GB1306189A - - Google Patents
Info
- Publication number
- GB1306189A GB1306189A GB2323571A GB2323571A GB1306189A GB 1306189 A GB1306189 A GB 1306189A GB 2323571 A GB2323571 A GB 2323571A GB 2323571 A GB2323571 A GB 2323571A GB 1306189 A GB1306189 A GB 1306189A
- Authority
- GB
- United Kingdom
- Prior art keywords
- metallization
- cells
- points
- faulty
- interconnections
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000001465 metallisation Methods 0.000 abstract 4
- 239000000758 substrate Substances 0.000 abstract 2
- 235000012431 wafers Nutrition 0.000 abstract 2
- 238000009413 insulation Methods 0.000 abstract 1
- 238000003698 laser cutting Methods 0.000 abstract 1
- 238000010329 laser etching Methods 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US76245968A | 1968-09-25 | 1968-09-25 | |
| US1686970A | 1970-03-05 | 1970-03-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1306189A true GB1306189A (enrdf_load_stackoverflow) | 1973-02-07 |
Family
ID=34315864
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB2323571A Expired GB1306189A (enrdf_load_stackoverflow) | 1968-09-25 | 1971-04-19 |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB1306189A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2418906A1 (de) * | 1973-04-30 | 1974-12-12 | Hughes Aircraft Co | Verfahren zur verbindung der in einer halbleiterscheibe erzeugten schaltungskreise |
| EP0023294A3 (en) * | 1979-07-30 | 1983-08-31 | International Business Machines Corporation | Method for repairing integrated circuits |
| GB2153590A (en) * | 1984-02-01 | 1985-08-21 | Ramesh Chandra Varshney | Matrix of functional circuits on a semiconductor wafer |
-
1971
- 1971-04-19 GB GB2323571A patent/GB1306189A/en not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2418906A1 (de) * | 1973-04-30 | 1974-12-12 | Hughes Aircraft Co | Verfahren zur verbindung der in einer halbleiterscheibe erzeugten schaltungskreise |
| EP0023294A3 (en) * | 1979-07-30 | 1983-08-31 | International Business Machines Corporation | Method for repairing integrated circuits |
| GB2153590A (en) * | 1984-02-01 | 1985-08-21 | Ramesh Chandra Varshney | Matrix of functional circuits on a semiconductor wafer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed | ||
| PE20 | Patent expired after termination of 20 years |