 | 1994-04-12 | Sumitomo Chem Co Ltd | Epoxy resin composition and copper-clad laminate |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6253342A (en) * | 1985-09-03 | 1987-03-09 | Mitsubishi Gas Chem Co Inc | Production of epoxy resin laminate sheet |
JPS62135539A (en) * | 1985-12-09 | 1987-06-18 | Sanyo Kokusaku Pulp Co Ltd | Epoxy resin laminate |
-
1987
- 1987-06-26 JP JP15751587A patent/JPS644628A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6253342A (en) * | 1985-09-03 | 1987-03-09 | Mitsubishi Gas Chem Co Inc | Production of epoxy resin laminate sheet |
JPS62135539A (en) * | 1985-12-09 | 1987-06-18 | Sanyo Kokusaku Pulp Co Ltd | Epoxy resin laminate |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4110219A1 (en) * | 1991-03-28 | 1992-10-01 | Huels Troisdorf | METHOD FOR PRODUCING PREPREGS WITH SOLVENT-FREE EPOXY RESIN |
JPH05156130A (en) * | 1991-12-04 | 1993-06-22 | Shin Kobe Electric Mach Co Ltd | Resin composition for laminate and laminate |
JPH06100660A (en) * | 1992-09-22 | 1994-04-12 | Sumitomo Chem Co Ltd | Epoxy resin composition and copper-clad laminate |
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